型号
- 型号
- 关键词
| 型号 | HD74LV1G32ACME | HD74LV1G32A | HD74LV1G32AVSE | HD74LV1G32A_08 |
|---|---|---|---|---|
| 描述 | 2.input OR Gate | 2.input OR Gate | 2.input OR Gate | 2.input OR Gate |
| 厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | - |
| 零件包装代码 | SOIC | SOIC | SON | - |
| 包装说明 | SC-88A, CMPAK-5 | TSSOP, | VSOF, FL5/6,.047,20 | - |
| 针数 | 5 | 5 | 5 | - |
| Reach Compliance Code | compliant | compli | compli | - |
| 系列 | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | - |
| JESD-30 代码 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-F5 | - |
| JESD-609代码 | e0 | e6 | e0 | - |
| 长度 | 2 mm | 2 mm | 1.6 mm | - |
| 逻辑集成电路类型 | OR GATE | OR GATE | OR GATE | - |
| 功能数量 | 1 | 1 | 1 | - |
| 输入次数 | 2 | 2 | 2 | - |
| 端子数量 | 5 | 5 | 5 | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | TSSOP | TSSOP | VSOF | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | - |
| 传播延迟（tpd） | 34 ns | 34 ns | 34 ns | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 1.1 mm | 1.1 mm | 0.6 mm | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | - |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | - |
| 表面贴装 | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子形式 | GULL WING | GULL WING | FLAT | - |
| 端子节距 | 0.65 mm | 0.65 mm | 0.5 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | - |
| 宽度 | 1.25 mm | 1.25 mm | 1.2 mm | - |
| Base Number Matches | 1 | 1 | 1 | - |
