Intel
®
Pentium
®
4 Processor 6x1
Δ
Sequence
Datasheet
– On 65 nm Process in the 775-land LGA Package and supporting
Intel
®
Extended Memory 64 Technology
Φ
January 2006
Document Number: 310308-001
Contents
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future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel
®
Pentium
®
4 Processor 6x1 sequence may contain design defects or errors known as errata which may cause the product to deviate from
published specifications.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel
®
Extended Memory 64 Technology (Intel
®
EM64T) requires a computer system with a processor, chipset, BIOS, operating system, device drivers
and applications enabled for Intel EM64T. Processor will not operate (including 32-bit operation) without an Intel EM64T-enabled BIOS. Performance
will vary depending on your hardware and software configurations. See www.intel.com/info/em64t for more information including details on which
processors support EM64T or consult with your system vendor for more information.
Hyper-Threading Technology requires a computer system with an Intel
®
Pentium
®
4 processor supporting HT Technology and a HT Technology
enabled chipset, BIOS, and an operating system. Performance will vary depending on the specific hardware and software you use. See <http://
www.intel.com/info/hyperthreading> for information.
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Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.
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*Other names and brands may be claimed as the property of others.
Copyright © 2006 Intel Corporation.
1
2
Datasheet
Contents
Contents
1
Introduction
............................................................................................................................. 13
1.1
1.2
Terminology ........................................................................................................................ 14
1.1.1 Processor Packaging Terminology ........................................................................ 14
References ......................................................................................................................... 15
Power and Ground Lands................................................................................................... 17
Decoupling Guidelines........................................................................................................ 17
2.2.1 V
CC
Decoupling ..................................................................................................... 17
2.2.2 V
TT
Decoupling ...................................................................................................... 17
2.2.3 FSB Decoupling ..................................................................................................... 18
Voltage Identification .......................................................................................................... 18
Reserved, Unused, and TESTHI Signals ........................................................................... 20
Voltage and Current Specification ...................................................................................... 21
2.5.1 Absolute Maximum and Minimum Ratings............................................................. 21
2.5.2 DC Voltage and Current Specification ................................................................... 22
2.5.3 V
CC
Overshoot....................................................................................................... 26
2.5.4 Die Voltage Validation ........................................................................................... 26
Signaling Specifications...................................................................................................... 27
2.6.1 FSB Signal Groups ................................................................................................ 27
2.6.2 GTL+ Asynchronous Signals ................................................................................. 29
2.6.3 Processor DC Specifications ................................................................................. 30
2.6.3.1 GTL+ Front Side Bus Specifications ...................................................... 33
Clock Specifications............................................................................................................ 34
2.7.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking .................................. 34
2.7.2 FSB Frequency Select Signals (BSEL[2:0])........................................................... 35
2.7.3 Phase Lock Loop (PLL) and Filter ......................................................................... 35
2.7.4 BCLK[1:0] Specifications ....................................................................................... 37
Package Mechanical Drawing ............................................................................................ 39
Processor Component Keep-Out Zones............................................................................. 43
Package Loading Specifications......................................................................................... 43
Package Handling Guidelines............................................................................................. 43
Package Insertion Specifications........................................................................................ 44
Processor Mass Specification............................................................................................. 44
Processor Materials ............................................................................................................ 44
Processor Markings ............................................................................................................ 44
Processor Land Coordinates ..............................................................................................45
Processor Land Assignments ............................................................................................. 47
Alphabetical Signals Reference .......................................................................................... 70
Processor Thermal Specifications ...................................................................................... 79
5.1.1 Thermal Specifications .......................................................................................... 79
2
Electrical Specifications
..................................................................................................... 17
2.1
2.2
2.3
2.4
2.5
2.6
2.7
3
Package Mechanical Specifications
.............................................................................. 39
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4
Land Listing and Signal Descriptions
........................................................................... 47
4.1
4.2
5
Thermal Specifications and Design Considerations
.............................................. 79
5.1
Datasheet
3
Contents
5.2
5.1.2 Thermal Metrology................................................................................................. 82
Processor Thermal Features .............................................................................................. 82
5.2.1 Thermal Monitor..................................................................................................... 82
5.2.2 Thermal Monitor 2.................................................................................................. 83
5.2.3 On-Demand Mode ................................................................................................. 84
5.2.4 PROCHOT# Signal................................................................................................ 85
5.2.5 THERMTRIP# Signal............................................................................................. 85
5.2.6 T
CONTROL
and Fan Speed Reduction.................................................................... 85
5.2.7 Thermal Diode ....................................................................................................... 85
Power-On Configuration Options........................................................................................ 89
Clock Control and Low Power States ................................................................................. 90
6.2.1 Normal State.......................................................................................................... 90
6.2.2 HALT and Enhanced HALT Powerdown States .................................................... 90
6.2.2.1 HALT Powerdown State......................................................................... 91
6.2.2.2 Enhanced HALT Powerdown State ....................................................... 91
6.2.3 Stop Grant State .................................................................................................... 92
6.2.4 Enhanced HALT Snoop or HALT Snoop State,
Stop Grant Snoop State......................................................................................... 92
6.2.4.1 HALT Snoop State, Stop Grant Snoop State......................................... 92
6.2.4.2 Enhanced HALT Snoop State................................................................ 92
Mechanical Specifications .................................................................................................. 93
7.1.1 Boxed Processor Cooling Solution Dimensions .................................................... 93
7.1.2 Boxed Processor Fan Heatsink Weight ................................................................. 95
7.1.3 Boxed Processor Retention Mechanism and Heatsink
Attach Clip Assembly............................................................................................. 95
Electrical Requirements...................................................................................................... 95
7.2.1 Fan Heatsink Power Supply .................................................................................. 95
Thermal Specifications ....................................................................................................... 97
7.3.1 Boxed Processor Cooling Requirements............................................................... 97
Mechanical Specifications ................................................................................................ 100
8.1.1 Balanced Technology Extended (BTX) Type I and
Type II Boxed Processor Cooling Solution Dimensions ...................................... 100
8.1.2 Boxed Processor Thermal Module Assembly Weight.......................................... 102
8.1.3 Boxed Processor Support and Retention Module (SRM) .................................... 102
Electrical Requirements.................................................................................................... 103
8.2.1 Thermal Module Assembly Power Supply ........................................................... 103
Thermal Specifications ..................................................................................................... 105
8.3.1 Boxed Processor Cooling Requirements............................................................. 105
8.3.2 Variable Speed Fan ............................................................................................. 106
Logic Analyzer Interface (LAI) .......................................................................................... 109
9.1.1 Mechanical Considerations.................................................................................. 109
9.1.2 Electrical Considerations ..................................................................................... 109
6
Features
..................................................................................................................................... 89
6.1
6.2
7
Boxed Processor Specifications
..................................................................................... 93
7.1
7.2
7.3
8
Balanced Technology Extended (BTX) Boxed Processor Specifications
..... 99
8.1
8.2
8.3
9
Debug Tools Specifications
............................................................................................ 109
9.1
4
Datasheet
Contents
Figures
2-1
2-2
2-3
3-1
3-2
3-3
3-4
3-5
3-6
4-1
4-2
5-1
5-2
5-3
6-1
7-1
7-2
7-3
7-4
7-5
7-6
7-7
7-8
8-1
8-2
8-3
8-4
8-5
8-6
8-7
8-8
V
CC
Static and Transient Tolerance for 775_VR_CONFIG_05A Processors............................. 25
V
CC
Overshoot Example Waveform ........................................................................................... 26
Phase Lock Loop (PLL) Filter Requirements.............................................................................. 36
Processor Package Assembly Sketch ........................................................................................ 39
Processor Package Drawing Sheet 1 of 3 .................................................................................. 40
Processor Package Drawing Sheet 2 of 3 .................................................................................. 41
Processor Package Drawing Sheet 3 of 3 .................................................................................. 42
Processor Top-Side Markings Example ..................................................................................... 44
Processor Land Coordinates and Quadrants (Top View) ........................................................... 45
land-out Diagram (Top View – Left Side).................................................................................... 48
land-out Diagram (Top View – Right Side) ................................................................................. 49
Thermal Profile for Processors with PRB = 0 ............................................................................. 81
Case Temperature (TC) Measurement Location ........................................................................ 82
Thermal Monitor 2 Frequency and Voltage Ordering .................................................................84
Processor Low Power State Machine......................................................................................... 90
Mechanical Representation of the Boxed Processor.................................................................. 93
Space Requirements for the Boxed Processor (Side View; applies to all four side views) ........ 94
Space Requirements for the Boxed Processor (Top View) ........................................................ 94
Space Requirements for the Boxed Processor (Overall View) ................................................... 95
Boxed Processor Fan Heatsink Power Cable Connector Description ........................................ 96
Baseboard Power Header Placement Relative to Processor Socket ......................................... 97
Boxed Processor Fan Heatsink Airspace Keep-out Requirements
(Side 1 View) .............................................................................................................................. 98
Boxed Processor Fan Heatsink Airspace Keep-out Requirements
(Side 2 View) .............................................................................................................................. 98
Mechanical Representation of the Boxed Processor with a Type I TMA.................................... 99
Mechanical Representation of the Boxed Processor with a Type II TMA.................................100
Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes ........101
Requirements for the Balanced Technology Extended (BTX) Type II Keep-out Volume .........102
Assembly Stack Including the Support and Retention Module .................................................103
Boxed Processor TMA Power Cable Connector Description....................................................104
Balanced Technology Extended (BTX) Mainboard Power Header Placement (Hatched Area)105
Boxed Processor TMA Set Points ............................................................................................106
Datasheet
5
模拟电子
