HFBR-5805/5805T/5805A/5805AT ATM
Transceivers for SONET OC-3/SDH
STM-1 in Low Cost 1 x 9 Package Style
Data Sheet
Features
• Full compliance with ATM forum
UNI SONET OC-3 multimode fiber
physical layer specification
• Multisourced 1 x 9 package style
with choice of duplex SC or
duplex ST* receptacle
• Wave solder and aqueous wash
process compatibility
• Manufactured in an ISO 9002
certified facility
• Single +3.3 V or +5.0 V power
supply
Applications
• Multimode fiber ATM backbone
links
• Multimode fiber ATM wiring
closet to desktop links
Ordering Information
The HFBR-5805/5805T/5805A/
5805AT 1300 nm products are
available for production orders
through the Agilent Component
Field Sales Offices and
Authorized Distributors world
wide.
0 °C to +70 °C
HFBR-5805/5805T
-10 °C to +85 °C
HFBR-5805A/5805AT
*ST is a registered trademark of AT&T
Lightguide Cable Connectors.
Note:
The “T” in the product numbers
indicates a transceiver with a duplex ST
connector receptacle.
Product numbers without a “T” indicate
transceivers with a duplex SC connector
receptacle.
Description
The HFBR-5800 family of
transceivers from Agilent
provide the system designer
with products to implement a
range of solutions for
multimode fiber SONET OC-3
(SDH STM-1) physical layers
for ATM and other services.
The transceivers are all
supplied in the industry
standard 1 x 9 SIP package
style with either a duplex SC
or a duplex ST* connector
interface.
ATM 2 km Backbone Links
The HFBR-5805/-5805T are
1300 nm products with optical
performance compliant with
the SONET STS-3c (OC-3)
Physical Layer Interface
Specification. This physical
layer is defined in the ATM
Forum User-Network Interface
(UNI) Specification Version 3.0.
This document references the
ANSI T1E1.2 specification for
the details of the interface for
2 km multimode fiber
backbone links.
The ATM 100 Mb/s-125 MBd
Physical Layer interface is best
implemented with the HFBR-
5803 family of Fast Ethernet
and FDDI Transceivers which
are specified for use in this
4B/5B encoded physical layer
per the FDDI PMD standard.
Transmitter Sections
The transmitter section of the
HFBR-5803 and HFBR-5805
series utilize 1300 nm InGaAsP
LEDs. These LEDs are
packaged in the optical
subassembly portion of the
transmitter section. They are
driven by a custom silicon IC
which converts differential
PECL logic signals, ECL
referenced (shifted) to a +3.3 V
or +5.0 V supply, into an
analog LED drive current.
Receiver Sections
The receiver section of the
HFBR-5803 and HFBR-5805
series utilize InGaAs PIN
photodiodes coupled to a
custom silicon transimpedance
preamplifier IC. These are
packaged in the optical
subassembly portion of the
receiver.
These PIN/preamplifier
combinations are coupled to a
custom quantizer IC which
provides the final pulse
shaping for the logic output
and the Signal Detect function.
The data output is dif-
ferential. The signal detect
output is single-ended. Both
data and signal detect outputs
are PECL compatible, ECL
referenced (shifted) to a 3.3 V
or +5.0 V power supply.
Package
The overall package concept
for the Agilent transceivers
consists of three basic
elements; the two optical
subassemblies, an electrical
subassembly and the housing
as illustrated in Figure 1 and
Figure 1a.
The package outline drawing
and pin out are shown in
Figures 2, 2a and 3. The
details of this package outline
and pin out are compliant
with the multisource definition
of the 1 x 9 SIP. The low
profile of the Agilent
transceiver design complies
with the maximum height
allowed for the duplex SC
connector over the entire
length of the package.
The optical subassemblies
utilize a high volume assembly
process together with low cost
lens elements which result in a
cost effective building block.
The electrical subassembly
consists of a high volume
multilayer printed circuit
board on which the IC chips
and various surface-mounted
passive circuit elements are
attached.
The package includes internal
shields for the electrical and
optical subassemblies to ensure
low EMI emissions and high
immunity to external EMI
fields.
The outer housing including
the duplex SC connector or
the duplex ST ports is molded
of filled nonconductive plastic
to provide mechanical strength
and electrical isolation. The
solder posts of the Agilent
design are isolated from the
circuit design of the
transceiver and do not require
connection to a ground plane
on the circuit board.
The transceiver is attached to
a printed circuit board with
the nine signal pins and the
two solder posts which exit
the bottom of the housing. The
two solder posts provide the
primary mechanical strength to
withstand the loads imposed
on the transceiver by mating
with duplex or simplex SC or
ST connectored fiber cables.
ELECTRICAL SUBASSEMBLY
DIFFERENTIAL
DATA OUT
SINGLE-ENDED
SIGNAL
DETECT OUT
QUANTIZER IC
PREAMP IC
DUPLEX SC
RECEPTACLE
PIN PHOTODIODE
OPTICAL
SUBASSEMBLIES
DIFFERENTIAL
DATA IN
DRIVER IC
LED
TOP VIEW
Figure 1. SC Connector Block Diagram
ELECTRICAL SUBASSEMBLY
DIFFERENTIAL
DATA OUT
SINGLE-ENDED
SIGNAL
DETECT OUT
QUANTIZER IC
PREAMP IC
DUPLEX ST
RECEPTACLE
PIN PHOTODIODE
OPTICAL
SUBASSEMBLIES
DIFFERENTIAL
DATA IN
DRIVER IC
LED
TOP VIEW
Figure 1a. ST Connector Block Diagram.
2
Case Temperature
Measurement Point
39.12
MAX.
(1.540)
12.70
(0.500)
6.35
(0.250)
25.40
MAX.
(1.000)
AREA
RESERVED
FOR
PROCESS
PLUG
12.70
(0.500)
HFBR-5805
DATE CODE (YYWW)
SINGAPORE
+ 0.08
0.75
– 0.05
3.30 ± 0.38
+ 0.003 )
(0.030
(0.130 ± 0.015)
– 0.002
AGILENT
5.93 ± 0.1
(0.233 ± 0.004)
10.35 MAX.
(0.407)
2.92
(0.115)
Ø
0.46
(9x)
(0.018)
NOTE 1
18.52
(0.729)
4.14
(0.163
1.27 + 0.25
– 0.05
+ 0.010
(0.050
)
– 0.002
NOTE 1
23.55
(0.927)
20.32 [8x(2.54/.100)]
(0.800)
16.70
(0.657)
17.32 20.32
(0.682 (0.800)
23.32
(0.918)
0.87
(0.034)
23.24
(0.915)
15.88
(0.625)
NOTE 1: THE SOLDER POSTS AND ELECTRICAL PINS ARE PHOSPHOR BRONZE WITH TIN LEAD OVER NICKEL PLATING.
DIMENSIONS ARE IN MILLIMETERS (INCHES).
Figure 2. Package Outline Drawing
3
Case Temperature
Measurement Point
39.12
MAX.
(1.540)
12.70
(0.500)
6.35
(0.250)
25.40
MAX.
(1.000)
AREA
RESERVED
FOR
PROCESS
PLUG
12.70
(0.500)
HFBR-5805
DATE CODE (YYWW)
SINGAPORE
+ 0.08
0.75
– 0.05
3.30 ± 0.38
+ 0.003 )
(0.030
(0.130 ± 0.015)
– 0.002
AGILENT
5.93 ± 0.1
(0.233 ± 0.004)
10.35 MAX.
(0.407)
2.92
(0.115)
Ø
0.46
(9x)
(0.018)
NOTE 1
18.52
(0.729)
4.14
(0.163
1.27 + 0.25
– 0.05
+ 0.010
(0.050
)
– 0.002
NOTE 1
23.55
(0.927)
20.32 [8x(2.54/.100)]
(0.800)
16.70
(0.657)
17.32 20.32
(0.682 (0.800)
23.32
(0.918)
0.87
(0.034)
23.24
(0.915)
15.88
(0.625)
NOTE 1: THE SOLDER POSTS AND ELECTRICAL PINS ARE PHOSPHOR BRONZE WITH TIN LEAD OVER NICKEL PLATING.
DIMENSIONS ARE IN MILLIMETERS (INCHES).
Figure 2a. ST Package Outline Drawing
1 = V
EE
2 = RD
3 = RD
4 = SD
5 = V
CC
6 = V
CC
7 = TD
8 = TD
9 = V
EE
TOP VIEW
Figure 3. Pin Out Diagram.
N/C
Rx
Tx
N/C
4
Application Information
The Applications Engineering
group in the Agilent Fiber
Optics Communication Division
is available to assist you with
the technical understanding
and design trade-offs
associated with these trans-
ceivers. You can contact them
through your Agilent sales
representative.
The following information is
provided to answer some of
the most common questions
about the use of these parts.
Transceiver Optical Power Budget
versus Link Length
Optical Power Budget (OPB) is
the available optical power for
a fiber optic link to
accommodate fiber cable losses
plus losses due to in-line
connectors, splices, optical
switches, and to provide
margin for link aging and
unplanned losses due to cable
plant reconfiguration or repair.
Figure 4 illustrates the pre-
dicted OPB associated with the
transceiver series specified in
this data sheet at the Beginning
of Life (BOL). These curves
represent the attenuation and
chromatic plus modal
dispersion losses associated
with the 62.5/125 µm and 50/
125 µm fiber cables only. The
area under the curves
represents the remaining OPB
at any link length, which is
available for overcoming non-
fiber cable related losses.
Agilent LED technology has
produced 1300 nm LED
devices with lower aging
characteristics than normally
associated with these
technologies in the industry.
The industry convention is 1.5
dB aging for 1300 nm LEDs.
The Agilent 1300 nm LEDs are
specified to experience less
than 1 dB of aging over
normal commerical equipment
mission life periods. Contact
your Agilent sales repre-
sentative for additional details.
Figure 4 was generated for the
1300 nm transceivers with a
Agilent fiber optic link model
containing the current industry
conventions for fiber cable
specifications and the draft
ANSI T1E1.2. These optical
parameters are reflected in the
guaranteed performance of the
transceiver specifications in
this data sheet. This same
model has been used
extensively in the ANSI and
IEEE committees, including the
ANSI T1E1.2 committee, to
establish the optical
performance requirements for
various fiber optic interface
standards. The cable
parameters used come from the
ISO/IEC JTC1/SC 25/WG3
Generic Cabling for Customer
Premises per DIS 11801 docu-
ment and the EIA/TIA-568-A
Commercial Building Telecom-
munications Cabling Standard
per SP-2840.
12
HFBR-5805, 62.5/125 µm
10
OPTICAL POWER BUDGET (dB)
8
6
4
2
1.
0
HFBR-5805
50/125 µm
0
0.3 0.5
1.5
2.0
2.5
FIBER OPTIC CABLE LENGTH (km)
Figure 4. Optical Power Budget at BOL versus
Fiber Optic Cable Length.
5
