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HGXO2BTSM3-460.0K,H3B0

CMOS Output Clock Oscillator, 0.46MHz Nom, CERAMIC, MINIATURE PACKAGE-4

器件类别:无源元件    振荡器   

厂商名称:STATEK CORPORATION

厂商官网:http://www.statek.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
Objectid
1309343613
Reach Compliance Code
compliant
其他特性
TRI-STATE; ENABLE/DISABLE FUNCTION
最长下降时间
8 ns
频率调整-机械
NO
频率稳定性
25%
JESD-609代码
e0
制造商序列号
HGXO
安装特点
SURFACE MOUNT
标称工作频率
0.46 MHz
最高工作温度
85 °C
最低工作温度
-40 °C
振荡器类型
CMOS
输出负载
15 pF
物理尺寸
7.68mm x 5.18mm x 2.5mm
最长上升时间
8 ns
标称供电电压
2.5 V
表面贴装
YES
最大对称度
60/40 %
端子面层
Tin/Lead (Sn/Pb)
文档预览
MILITARY PRODUCTS
HIGH FREQUENCY OSCILLATORS WITH
STANDARD MILITARY TESTING
S
YS
TE
M
C
ERT
I
F
I
C
A
T
IO
N
STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256
www.statek.com
O
IS
O
01
0
90
OVERVIEW
For over 35 years, Statek has supported military programs with both standard products (normally purchased without a drawing and
without modifications or special testing) and specialized products (normally purchased to a drawing and requiring modifications or
special testing). For those desiring standard products (not governed by a source control document) but still desiring construction
and testing to military standards, Statek offers a portfolio of oscillators manufactured and tested to MIL-PRF-55310, Product
Level B. Because of our dedication to servicing specialized needs and continued support of the military market over the years,
Statek is a preferred supplier to a number of major defense contractors.
GUIDELINES FOR MILITARY PRODUCTS
Materials
Statek uses only the highest quality materials from carefully selected suppliers. Whenever possible, we use domestic suppliers
and try to cultivate a long-term relationship to provide stable sources of high-quality materials. Statek’s incoming inspection
assures compliance to our requirements. We manufacture our crystals with ultra-pure synthetically grown alpha-quartz bars.
(Swept quartz is also available, e.g., for applications requiring radiation hardness.) To simplify and minimize the device circuitry,
we use oscillator-dedicated integrated circuits. Lastly, we design our own ceramic packages, which are then manufactured for us
by our package supplier.
Assembly
Statek optimizes its manufacturing process to guarantee high quality. Our time-proven assembly process includes many
proprietary techniques to ensure robust parts suitable for the harshest environments. All military oscillators are inspected to
MIL-STD-883 prior to seal.
Testing
In order to meet COTS (commercial-off-the-shelf) requirements, Statek offers oscillators meeting the testing requirements of
MIL-PRF-55310 Product Level B. However, Statek gladly accepts fully customized testing to meet your needs; just contact us
with your requirements.
Continuity
Statek offers the continuity of support required for long-term military programs. We maintain records so that we can trace each
delivery back through its manufacturing history. Statek also has production redundancy and an established Business Continuity
Plan, which will allow us to recover in the event of an unforeseen occurrence.
Quality Assurance
Statek uses the ISO 9001:2000 process approach model and plans its continual improvements in order to achieve total customer
satisfaction.
IN-HOUSE TEST CAPABILITIES FOR OSCILLATORS:
(INCLUDE BUT NOT LIMITED TO)
Aging (Elevated Temp) . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-PRF-55310, Paragraph 4.8.35)
Burn-in . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-PRF-55310, Table III)
Die Shear Strength . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-883, Method 2019)
Fine/Gross Leak Testing . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-883, Method 1014; MIL-STD-202, Method 112)
Lead Integrity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-883, Method 2004)
Mechanical Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-883, Method 2002)
Moisture Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-202, Method 106)
PIND (Particle Impact Noise Detection) . . . . . . . . . . . . . . .(MIL-STD-883, Method 2020; MIL-STD-202, Method 217)
Salt Atmosphere . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-883, Method 1009)
Solderability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-883, Method 2003)
Temperature Cycling . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-883, Method 1010)
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-PRF-55310, Paragraph 1.2.1.3, Table III)
Thermal Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-202, Method 107)
Vibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-202, Method 204)
Wirebond Pull Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(MIL-STD-883, Method 2023)
PRODUCT FAMILY DESCRIPTIONS
Statek’s high-frequency military grade oscillators are designed specifically to meet the demanding
requirements of today’s precision military applications.
The CXO oscillator is compatible with
conventional soldering, epoxy attachment and
wirebonding. It has high shock resistance and
excellent long-term reliability.
The CXOX oscillator is a miniaturized version
of the CXOM, with a low profile ceramic
package and one of the smallest footprints
available in the industry.
The CXOHG, CXOMHG and CXOXHG
oscillators are high-shock versions of the CXO,
CXOM and CXOX oscillators that can survive
shocks up to 10,000 g (and higher if required.)
The HGXO is a miniature surface mount
oscillator that can survive extremely high shocks
up to 100,000 g. In addition, due to its design
and construction, it is available in tighter
frequency calibrations than Statek’s other
oscillators.
The LXOAT and LXOMAT are thru-hole
oscillators.
For applications requiring other types of
crystals, oscillators, or sensors, please contact
the factory.
MILITARY APPLICATIONS
Smart Munitions
Airborne Communication Systems
Battlefield Simulation
Portable Field Equipment
Projectile Electronics
Robust Computing Platform
Telemetry
Navigation
GPS
MILITARY PROGRAM
PARTICIPATION
AMRAAM
(Advanced Medium-Range Air to Air Missile)
ASRAAM
(Advance Short-Range Air to Air Missile)
CSEL
(Combat Survivor Evader Locator)
DAS
(Distributed Aperture System)
ERGM
(Extended Range Guided Munitions)
EXCALIBER
(Next Generation Fuze)
JASSM
(Joint Air to Surface Standoff Missile)
JCM
(Joint Common Missile)
JTRS
(Joint Tactical Radio System)
JSF
(Joint Strike Fighter)
LGB
(Laser Guided Bomb)
MRM
(Medium Range Munition)
PAC-3
(Patriot Advanced Capabilities)
PREDATOR
(Hand-Held Missile)
SFW
(Sensor Fuzed Weapons)
WCMD
(Wind Corrected Munitions Dispenser)
MAXIMUM RATINGS
Supply Voltage V
DD
Storage Temperature
-0.5 V to 7.0 V
-55
O
C to +125
O
C
ENABLE/DISABLE OPTIONS (E/T/N)
Statek offers three enable/disable options: E, T, and N. Both the E-version and T-version have Tri-State outputs and
differ in whether the oscillator continues to run internally when the output is put into the high Z state: it stops in the
E-version and continues to run in the T-version. So, the E-version offers very low current consumption when the oscillator
is disabled and the T-version offers very fast output recovery when the oscillator is re-enabled. The N-version does not
have PIN 1 connected internally and so has no enable/disable capability. The following table summarizes the three
options.
SUMMARY OF ENABLE/DISABLE OPTIONS E/T/N
E
T
Freq.output
Oscillates
Normal
High Z state
Oscillates
Lower than normal
Immediate
N
Freq. output
Oscillates
Normal
Freq. output
Oscillates
Normal
N/A
When enabled (PIN 1 is high*)
Output
Oscillator
Current consumption
Output
Oscillator
Current consumption
Output recovery
Freq. output
Oscillates
Normal
High Z state
Stops
Very low
Delayed
When disabled (PIN 1 is low)
When re-enabled (PIN 1 changes from low to high)
*
When PIN 1 is allowed to float, it is held high by an internal pull-up resistor.
3
2
E
2
3
0.275 (6.99)
DIMENSIONS
TYP.
MAX.
mm
10.16
4.57
1.30
8.64
3.18
1.27
inches
0.405
0.190
0.055
0.350
0.135
0.060
mm
10.29
4.83
1.40
8.89
3.43
1.52
GRID
PLACEMENT
COURTYARD
0.140 (3.56)
0.135 (3.43)
0. 30 (3.30)
1
0.070 (1.78)
A
TOP
D
BOTTOM
DIM
A
B
C*
inches
0.400
0.180
0.051
0.340
0.125
0.050
CXO/
CXOHG
4
B
1
C
1
F
4
D
E
F
0.060 (1.52)
PIN CONNECTIONS
1.
2.
3.
4.
Enable/Disable (E or T) or not connected (N)
Ground
Output
V
DD
* SM1 Termination
G
DIMENSIONS
D
TYP.
DIM
A
B
inches
0.295
0.197
0.089
0.055
0.040
0.240
0.100
mm
7.50
5.00
2.25
1.40
1.02
6.10
2.54
MAX.
inches
0.302
0.204
0.098
mm
7.68
5.18
2.50
0.040 (1.02)
0.060 (1.52)
2
3
A
TOP
F
1
4
0.075 (1.91)
HGXO
B
D
C
E
C*
D
E
F
G
0.240 (6.10)
0.165 (4.19)
PIN CONNECTIONS
1.
2.
3.
4.
Enable/Disable (E or T) or not connected (N)
Ground
Output
V
DD
* SM1 Termination
inches (mm)
0. 00 (2.54)
1
GRID
PLACEMENT
COURTYARD
SPECIFICATIONS
Specifications are typical at 25
O
C unless otherwise noted. Specifications are subject to change without notice.
SURFACE MOUNT PRODUCTS
CXO/CXOHG
0
033
60M
T
CXOM/CXOMHG
GM
M
4.19
CXOX/CXOXHG
Frequency Range
Supply Voltage
Standard Calibration Tolerances
1
Frequency Stability Over Temp. Range
2
Supply Current (Typical)
300 kHz to 120 MHz
(up to 220 MHz for 3.3V)
1.8 V to 5.0 V
+
_
25
+
_
300 kHz to 120 MHz
1.8 V to 5.0 V
(up to 220 MHz for 3.3V)
1 MHz to 160 MHz
1.8 V to 5.0 V
ppm,
+
_
50 ppm,
+
_
+
_
100 ppm
+
_
25
+
_
ppm,
+
_
50 ppm,
+
_
+
_
100 ppm
+
_
25
+
_
25
ppm,
+
_
50 ppm,
+
_
100
+
_
100 ppm
25 ppm to
100 ppm
3.3 V
10 mA for 50 MHz
8 mA for 40 MHz
6 mA for 30 MHz
4 mA for 24 MHz
25 ppm to
100 ppm
3.3 V
6 mA for 50 MHz
5.5 mA for 40 MHz
5 mA for 32 MHz
3 mA for 24 MHz
ppm to
ppm
3.3 V
6 mA for 50 MHz
5.5 mA for 40 MHz
5 mA for 320 MHz
3 mA for 24 MHz
5.0 V
14 mA for 50 MHz
12 mA for 40 MHz
10 mA for 30 MHz
8 mA for 24 MHz
15 pF
5 ms MAX
3 ns TYP, 6 ns MAX
40% MIN, 60% MAX
5.0 V
13 mA for 50 MHz
12 mA for 40 MHz
10 mA for 32 MHz
8 mA for 24 MHz
15 pF
5 ms MAX
3 ns TYP, 6 ns MAX
40% MIN, 60% MAX
5.0 V
13 mA for 50 MHz
12 mA for 40 MHz
10 mA for 32 MHz
8 mA for 24 MHz
15 pF
5 ms MAX
3 ns TYP, 6 ns MAX
40% MIN, 60% MAX
Output Load (CMOS)
3
Start-up Time
Rise/Fall Time
Duty Cycle
1
Aging, first year
Shock, survival
4
Vibration, survival
5
Maximum Process Temperature
For high frequency oscillators, aging is dependent on frequency and
3,000 g / 10,000 g, 0.3 ms,
1
/
2
sine
20 g, 10-2000 Hz swept sine
260
O
C for 20 seconds
3,000 g / 10,000 g, 0.3 ms,
1
/
2
sine
20 g, 10-2000 Hz swept sine
260
O
C for 20 seconds
5,000 g / 10,000 g, 0.3 ms,
1
/
2
sine
20 g, 10-2000 Hz swept sine
260
O
C for 20 seconds
1. Other tolerances available
3. TTL loads and higher CMOS loads available. Contact Factory.
2. Does not include calibration tolerance. Other tolerances available.
4. Higher shock version available.
5. Per MIL-STD-202G, Method 204D, Condition D. Random vibration testing also available.
NOTE: All combinations may not be available. All parameters are measured at an ambient temperature with a 10 MΩ, 15 pF load.
DIMENSIONS
D
0.067 (1.70)
0.070 (1.78)
2
A
TOP
BOTTOM
3
TYP.
DIM
A
B
C*
D
E
inches
0.256
0.197
0.051
0.055
0.060
mm
6.50
5.00
1.30
1.40
1.52
MAX.
inches
0.263
0.204
0.055
0.070
mm
6.68
5.18
1.40
1.78
0.201 (5.11)
0.136 (3.45)
0.065 (1.65)
CXOM/
CXOMHG
B
C
1
4
D
E
PIN CONNECTIONS
1.
2.
3.
4.
Enable/Disable (E or T) or not connected (N)
Ground
Output
V
DD
* SM1 Termination
GRID
PLACEMENT
COURTYARD
0. 37 (3.48)
1
E
F
G
H
J
A
I
DIMENSIONS
DIM
A
B
PIN
NO.7
inches
0.810 MAX
0.510 MAX
0.300 ± 0.005
0.600 ± 0.005
0.430 TYP
0.240 MAX
0.040 TYP
0.150 MIN
0.018 ± 0.002
0.070 TYP
mm
20.57 MAX
12.95 MAX
7.62 ± 0.13
15.24 ± 0.13
10.92 TYP
6.10 MAX
1.02 TYP
3.81 MIN
0.46 ± 0.05
1.78 TYP
PIN
NO.1
D
C
D
E
F
LXOAT
B
C
PIN
NO.14
PIN
NO.8
G
H
I
J
PIN CONNECTIONS
1. Enable/Disable (E or T) or not connected (N)
7. Ground
8. Output
14. V
DD
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