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HE2LAAA030D-T5

Active Delay Line, 1-Func, PBGA6, BGA-6

器件类别:逻辑    逻辑   

厂商名称:Thin Film Technology Corp (TFT)

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
零件包装代码
BGA
包装说明
BGA,
针数
6
Reach Compliance Code
compliant
系列
HE2LA
JESD-30 代码
R-PBGA-B6
JESD-609代码
e0
长度
6.35 mm
逻辑集成电路类型
ACTIVE DELAY LINE
功能数量
1
端子数量
6
最高工作温度
85 °C
最低工作温度
-40 °C
输出阻抗标称值(Z0)
100 Ω
封装主体材料
PLASTIC/EPOXY
封装代码
BGA
封装形状
RECTANGULAR
封装形式
GRID ARRAY
峰值回流温度(摄氏度)
NOT SPECIFIED
可编程延迟线
NO
认证状态
Not Qualified
座面最大高度
1.0922 mm
表面贴装
YES
温度等级
INDUSTRIAL
端子面层
TIN LEAD
端子形式
BALL
端子节距
2.54 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
NOT SPECIFIED
总延迟标称(td)
0.3 ns
宽度
3.81 mm
Base Number Matches
1
文档预览
HE2LA*****D Series (Published)
Page 1 of 4
BGA (HE) Delay Lines (Patent Pending)
HE2LA(A,B)A***D
Series
Description
High-efficiency delay lines for clock and data deskew in differential circuit
designs requiring precise timing control in a small, low profile BGA
package. The differential delay lines are constructed as broadside-coupled
transmission lines on ceramic. These designs feature characteristics similar
to unshielded twisted-pair cable.
This product is currently available with solder finshes of Sn63/Pb37, as well
as a RoHS compliant, Pb free solder finish of Sn95.5/Ag3.8/Cu0.7. For the
RoHS compliant part, the customer must specify this upon ordering by
following the instructions in the part numbering section of this specification.
Electrical
Size A
Size Designator:
Delay Range:
Standard Delay Increment:
Delay Tolerance:
Differential Impedance:
DC Resistance:
Rated Current:
Temp. Coef. of Time
Delay:
Insulation Resistance:
Isolation Resistance:
Operating Temperature:
Storage Temperature:
A
B
0.1 to 0.5 ns
0.1 to 1.6 ns
0.1 ns
0.1 ns
± (15 ps + 2% of nominal)
100
± 10%
0.1 - 0.5 ns < 1.15
over 0.5 ns < 2.30
Ω/ns
100 mA
< 150 ppm/C
> 100MΩ (100 Vdc)
> 100 MΩ (100 Vdc)
-40 to +85°C
-55 to +125C°
Size B
- Not Actual Size -
Electrical Performance Characteristics:
Part Number
HE2LAAA010D
HE2LAAA020D
HE2LAAA030D
HE2LAAA040D
HE2LAAA050D
HE2LAAT060D
HE2LABA010D
HE2LABA020D
HE2LABA030D
HE2LABA040D
HE2LABA050D
HE2LABA060D
HE2LABA070D
HE2LABA080D
HE2LABA090D
HE2LABA100D
HE2LABA110D
Nominal
Time Delay Tolerance
Time Delay
0.10 ns ± 15 ps +2% of Nominal
0.20 ns ± 15 ps +2% of Nominal
0.30 ns ± 15 ps +2% of Nominal
0.40 ns ± 15 ps +2% of Nominal
0.50 ns ± 15 ps +2% of Nominal
0.60 ns ± 15 ps +2% of Nominal
0.10 ns ± 15 ps +2% of Nominal
0.20 ns ± 15 ps +2% of Nominal
0.30 ns ± 15 ps +2% of Nominal
0.40 ns ± 15 ps +2% of Nominal
0.50 ns ± 15 ps +2% of Nominal
0.60 ns ± 15 ps +2% of Nominal
0.70 ns ± 15 ps +2% of Nominal
0.80 ns ± 15 ps +2% of Nominal
0.90 ns ± 15 ns +2% of Nominal
1.00 ns ± 15 ps +2% of Nominal
1.10 ns ± 15 ps +2% of Nominal
Typical Rise
Time (20%-
80%)
17 ps
26 ps
ps
ps
56 ps
ps
ps
ps
ps
ps
ps
53 ps
ps
61 ps
ps
69 ps
ps
http://www.thin-film.com/web/tft.nsf/41acb363040f5be585256a7b001dcc4c/3246c243a0... 10/23/2007
HE2LA*****D Series (Published)
Page 2 of 4
HE2LABA120D
HE2LABA130D
HE2LABA140D
HE2LABA150D
HE2LABA160D
1.20 ns ± 15 ps +2% of Nominal
1.30 ns ± 15 ps +2% of Nominal
1.40 ns ± 15 ps +2% of Nominal
1.50 ns ± 15 ps +2% of Nominal
1.60 ns ± 15 ps +2% of Nominal
90 ps
ps
ps
ps
116 ps
Mechanical
Size A
Notes:
Delay Line 1 I/O (DL1) = b1 & b3
Delay Line 2 I/O (DL2) = c1 & c3
The following positions do not have a ball: a1, a3, b2,
c2, d1, d3
No Connection = all other
Both signals shall enter positions '1' and exit positions
'3' or both signals shall enter positions '3' and exit
positions '1'.
Size B
Notes:
Delay Line 1 I/O (DL1) = a2 & b2
Delay Line 2 I/O (DL2) = a3 & b3
No Connection = all other
Both signals shall enter positions 'a' and exit positions
'b' or both signals shall enter positions 'b' and exit
positions 'a'.
Notes for Both:
Either DL1 or DL2 can be used for the inv. and non-inv.
signals.
Ball positions labeled 'No Connection' are only present
for mechanical stability (attach all to open pads on
board).
Marking
Size A
Size B
Part number code will be marked on the top of the part
in 2 rows followed by a TFT "don't stop" logo ("B" size
only) and a 1 digit monthly date code
A '1' pin identifier (dot) will be located as shown above
Land Pattern
Copper Defined Land Pattern:
Copper Land diameter
Soldermask diameter
Soldermask clearance
Soldermask Defined Land
Pattern:
Dimensions (mm)
0.66 - 0.71
0.81 - 0.86
0.07 min
Dimensions (mm)
http://www.thin-film.com/web/tft.nsf/41acb363040f5be585256a7b001dcc4c/3246c243a0... 10/23/2007
HE2LA*****D Series (Published)
Page 3 of 4
Soldermask diameter
Soldermask diameter
0.66 - 0.71
0.05 min
Note:
Adjust the copper land diameter accordingly to ensure the minimum soldermask coverage.
Recommended dimensions as per IPC-7095 "Design and Assembly Process Implementation for BGAs".
Packaging
Size Designator A:
Additional Comments:
All taping done in accordance with EIA 481 standards
Pieces taped with the marking up and showing through the cover tape
Labels will contain the TFT part number and quantity of pieces taped
Carrier Tape Part#: CT-9916H-123
Carrier Tape Drawing#: 01-019491
Size Designator B:
Additional Comments:
All taping done in accordance with EIA 481 standards
Pieces taped with the marking up and showing through the cover tape
http://www.thin-film.com/web/tft.nsf/41acb363040f5be585256a7b001dcc4c/3246c243a0... 10/23/2007
HE2LA*****D Series (Published)
Page 4 of 4
Labels will contain the TFT part number and quantity of pieces taped
Carrier Tape Part#: TBD
Carrier Tape Drawing#: TBD
Part Number
RoHS compliant designator leave blank if ordering non-RoHS compliant part
1980 Commerce Drive, North Mankato, MN. 56001 (507) 625-8445
http://www.thin-film.com/web/tft.nsf/41acb363040f5be585256a7b001dcc4c/3246c243a0... 10/23/2007
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