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HFBR-5905

Transceiver, 1-Func, LOW PROFILE, DIP-20

器件类别:无线/射频/通信    电信电路   

厂商名称:Hewlett Packard Co

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器件参数
参数名称
属性值
厂商名称
Hewlett Packard Co
零件包装代码
DIP
包装说明
,
针数
20
Reach Compliance Code
unknown
应用程序
ATM;SDH;SONET
JESD-30 代码
R-XXFO-X
功能数量
1
最高工作温度
70 °C
最低工作温度
封装主体材料
UNSPECIFIED
封装形状
RECTANGULAR
封装形式
FIBER OPTIC
认证状态
Not Qualified
标称供电电压
3.3 V
表面贴装
NO
电信集成电路类型
ATM/SONET/SDH TRANSCEIVER
温度等级
COMMERCIAL
端子形式
UNSPECIFIED
端子位置
UNSPECIFIED
文档预览
ATM Multimode Fiber Transceivers
for SONET OC-3/SDH STM-1
in Low Cost 2 x 5 Package Style
Technical Data
HFBR-5905
1300 nm 2 km
Features
• Multisourced 2 x 5 Package
Style with MT-RJ Receptacle
• Single +3.3 V Power Supply
• Wave Solder and Aqueous
Wash Process Compatibility
• Manufactured in an ISO
9002 Certified Facility
• Full Compliance with ATM
Forum UNI SONET OC-3
Multimode Fiber Physical
Layer Specification
ATM 2 km Backbone Links
The HFBR-5905 is a 1300 nm
product with optical performance
compliant with the SONET STS-3c
(OC-3) Physical Layer Interface
Specification. This physical layer
is defined in the ATM Forum User-
Network Interface (UNI)
Specification Version 3.0. This
document references the ANSI
T1E1.2 specification for the details
of the interface for 2 km multimode
fiber backbone links.
The ATM 100 Mb/s-125 MBd
Physical Layer interface is best
implemented with the HFBR-5903
family of FDDI Transceivers
which are specified for use in this
4B/5B encoded physical layer per
the FDDI PMD standard.
Transmitter Sections
The transmitter section of the
HFBR-5905 utilizes a 1300 nm
InGaAsP LED. This LED is
packaged in the optical
subassembly portion of the
transmitter section. It is driven by
a custom silicon IC which
converts differential PECL logic
signals, ECL referenced (shifted)
to a +3.3 V supply, into an analog
LED drive current.
Applications
• Multimode Fiber ATM
Backbone Links
• Multimode Fiber ATM
Wiring Closet to Desktop
Links
Receiver Sections
The receiver section of the
HFBR-5905 utilizes an InGaAs PIN
photodiode coupled to a custom
silicon transimpedance preampli-
fier IC. It is packaged in the
optical subassembly portion of the
receiver.
This PIN/preamplifier combination
is coupled to a custom quantizer
IC which provides the final pulse
shaping for the logic output and
the Signal Detect function. The
Data output is differential. The
Signal Detect output is single-
ended. Both Data and Signal
Detect outputs are PECL compat-
ible, ECL referenced (shifted) to a
3.3 V power supply. The receiver
outputs, Data Out and Data Out
Bar, are squelched at Signal
Detect Deassert. That is, when the
light input power decreases to a
typical -38 dBm or less, the Signal
Detect Deasserts, i.e. the Signal
Detect output goes to a PECL low
state. This forces the receiver
outputs, Data Out and Data Out
Bar to go to steady PECL levels
High and Low respectively.
Description
The HFBR-5900 family of trans-
ceivers from Hewlett-Packard
provide the system designer with
products to implement a range of
solutions for multimode fiber
SONET OC-3 (SDH STM-1)
physical layers for ATM and other
services.
These transceivers are all
supplied in the new industry
standard 2 x 5 DIP style with a
MT-RJ fiber connector interface.
2
Package
The overall package concept for
the HP transceiver consists of
three basic elements; the two
optical subassemblies, an
electrical subassembly, and the
housing as illustrated in the
block diagram in Figure 1.
The package outline drawing and
pin out are shown in Figures 2 and
3. The details of this package
outline and pin out are compliant
with the multisource definition of
the 2 x 5 DIP. The low profile of
the Hewlett-Packard transceiver
design complies with the
maximum height allowed for the
MT-RJ connector over the entire
length of the package.
The optical subassemblies utilize
a high-volume assembly process
together with low-cost lens
elements which result in a cost-
effective building block.
The electrical subassembly con-
sists of a high volume multilayer
printed circuit board on which the
IC and various surface-mounted
passive circuit elements are
attached.
The receiver section includes an
internal shield for the electrical
and optical subassemblies to
ensure high immunity to external
EMI fields.
The outer housing including the
MT-RJ ports is molded of filled
nonconductive plastic to provide
mechanical strength and
electrical isolation. The solder
posts of the Hewlett-Packard
design are isolated from the
internal circuit of the transceiver.
The transceiver is attached to a
printed circuit board with the ten
signal pins and the two solder
posts which exit the bottom of the
housing. The two solder posts
provide the primary mechanical
strength to withstand the loads
imposed on the transceiver by
mating with the MT-RJ
connectored fiber cables.
R
X
SUPPLY
DATA OUT
DATA OUT
SIGNAL
DETECT
DATA IN
DATA IN
LED DRIVER IC
QUANTIZER IC
PIN PHOTODIODE
PRE-AMPLIFIER
SUBASSEMBLY
R
X
GROUND
T
X
GROUND
MT-RJ
RECEPTACLE
LED
OPTICAL
SUBASSEMBLY
T
X
SUPPLY
Figure 1. Block Diagram.
3
13.97
(0.55)
MIN.
FRONT VIEW
9.6
13.59
(0.535) (0.378)
MAX. MAX.
TOP VIEW
Pin 1
7.59
(0.299)
8.6
(0.339)
1.778
(0.07)
10.16
(0.4)
Ø 0.61
Ø1.5
(0.059)
17.778
(0.7)
+0
-0.2
(+000)
(0.24)
(-008)
12
(0.472)
7.112
(0.28)
49.56 (1.951)
37.56 (1.479) MAX.
9.3
9.8
(0.386) (0.366)
MAX. MAX.
SIDE VIEW
3.3
(0.13)
0.977 Ø
(0.038)
DIMENSIONS IN MILLIMETERS (INCHES)
Notes:
1. This page describes the maximum package outline, mounting studs, pins and their relationships to each other.
2. Toleranced to accommodate round or rectangular leads.
3. All 12 pins and posts are to be treated as a single pattern.
4. The MT-RJ has a 750 µm fiber spacing.
5. The MT-RJ alignment pins are in the module.
6. For SM modules, the ferrule will be PC polished (not angled).
7. See MT-RJ Transceiver Pin Out Diagram for details.
Figure 2. Package Outline Drawing
4
RX
TX
Mounting Studs/
Solder Posts
Top
View
RECEIVER SIGNAL GROUND
RECEIVER POWER SUPPLY
SIGNAL DETECT
RECEIVER DATA OUT BAR
RECEIVER DATA OUT
Figure 3. Pin Out Diagram.
f
f
f
f
f
1
2
3
4
5
10
9
8
7
6
f
f
f
f
f
TRANSMITTER DATA IN BAR
TRANSMITTER DATA IN
TRANSMITTER DISABLE (LASER BASED PRODUCTS ONLY)
TRANSMITTER SIGNAL GROUND
TRANSMITTER POWER SUPPLY
Pin Descriptions:
Pin 1 Receiver Signal Ground
V
EE
RX:
Directly connect this pin to the
receiver ground plane.
Pin 2 Receiver Power Supply
V
CC
RX:
Provide +3.3 V dc via the
recommended receiver power
supply filter circuit. Locate the
power supply filter circuit as close
as possible to the V
CC
RX pin.
Pin 3 Signal Detect SD:
Normal optical input levels to the
receiver result in a logic “1”
output.
Low optical input levels to the
receiver result in a fault condition
indicated by a logic “0” output.
This Signal Detect output can be
used to drive a PECL input on an
upstream circuit, such as Signal
Detect input or Loss of Signal-bar.
Pin 4 Receiver Data Out Bar
RD-:
No internal terminations are
provided. See recommended
circuit schematic.
Pin 5 Receiver Data Out RD+:
No internal terminations are
provided. See recommended
circuit schematic.
Pin 6 Transmitter Power
Supply V
CC
TX:
Provide +3.3 V dc via the
recommended transmitter power
supply filter circuit. Locate the
power supply filter circuit as
close as possible to the V
CC
TX
pin.
Pin 7 Transmitter Signal
Ground V
EE
TX:
Directly connect this pin to the
transmitter ground plane.
Pin 8 Transmitter Disable
T
DIS
:
No internal connection. Optional
feature for laser based products
only. For laser based products
connect this pin to
+3.3 V TTL logic high “1” to
disable module. To enable module
connect to TTL logic low “0”.
Pin 9 Transmitter Data In TD+:
No internal terminations are
provided. See recommended
circuit schematic.
Pin 10 Transmitter Data In Bar
TD-:
No internal terminations are
provided. See recommended
circuit schematic.
Mounting Studs/Solder Posts
The mounting studs are provided
for transceiver mechanical
attachment to the circuit board. It
is recommended that the holes in
the circuit board be connected to
chassis ground.
5
Application Information
The Applications Engineering
group in the Hewlett-Packard
Fiber Optic Communications
Division is available to assist you
with the technical understanding
and design trade-offs associated
with these transceivers. You can
contact them through your
Hewlett-Packard sales
representative.
The following information is
provided to answer some of the
most common questions about the
use of these parts.
Transceiver Optical Power
Budget versus Link Length
Optical Power Budget (OPB) is
the available optical power for a
fiber optic link to accommodate
fiber cable losses plus losses due
to in-line connectors, splices,
optical switches, and to provide
margin for link aging and
unplanned losses due to cable
plant reconfiguration or repair.
Figure 4 illustrates the predicted
OPB associated with the
transceiver specified in this data
sheet at the Beginning of Life
(BOL). These curves represent the
attenuation and chromatic plus
modal dispersion losses
associated with the 62.5/125 µm
and 50/125 µm fiber cables only.
12
HFBR-5905, 62.5/125 µm
The area under the curves
represents the remaining OPB at
any link length, which is available
for overcoming non-fiber cable
related losses.
Hewlett-Packard LED technology
has produced 1300 nm LED
devices with lower aging
characteristics than normally
associated with these
technologies in the industry. The
industry convention is 1.5 dB
aging for 1300 nm LEDs. The 1300
nm HP LEDs are specified to
experience less than 1 dB of aging
over normal commercial equip-
ment mission life periods. Contact
your Hewlett-Packard sales repre-
sentative for additional details.
Figure 4 was generated for the
1300 nm transceivers with a
Hewlett-Packard fiber optic link
model containing the current
industry conventions for fiber
cable specifications and the draft
ANSI T1E1.2. These optical
parameters are reflected in the
guaranteed performance of the
transceiver specifications in this
data sheet. This same model has
been used extensively in the ANSI
and IEEE committees, including
the ANSI T1E1.2 committee, to
establish the optical performance
requirements for various fiber
optic interface standards. The
cable parameters used come from
the ISO/IEC JTC1/SC 25/WG3
Generic Cabling for Customer
Premises per DIS 11801 document
and the EIA/TIA-568-A
Commercial Building
Telecommunications Cabling
Standard per SP-2840.
Transceiver Signaling
Operating Rate Range and BER
Performance
For purposes of definition, the
symbol (Baud) rate, also called
signaling rate, is the reciprocal of
the symbol time. Data rate (bits/
sec) is the symbol rate divided by
the encoding factor used to
encode the data (symbols/bit).
When used in 155 Mb/s SONET
OC-3 applications the perform-
ance of the 1300 nm transceivers,
HFBR-5905 is guaranteed to the
full conditions listed in product
specification tables.
The transceivers may be used for
other applications at signaling
rates different than 155 Mb/s with
some variation in the link optical
power budget. Figure 5 gives an
indication of the typical
performance of these products at
different rates.
2.5
TRANSCEIVER RELATIVE POWER BUDGET
AT CONSTANT BER (dB)
2
1.5
1
0.5
0
-0.5
-1
0
25
50
75
100
125
150
175
200
SIGNAL RATE (MBd)
CONDITIONS:
1. PRBS 2
7
-1
2. DATA SAMPLED AT CENTER OF DATA SYMBOL.
3. BER = 10
-6
4. T
A
= +25° C
5. V
CC
= 3.3 V dc
6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
10
OPTICAL POWER BUDGET (dB)
8
6
4
2
0
HFBR-5905,
50/125 µm
Figure 5. Transceiver Relative
Optical Power Budget at Constant
BER vs. Signaling Rate.
0.3 0.5
1.0
1.5
2.0
2.5
FIBER OPTIC CABLE LENGTH (km)
Figure 4. Typical Optical Power
Budget at BOL versus Fiber Optic
Cable Length.
These transceivers can also be
used for applications which require
different Bit Error Rate (BER)
performance. Figure 6 illustrates
the typical trade-off between link
BER and the receivers input
optical power level.
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