型号
- 型号
- 关键词
| 型号 | HD74LV1G32A_08 | HD74LV1G32A | HD74LV1G32ACME | HD74LV1G32AVSE |
|---|---|---|---|---|
| 描述 | 2.input OR Gate | 2.input OR Gate | 2.input OR Gate | 2.input OR Gate |
| 厂商名称 | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 零件包装代码 | - | SOIC | SOIC | SON |
| 包装说明 | - | TSSOP, | SC-88A, CMPAK-5 | VSOF, FL5/6,.047,20 |
| 针数 | - | 5 | 5 | 5 |
| Reach Compliance Code | - | compli | compliant | compli |
| 系列 | - | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H |
| JESD-30 代码 | - | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-F5 |
| JESD-609代码 | - | e6 | e0 | e0 |
| 长度 | - | 2 mm | 2 mm | 1.6 mm |
| 逻辑集成电路类型 | - | OR GATE | OR GATE | OR GATE |
| 功能数量 | - | 1 | 1 | 1 |
| 输入次数 | - | 2 | 2 | 2 |
| 端子数量 | - | 5 | 5 | 5 |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | TSSOP | TSSOP | VSOF |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE |
| 传播延迟（tpd） | - | 34 ns | 34 ns | 34 ns |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1.1 mm | 1.1 mm | 0.6 mm |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | - | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | - | YES | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | - | GULL WING | GULL WING | FLAT |
| 端子节距 | - | 0.65 mm | 0.65 mm | 0.5 mm |
| 端子位置 | - | DUAL | DUAL | DUAL |
| 宽度 | - | 1.25 mm | 1.25 mm | 1.2 mm |
| Base Number Matches | - | 1 | 1 | 1 |