HFBR-0501 Series
Versatile Link
The Versatile Fiber Optic Connection
Data Sheet
Description
The Versatile Link series is a complete family of fiber
optic link components for applications requiring a low
cost solution. The HFBR-0501 series includes
transmitters, receivers, connectors and cable specified
for easy design. This series of components is ideal for
solving problems with voltage isolation/insulation,
EMI/RFI immunity or data security. The optical link design
is simplified by the logic compatible receivers and
complete specifications for each component. The key
optical and electrical parameters of links configured with
the HFBR-0501 family are fully guaranteed from 0° to
70°C.
A wide variety of package configurations and connectors
provide the designer with numerous mechanical solutions
to meet application requirements. The transmitter and
receiver components have been designed for use in high
volume/low cost assembly processes such as auto
insertion and wave soldering.
Transmitters incorporate a 660 nm LED. Receivers
include a monolithic dc coupled, digital IC receiver with
open collector Schottky output transistor. An internal
pullup resistor is available for use in the HFBR-25X1/2/4
receivers. A shield has been integrated into the receiver
IC to provide additional, localized noise immunity.
Internal optics have been optimized for use with 1 mm
diameter plastic optical fiber. Versatile Link specifications
incorporate all connector interface losses. Therefore,
optical calculations for common link applications are
simplified.
Features
Low cost fiber optic components
Enhanced digital links dc-5 MBd
Extended distance links up to 120 m at 40 kBd
Low current link: 6 mA peak supply current
Horizontal and vertical mounting
Interlocking feature
High noise immunity
Easy connectoring Simplex, Duplex, and Latching
connectors
• Flame retardant
• Transmitters incorporate a 660 nm Red LED for easy
visibility
• Compatible with standard TTL circuitry
•
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•
•
•
•
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Applications
•
•
•
•
•
•
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Reduction of lightning/voltage transient susceptibility
Motor controller triggering
Data communications and local area networks
Electromagnetic Compatibility (EMC) for regulated
systems: FCC, VDE, CSA, etc.
Tempest-secure data processing equipment
Isolation in test and measurement instruments
Error free signalling for industrial and manufacturing
equipment
Automotive communications and control networks
Noise immune communication in audio and video
equipment
HFBR-0501 Series Part Number Guide
HFBR X5XX
1 = Transmitter
2 = Receiver
5 = 600 nm Transmitter and
Receiver Products
2 = Horizontal Package
3 = Vertical Package
1 = 5 MBd High Performance Link
2 = 1 MBd High Performance Link
3 = 40 kBd Low Current/Extended Distance Link
4 = 1 MBd Standard Link
6 = 155 MBd Receiver
7 = 155 MBd Transmitter
8 = 10 MBd High Performance Link
Link Selection Guide
(Links specified from 0 to 70°C, for plastic optical fiber unless specified.)
Signal Rate
40 kBd
1 MBd
1 MBd
5 Mbd
Distance (m) 25°C
120
20
55
30
Distance (m)
110
10
45
20
Transmitter
HFBR-1523
HFBR-1524
HFBR-1522
HFBR-1521
Receiver
HFBR-2523
HFBR-2524
HFBR-2522
HFBR-2521
Evaluation Kit
HFBR-0501 1 MBd Versatile Link:
This kit contains: HFBR-1524 Tx, HFBR-2524 Rx,
polishing kit, 3 styles of plastic connectors, Bulkhead
feedthrough, 5 meters of 1 mm diameter plastic cable,
lapping film and grit paper, and HFBR-0501 data sheet.
Application Literature
Application Note 1035 (Versatile Link)
Package and Handling Information
The compact Versatile Link package is made of a flame
retardant VALOX
®
UL 94 V-0 material (UL file # E121562)
and uses the same pad layout as a standard, eight pin
dual-in-line package. Vertical and horizontal mountable
parts are available. These low profile Versatile Link
packages are stackable and are enclosed to provide a
dust resistant seal. Snap action simplex, simplex
latching, duplex, and duplex latching connectors are
offered with simplex or duplex cables.
Package Orientation
Performance and pinouts for the vertical and horizontal
packages are identical. To provide additional attachment
support for the vertical Versatile Link housing, the
designer has the option of using a self-tapping screw
through a printed circuit board into a mounting hole at
the bottom of the package. For most applications this is
not necessary.
Package Housing Color
Versatile Link components and simplex connectors are
color coded to eliminate confusion when making
connections. Receivers are blue and transmitters are
gray, except for the HFBR-15X3 transmitter, which is
black.
VALOX
®
is a registered trademark of the General Electric Corporation.
2
Handling
Versatile Link components are auto-insertable. When
wave soldering is performed with Versatile Link
components, the optical port plug should be left in to
prevent contamination of the port. Do not use reflow
solder processes (i.e., infrared reflow or vapor-phase
reflow). Nonhalogenated water soluble fluxes
(i.e., 0% chloride), not rosin based fluxes, are recom-
mended for use with Versatile Link components.
Versatile Link components are moisture sensitive
devices and are shipped in a moisture sealed bag. If the
components are exposed to air for an extended period
of time, they may require a baking step before the
soldering process. Refer to the special labeling on the
shipping tube for details.
Recommended Chemicals for Cleaning/Degreasing
Alcohols: methyl, isopropyl, isobutyl. Aliphatics: hexane,
heptane, Other: soap solution, naphtha.
CAUTION
This bag contains
MOISTURE-SENSITIVE
DEVICES
Level
4
1. Shelf life in sealed bag: 12 months at < 40°C and < 90% Relative
Humidity (RH).
2. After this bag is opened, devices that will be subjected to wave
soldering, or equivalent processing (solder temperature < 260°C for
10 sec) must be:
a) Mounted within 72 hours at factory conditions of
≤
30°C/60% RH.
b) Stored at
≤
20% RH.
3. Devices require baking, before mounting, if:
a) Desiccant changes to PINK.
b) If 2a or 2b are not met.
4. If baking is required, devices may be baked outside of tube for 20
hours at 75°C.
Bag Seal Date: ______________________________________________________
(If blank, see barcode label)
Note: LEVEL defined by EIA JEDEC Standard J-STD-020
Do not use partially halogenated hydrocarbons such as
1,1.1 trichloroethane, ketones such as MEK, acetone,
chloroform, ethyl acetate, methylene dichloride, phenol,
methylene chloride, or N-methylpyrolldone. Also, Avago
does not recommend the use of cleaners that use
halogenated hydrocarbons because of their potential
environmental harm.
Mechanical Dimensions
Horizontal Modules
Vertical Modules
2.0
(0.080)
6.8
(0.270)
10.2
(0.400)
18.8
(0.740)
5.1
(0.200)
4.2
(0.165)
7.6
(0.30)
0.64
(0.025)
7.71
7.6
(0.305)
(0.30)
18.8
0.740
7.62
(0.300)
3.81 (0.150) MAX.
3.56 (0.140) MIN.
0.51
(0.020)
1.27
(0.050)
2.5
(0.100)
0.64 (0.025) DIA.
2.8
(0.109)
1.85
(0.073)
3
Versatile Link Printed Board Layout Dimensions
Horizontal Module
Vertical Module
7.62
(0.300)
2.54
(0.100)
1.01 (0.040) DIA.
4
TOP VIEW
3
2
1
7.62
(0.300)
PCB EDGE
5
6
1.85 MIN.
(0.073)
DIMENSIONS IN MILLIMETERS (INCHES).
Interlocked (Stacked) Assemblies
(refer to Figure 1)
Horizontal packages may be stacked by placing units
with pins facing upward. Initially engage the inter-
locking mechanism by sliding the L bracket body from
above into the L slot body of the lower package. Use a
straight edge, such as a ruler, to bring all stacked units
into uniform alignment. This technique prevents
potential harm that could occur to fingers and hands of
assemblers from the package pins. Stacked horizontal
packages can be disengaged if necessary. Repeated
stacking and unstacking causes no damage to individual
units.
To stack vertical packages, hold one unit in each hand,
with the pins facing away and the optical ports on the
bottom. Slide the L bracket unit into the L slot unit. The
straight edge used for horizontal package alignment is
not needed.
Stacking Horizontal Modules
Stacking Vertical Modules
Figure 1. Interlocked (stacked) horizontal or vertical packages
4
5 MBd Link (HFBR-15X1/25X1)
System Performance 0 to 70°C unless otherwise specified.
High
Performance
5 MBd
Parameter
Data Rate
Link Distance
(Standard Cable)
Link Distance
(Improved Cable)
Propagation
Delay
Pulse Width
Distortion t
PLH
-t
PHL
t
PLH
t
PHL
t
D
Symbol
Min.
dc
19
27
22
27
Typ. Max. Units
5
MBd
48
53
80
50
30
140
140
m
m
m
m
ns
ns
ns
Conditions
BER
≤10
-9
, PRBS:2
7
-1
I
Fdc
= 60 mA
I
Fdc
= 60 mA, 25°C
I
Fdc
= 60 mA
I
Fdc
= 60 mA, 25°C
R
L
= 560
Ω,
C
L
= 30 pF
fiber length = 0.5 m
-21.6
≤P
R
≤-9.5
dBm
P
R
= -15 dBm
R
L
= 560
Ω,
C
L
= 30 pF
Ref.
Fig. 3
Note 3
Fig. 4
Note 3
Fig. 5, 8
Notes 1, 2
Fig. 5, 7
Notes:
1. The propagation delay for one metre of cable is typically 5 ns.
2. Typical propagation delay is measured at P
R
= -15 dBm.
3. Estimated typical link life expectancy at 40°C exceeds 10 years at 60 mA.
Figure 2. Typical 5 MBd interface circuit
100
100
I F – FORWARD CURRENT (mA)
50
40
30
20
OVERDRIVE
UNDERDRIVE
I F – FORWARD CURRENT (mA)
50
40
30
20
OVERDRIVE
UNDERDRIVE
10
0°C–70°C
25°C
0
10
20
30
40
50
10
0°C–70°C
25°C
0
10
20
30
40
50
60
5
5
– CABLE LENGTH – METRES
– CABLE LENGTH – METRES
Figure 3. Guaranteed system performance with standard cable (HFBR-15X1/25X1)
Figure 4. Guaranteed system performance with improved cable (HFBR-15X1/25X1)
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