High Efficiency Delay Lines
HE*L5*T***U & S Series
1.0 Description
These delay lines come in solder ball configuration that takes up less board space than the GL series. As
with all of TFT’s delay lines, these feature microstrip transmission lines on ceramic for high speed, high sta-
bility performance.
2.0 Mechanical
-
Please refer to page 43 for land pattern
1
2 3 4
5 6 7
8
1.1 Max
Ball Dia = 28 mil
6.35
±0.20
A size
1
a
b
c
2
3
4
5
1.1 Max
Ball Dia = 28 mil
3.81
±0.20
B size
a
b
c
0.00
6.35 ±0.20
1
a
b
c
un coupled
2
3
4
5
a
b
c
single
1
2
3
4
0.075
5
1
a
2 3 4
10.16
±0.20
5 6 7
8
a
1
2 3 4
0.075
5 6 7
8
b
b
dimension mm
c
single
c
un coupled
3.0 Electrical
Application Type
S (Single-ended)
U (Uncoupled - Pair)
Size Designator
A
B
A
B
Delay Range
0.1 to 1.2 ns 0.1 & 0.5 to 3.5 ns 0.1 to 0.6 ns 0.1 to 1.6 ns
Standard Delay Increment
0.1 ns
0.5 ns
0.1 ns
0.1 ns
Delay Tolerance (provisional)
± (15 ps + 2% of nominal)
± (15 ps + 2% of nominal)
Delay Difference Tolerance (provisional)
NA
< (10 ps + 0.5%)
Individual Impedance
50 ohm ± 10%
50 ohm ± 10%
Differential Impedance
NA
100 ohm ± 10%
DC Resistance
The greater of 1 ohm or < 2 ohm/ns
Rated Current
100 mA
Temperature Coeff. of Time Delay
< 150 ppm/C
Insulation Resistance
> 100 Mohm (100 Vdc)
Isolation Resistance
> 100 Mohm (100 Vdc)
Operating Temperature
-40°C to +85°C
Storage Temperature
-55°C to +125°C
4.0 Part Number
HE
*
L
5
*
T
***
*
T
Product family
Number of signal lines
Product type
Impedance (5 = 50 ohm)
Size designator
Termination type
Delay ‘ns’ x 100 (0.5 ns = 050)
Application Type
Tape & Reel Designator
5
Tape & Reel Quantity (5 = 500 pcs per reel)
R
R
EG
I
S
TERE
EG
I
S
TERE
D
ISO9001 ISO14001
A4
303
Manufacturer(s) of the products described on this page are indicated by their respective logos.
D
A8
561
5
微控制器 MCU