SURFACE MOUNT GLASS PASSIVATED HIGH EFFICIENCY SILICON RECTIFIER (VOLTAGE RANGE 50 to 1000 Volts CURRENT 3.0 Amperes)
厂商官网:http://www.rectron.com/
器件标准:
下载文档型号 | HFM301 | HFM303 | HFM306 | HFM307 |
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描述 | SURFACE MOUNT GLASS PASSIVATED HIGH EFFICIENCY SILICON RECTIFIER (VOLTAGE RANGE 50 to 1000 Volts CURRENT 3.0 Amperes) | SURFACE MOUNT GLASS PASSIVATED HIGH EFFICIENCY SILICON RECTIFIER (VOLTAGE RANGE 50 to 1000 Volts CURRENT 3.0 Amperes) | SURFACE MOUNT GLASS PASSIVATED HIGH EFFICIENCY SILICON RECTIFIER (VOLTAGE RANGE 50 to 1000 Volts CURRENT 3.0 Amperes) | SURFACE MOUNT GLASS PASSIVATED HIGH EFFICIENCY SILICON RECTIFIER (VOLTAGE RANGE 50 to 1000 Volts CURRENT 3.0 Amperes) |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Rectron Semiconductor | Rectron Semiconductor | Rectron Semiconductor | Rectron Semiconductor |
零件包装代码 | DO-214AB | DO-214AB | DO-214AB | DO-214AB |
包装说明 | ROHS COMPLIANT, PLASTIC PACKAGE-2 | R-PDSO-C2 | ROHS COMPLIANT, PLASTIC PACKAGE-2 | ROHS COMPLIANT, PLASTIC PACKAGE-2 |
针数 | 2 | 2 | 2 | 2 |
Reach Compliance Code | _compli | _compli | _compli | _compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | LOW LEAKAGE CURRENT, METALLURGICALLY BONDED | LOW LEAKAGE CURRENT, METALLURGICALLY BONDED | LOW LEAKAGE CURRENT, METALLURGICALLY BONDED | LOW LEAKAGE CURRENT, METALLURGICALLY BONDED |
应用 | EFFICIENCY | EFFICIENCY | EFFICIENCY | EFFICIENCY |
配置 | SINGLE | SINGLE | SINGLE | SINGLE |
二极管元件材料 | SILICON | SILICON | SILICON | SILICON |
二极管类型 | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE |
最大正向电压 (VF) | 1 V | 1 V | 1.7 V | 1.7 V |
JEDEC-95代码 | DO-214AB | DO-214AB | DO-214AB | DO-214AB |
JESD-30 代码 | R-PDSO-C2 | R-PDSO-C2 | R-PDSO-C2 | R-PDSO-C2 |
JESD-609代码 | e3 | e3 | e3 | e3 |
最大非重复峰值正向电流 | 200 A | 200 A | 150 A | 150 A |
元件数量 | 1 | 1 | 1 | 1 |
相数 | 1 | 1 | 1 | 1 |
端子数量 | 2 | 2 | 2 | 2 |
最高工作温度 | 150 °C | 150 °C | 150 °C | 150 °C |
最大输出电流 | 3 A | 3 A | 3 A | 3 A |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | 265 | 265 | 265 | 265 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大重复峰值反向电压 | 50 V | 200 V | 600 V | 800 V |
最大反向恢复时间 | 0.05 µs | 0.05 µs | 0.075 µs | 0.075 µs |
表面贴装 | YES | YES | YES | YES |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | C BEND | C BEND | C BEND | C BEND |
端子位置 | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |