HFA08TB120
Vishay High Power Products
HEXFRED
®
Ultrafast Soft Recovery Diode, 8 A
FEATURES
•
•
•
•
•
•
Base
cathode
2
Ultrafast recovery
Ultrasoft recovery
Very low I
RRM
Very low Q
rr
Specified at operating conditions
Designed and qualified for industrial level
BENEFITS
•
•
•
•
•
Reduced RFI and EMI
Reduced power loss in diode and switching transistor
Higher frequency operation
Reduced snubbing
Reduced parts count
1
Cathode
3
Anode
DESCRIPTION
HFA08TB120 is a state of the art ultrafast recovery diode.
Employing the latest in epitaxial construction and advanced
processing techniques it features a superb combination of
characteristics which result in performance which is
unsurpassed by any rectifier previously available. With basic
ratings of 1200 V and 8 A continuous current, the
HFA08TB120 is especially well suited for use as the
companion diode for IGBTs and MOSFETs. In addition to
ultrafast recovery time, the HEXFRED
®
product line features
extremely low values of peak recovery current (I
RRM
) and
does not exhibit any tendency to “snap-off” during the t
b
portion of recovery. The HEXFRED features combine to offer
designers a rectifier with lower noise and significantly lower
switching losses in both the diode and the switching
transistor. These HEXFRED advantages can help to
significantly reduce snubbing, component count and
heatsink sizes. The HEXFRED HFA08TB120 is ideally
suited for applications in power supplies and power
conversion systems (such as inverters), motor drives, and
many other similar applications where high speed, high
efficiency is needed.
TO-220AC
PRODUCT SUMMARY
V
R
V
F
at 8 A at 25 °C
I
F(AV)
t
rr
(typical)
T
J
(maximum)
Q
rr
(typical)
dI
(rec)M
/dt (typical) at 125 °C
I
RRM
(typical)
1200 V
3.3 V
8A
28 ns
150 °C
140 nC
85 A/µs
4.5 A
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Cathode to anode voltage
Maximum continuous forward current
Single pulse forward current
Maximum repetitive forward current
Maximum power dissipation
Operating junction and storage temperature range
SYMBOL
V
R
I
F
I
FSM
I
FRM
P
D
T
J
, T
Stg
T
C
= 25 °C
T
C
= 100 °C
T
C
= 100 °C
TEST CONDITIONS
VALUES
1200
8.0
130
32
73.5
29
- 55 to + 150
W
°C
A
UNITS
V
Document Number: 93042
Revision: 30-Jul-08
For technical questions, contact: diodes-tech@vishay.com
www.vishay.com
1
HFA08TB120
Vishay High Power Products
HEXFRED
®
Ultrafast Soft Recovery Diode, 8 A
ELECTRICAL SPECIFICATIONS
(T
J
= 25 °C unless otherwise specified)
PARAMETER
Cathode to anode
breakdown voltage
SYMBOL
V
BR
I
R
= 100 µA
I
F
= 8.0 A
Maximum forward voltage
V
FM
I
F
= 16 A
I
F
= 8.0 A, T
J
= 125 °C
Maximum reverse
leakage current
Junction capacitance
Series inductance
I
RM
C
T
L
S
V
R
= V
R
rated
T
J
= 125 °C, V
R
= 0.8 x V
R
rated
V
R
= 200 V
Measured lead to lead 5 mm from package body
TEST CONDITIONS
MIN.
1200
-
-
-
-
-
-
-
TYP.
-
2.6
3.4
2.4
0.31
135
11
8.0
MAX.
-
3.3
4.3
3.1
10
1000
20
-
µA
pF
nH
V
UNITS
DYNAMIC RECOVERY CHARACTERISTICS
(T
J
= 25 °C unless otherwise specified)
PARAMETER
SYMBOL
t
rr
Reverse recovery time
t
rr1
t
rr2
Peak recovery current
I
RRM1
I
RRM2
Q
rr1
Q
rr2
dI
(rec)M
/dt1
dI
(rec)M
/dt2
TEST CONDITIONS
I
F
= 1.0 A, dI
F
/dt = 200 A/µs, V
R
= 30 V
T
J
= 25 °C
T
J
= 125 °C
T
J
= 25 °C
T
J
= 125 °C
T
J
= 25 °C
T
J
= 125 °C
T
J
= 25 °C
T
J
= 125 °C
I
F
= 8.0 A
dI
F
/dt = 200 A/µs
V
R
= 200 V
MIN.
-
-
-
-
-
-
-
-
-
TYP.
28
63
106
4.5
6.2
140
335
133
85
MAX.
-
95
160
8.0
11
380
880
-
-
A
ns
UNITS
Reverse recovery charge
Peak rate of recovery current
during t
b
nC
A/µs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
Lead temperature
Thermal resistance,
junction to case
Thermal resistance,
junction to ambient
Thermal resistance,
case to heatsink
Weight
Mounting torque
Marking device
Case style TO-220AC
SYMBOL
T
lead
R
thJC
R
thJA
R
thCS
Typical socket mount
Mounting surface, flat, smooth and greased
TEST CONDITIONS
0.063" from case (1.6 mm) for 10 s
MIN.
-
-
-
-
-
-
6.0
(5.0)
TYP.
-
-
-
0.25
6.0
0.21
-
MAX.
300
1.7
40
-
-
-
12
(10)
g
oz.
kgf · cm
(lbf · in)
K/W
UNITS
°C
HFA08TB120
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2
For technical questions, contact: diodes-tech@vishay.com
Document Number: 93042
Revision: 30-Jul-08
HFA08TB120
HEXFRED
®
Vishay High Power Products
Ultrafast Soft Recovery Diode, 8 A
I
F
- Instantaneous Forward Current (A)
100
1000
T
J
= 150 °C
I
R
- Reverse Current (µA)
100
T
J
= 125 °C
T
J
= 100 °C
10
10
1
T
J
= 25 °C
T
J
= 150 °C
T
J
= 125 °C
T
J
= 25 °C
1
0
2
4
6
8
10
0.1
0.01
0
300
600
900
1200
V
FM
- Forward Voltage Drop (V)
Fig. 1 - Maximum Forward Voltage Drop Characteristics
V
R
- Reverse Voltage (V)
Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage
100
C
T
- Junction Capacitance (pF)
T
J
= 25 °C
10
1
1
10
100
1000
10 000
V
R
- Reverse Voltage (V)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
Z
thJC
- Thermal Impedance (°C/W)
10
1
P
DM
0.1
Single pulse
(thermal resistance)
0.01
0.00001
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
0.001
0.01
t
1
t
2
Notes:
1. Duty factor D = t
1
/t
2
2. Peak T
J
= P
DM
x Z
thJC
+ T
C
0.1
1
0.0001
t
1
- Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance Z
thJC
Characteristics
Document Number: 93042
Revision: 30-Jul-08
For technical questions, contact: diodes-tech@vishay.com
www.vishay.com
3
HFA08TB120
Vishay High Power Products
160
140
120
I
F
=
8
A
I
F
= 4 A
HEXFRED
®
Ultrafast Soft Recovery Diode, 8 A
1200
1000
800
V
R
= 160
V
T
J
= 125 °C
T
J
= 25 °C
Q
rr
(nC)
t
rr
(ns)
100
80
60
40
V
R
= 160
V
T
J
= 125 °C
T
J
= 25 °C
1000
600
400
200
0
100
I
F
=
8
A
I
F
= 4 A
20
100
1000
dI
F
/dt (A/µs)
Fig. 5 - Typical Reverse Recovery Time vs. dI
F
/dt
dI
F
/dt (A/µs)
Fig. 7 - Typical Stored Charge vs. dI
F
/dt
20
V
R
= 160
V
T
J
= 125 °C
T
J
= 25 °C
1000
I
F
=
8
A
I
F
= 4 A
16
12
I
rr
(A)
I
F
=
8
A
I
F
= 4 A
dI
(rec)M
/dt (A/µs)
100
8
4
V
R
= 160
V
T
J
= 125 °C
T
J
= 25 °C
1000
10
100
1000
0
100
dI
F
/dt (A/µs)
Fig. 6 - Typical Recovery Current vs. dI
F
/dt
dI
F
/dt (A/µs)
Fig. 8 - Typical dI
(rec)M
/dt vs. dI
F
/dt
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For technical questions, contact: diodes-tech@vishay.com
Document Number: 93042
Revision: 30-Jul-08
HFA08TB120
HEXFRED
®
Vishay High Power Products
Ultrafast Soft Recovery Diode, 8 A
V
R
= 200
V
0.01
Ω
L = 70
µH
D.U.T.
dI
F
/dt
adjust
D
G
IRFP250
S
Fig. 9 - Reverse Recovery Parameter Test Circuit
(3)
I
F
0
t
rr
t
a
t
b
Q
rr
(2)
(4)
I
RRM
0.5 I
RRM
dI
(rec)M
/dt
(5)
0.75 I
RRM
(1)
dI
F
/dt
(1) dI
F
/dt - rate of change of current
through zero crossing
(2) I
RRM
- peak reverse recovery current
(3) t
rr
- reverse recovery time measured
from zero crossing point of negative
going I
F
to point
where
a line passing
through 0.75 I
RRM
and 0.50 I
RRM
extrapolated to zero current.
(4) Q
rr
- area
under
curve defined
by
t
rr
and I
RRM
Q
rr
=
t
rr
x I
RRM
2
(5) dI
(rec)M
/dt - peak rate of change of
current during t
b
portion of t
rr
Fig. 10 - Reverse Recovery Waveform and Definitions
Document Number: 93042
Revision: 30-Jul-08
For technical questions, contact: diodes-tech@vishay.com
www.vishay.com
5
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