型号
- 型号
- 关键词
4000/14000/40000 SERIES, HEX 1-INPUT NON-INVERT GATE, CDIP16
厂商名称：NXP(恩智浦)
厂商官网：https://www.nxp.com
下载文档| 型号 | HEF4050BDB | HEC4050BDB | HEF4050BPB |
|---|---|---|---|
| 描述 | 4000/14000/40000 SERIES, HEX 1-INPUT NON-INVERT GATE, CDIP16 | 4000/14000/40000 SERIES, HEX 1-INPUT NON-INVERT GATE, CDIP16 | 4000/14000/40000 SERIES, HEX 1-INPUT NON-INVERT GATE, PDIP16 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| Reach Compliance Code | unknown | unknown | unknown |
| 其他特性 | CMOS-TTL LEVEL TRANSLATOR | CMOS-TTL LEVEL TRANSLATOR | CMOS-TTL LEVEL TRANSLATOR |
| 系列 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
| JESD-30 代码 | R-GDIP-T16 | R-GDIP-T16 | R-PDIP-T16 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUFFER | BUFFER | BUFFER |
| 功能数量 | 6 | 6 | 6 |
| 输入次数 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 125 °C | 85 °C |
| 最低工作温度 | -40 °C | -55 °C | -40 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE |
| 传播延迟（tpd） | 70 ns | 70 ns | 70 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 4.7 mm |
| 最大供电电压 (Vsup) | 15 V | 15 V | 15 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | MILITARY | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | - | 1 | 1 |
