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HE2LABA060DT1-C

Active Delay Line, 1-Func, PBGA8, ROHS COMPLIANT, BGA-8

器件类别:逻辑    逻辑   

厂商名称:Thin Film Technology Corp (TFT)

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Thin Film Technology Corp (TFT)
包装说明
BGA,
Reach Compliance Code
unknown
系列
HE2LA
JESD-30 代码
R-PBGA-B8
JESD-609代码
e1
长度
10.16 mm
逻辑集成电路类型
ACTIVE DELAY LINE
功能数量
1
端子数量
8
最高工作温度
85 °C
最低工作温度
-40 °C
输出阻抗标称值(Z0)
100 Ω
封装主体材料
PLASTIC/EPOXY
封装代码
BGA
封装形状
RECTANGULAR
封装形式
GRID ARRAY
峰值回流温度(摄氏度)
NOT SPECIFIED
可编程延迟线
NO
座面最大高度
1.0922 mm
表面贴装
YES
温度等级
INDUSTRIAL
端子面层
TIN SILVER COPPER
端子形式
BALL
端子位置
BOTTOM
处于峰值回流温度下的最长时间
NOT SPECIFIED
总延迟标称(td)
0.6 ns
宽度
6.35 mm
Base Number Matches
1
文档预览
HE02M851.00 - Rev H - Page 1 of 2
Product Family:
Part Number Series:
High Efficiency Delay Line - Coupled Differential
HE-D Series
Construction:




High Purity Alumina Substrate
Broadside Coupled Transmission Lines
BGA Package
Available in RoHS (Sn96.5/Ag3.0/Cu0.5)
or Non-RoHS (Sn63/Pb37)
Features:





Coupled Differential (2 delay elements)
Time Delays of 0.1ns to 1.6ns
Tight Delay Tolerances
100Ω Differential Impedance
High volume production suitable for
commercial and special applications
Description:
This series features two broadside-coupled transmissions lines, ideal for differential applications. The BGA construction allows for
smaller footprint and low height profile. The performance of these equally distributed capacitance delay lines is significantly better
than lumped element delay lines and the physical size is much smaller than delays obtained by using cable.
Product Dimensions and Schematic:
Size A
Size B
Notes:
1) Dimensions:inches
2) Schematic is indicated by colored transmission lines
3) Locations B1 and B3 are input/output for one delay while locations
C1 and C3 are input/output for the other delay
4) All other locations are not electrically connected and are only
present for mechanical stability (attach all to open pads on board)
5) Either delay can be used for the inverted or non-inverted signals.
6) Both signals should enter “1” and exit “2”, or both should enter “2”
and exit “1” location.
Notes:
1) Dimensions:inches
2) Schematic is indicated by colored transmission lines
3) Locations A2 and B2 are input/output for one delay while locations
A3 and B3 are input/output for the other delay
4) All other locations are not electrically connected and are only
present for mechanical stability (attach all to open pads on board)
5) Either delay can be used for the inverted or non-inverted signals.
6) Both signals should enter “A” and exit “B”, or both should enter “B”
and exit “A” location.
Recommended Land Pattern Dimensions:
Copper Defined Land Pattern
Copper Land Diameter
Soldermask Diameter
Soldermask Clearance
Dimensions (inches)
0.026~0.028
0.032~0.034
0.003 min.
Soldermask Defined
Land Pattern
Soldermask Diameter
Soldermask Clearance
Dimensions (inches)
0.026~0.028
0.002 min.

Adjust the copper land pattern accordingly to ensure the minimum soldermask coverage

Recommended dimensions as per IPC-7095 - “Design and Assembly Process Implementation for BGA’s”
HE-D Series Part Numbering:
Ex: HE2LABA150D-C
Product
Designator
Number of
Elements
Impedance
Code
Package
Size
A
B
(refer to
dimensions)
Package
Height
Time Delay
Three numeric characters
representing
nanoseconds x 100
(i.e. 150=1.50ns)
Delay
Type
D=Coupled
Differential
T&R Packaging
Quantity
RoHS Indicator
-C = RoHS
(leave blank for
leaded)
HE
2L = 2
A = 100Ω
A=0.043”
T1=100pcs/reel
T5=500pcs/reel
Thin Film Technology Corp. / 1980 Commerce Drive, North Mankato, MN 56003 (USA) / (507) 625-8445 /
www.thin-film.com
HE02M851.00 - Rev H - Page 2 of 2
Electrical Specifications:
Product Size -->
Delay Range
Time delay increments
Time delay tolerance
Differential Impedance
DC Resistance
Rated Current
Temp. coef. of time delay
Isolation Resistance (Sgn-Gnd)
Insulation Resistance
Operating Temp. Range
Storage Temp. Range
Packaging
Size A
0.1 to 0.5ns
0.1ns steps
Size B
0.1ns to 1.6ns
0.1ns steps
±15ps + 2% of nominal
(i.e. For a 1.0ns delay value: ±15ps + (2% of 1.0ns) = ±35ps)
100Ω ±10%
0.1ns ~ 0.5ns = < 1.15
Ω
>0.5ns = < 2.30
Ω/ns
100 mA
150 ppm/°C
100MΩ minimum @ 100 Vdc
100MΩ minimum @ 100 Vdc
-40°C ~ +85°C
-55°C ~ +125°C
100pcs/reel or 500pcs/reel
Marking:
Product marking will be composed of the following:

Pin A1 identifier

Characters “HE2LAAA” or “HE2LABA”. Size dependant.

3-digit time delay code as explained in part numbering section

Character “D”

TFT “Don’t Stop” logo

1-digit manufacturing code
Packaging:
Packaging
Specification
General Notes
General Guidelines & Recommendations
All dimensions are in mm.
Not drawn to scale
Size A
Ao = 4.11 ±0.10mm
Size B
Ao = 6.50 ±0.10mm
Bo = 10.30±0.10mm
Ko = 2.10 ±0.10mm
T = 0.30 ±0.05mm
Tape Drawing:
Dimensions : mm
Drawing
Dimensional
Call-outs
Bo = 6.65 ±0.10mm
Ko = 1.55 ±0.10mm
T = 0.30 ±0.05mm
Packaging
Materials
Packaging
Requirements
Labeling
Requirements
“A” size carrier tape part #: CT-9916H-123
“B” size carrier tape part #: SOIC16-AC
Cover tape part #: Vendor determined.
Reel size: 7 inch diameter
All taping done in accordance with EIA 481
standards. Pieces taped with the marking facing
up and showing through the cover tape.
Labels will contain the TFT part number and
quantity of pieces taped.
Thin Film Technology Corp. / 1980 Commerce Drive, North Mankato, MN 56003 (USA) / (507) 625-8445 /
www.thin-film.com
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参数对比
与HE2LABA060DT1-C相近的元器件有:HE2LABA050D-C、HE2LABA040DT1-C、HE2LABA050DT1-C、HE2LABA080D-C、HE2LABA100DT1-C、HE2LABA070DT1-C、HE2LABA070D-C、HE2LABA080DT1-C、HE2LAAA050DT1。描述及对比如下:
型号 HE2LABA060DT1-C HE2LABA050D-C HE2LABA040DT1-C HE2LABA050DT1-C HE2LABA080D-C HE2LABA100DT1-C HE2LABA070DT1-C HE2LABA070D-C HE2LABA080DT1-C HE2LAAA050DT1
描述 Active Delay Line, 1-Func, PBGA8, ROHS COMPLIANT, BGA-8 Active Delay Line, 1-Func, PBGA8, ROHS COMPLIANT, BGA-8 Active Delay Line, 1-Func, PBGA8, ROHS COMPLIANT, BGA-8 Active Delay Line, 1-Func, PBGA8, ROHS COMPLIANT, BGA-8 Active Delay Line, 1-Func, PBGA8, ROHS COMPLIANT, BGA-8 Active Delay Line, 1-Func, PBGA8, ROHS COMPLIANT, BGA-8 Active Delay Line, 1-Func, PBGA8, ROHS COMPLIANT, BGA-8 Active Delay Line, 1-Func, PBGA8, ROHS COMPLIANT, BGA-8 Active Delay Line, 1-Func, PBGA8, ROHS COMPLIANT, BGA-8 Active Delay Line, 1-Func, PBGA6, BGA-6
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合 符合 不符合
包装说明 BGA, BGA, BGA, BGA, BGA, BGA, BGA, BGA, BGA, BGA-6
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
系列 HE2LA HE2LA HE2LA HE2LA HE2LA HE2LA HE2LA HE2LA HE2LA HE2LA
JESD-30 代码 R-PBGA-B8 R-PBGA-B8 R-PBGA-B8 R-PBGA-B8 R-PBGA-B8 R-PBGA-B8 R-PBGA-B8 R-PBGA-B8 R-PBGA-B8 R-PBGA-B6
JESD-609代码 e1 e1 e1 e1 e1 e1 e1 e1 e1 e0
长度 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 6.35 mm
逻辑集成电路类型 ACTIVE DELAY LINE ACTIVE DELAY LINE ACTIVE DELAY LINE ACTIVE DELAY LINE ACTIVE DELAY LINE ACTIVE DELAY LINE ACTIVE DELAY LINE ACTIVE DELAY LINE ACTIVE DELAY LINE ACTIVE DELAY LINE
功能数量 1 1 1 1 1 1 1 1 1 1
端子数量 8 8 8 8 8 8 8 8 8 6
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
输出阻抗标称值(Z0) 100 Ω 100 Ω 100 Ω 100 Ω 100 Ω 100 Ω 100 Ω 100 Ω 100 Ω 100 Ω
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA BGA BGA BGA BGA BGA
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
可编程延迟线 NO NO NO NO NO NO NO NO NO NO
座面最大高度 1.0922 mm 1.0922 mm 1.0922 mm 1.0922 mm 1.0922 mm 1.0922 mm 1.0922 mm 1.0922 mm 1.0922 mm 1.0922 mm
表面贴装 YES YES YES YES YES YES YES YES YES YES
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN LEAD
端子形式 BALL BALL BALL BALL BALL BALL BALL BALL BALL BALL
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
总延迟标称(td) 0.6 ns 0.5 ns 0.4 ns 0.5 ns 0.8 ns 1 ns 0.7 ns 0.7 ns 0.8 ns 0.5 ns
宽度 6.35 mm 6.35 mm 6.35 mm 6.35 mm 6.35 mm 6.35 mm 6.35 mm 6.35 mm 6.35 mm 3.81 mm
厂商名称 Thin Film Technology Corp (TFT) Thin Film Technology Corp (TFT) Thin Film Technology Corp (TFT) Thin Film Technology Corp (TFT) Thin Film Technology Corp (TFT) Thin Film Technology Corp (TFT) Thin Film Technology Corp (TFT) Thin Film Technology Corp (TFT) Thin Film Technology Corp (TFT) -
Base Number Matches 1 1 1 1 1 1 1 1 1 -
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