型号
- 型号
- 关键词
| 型号 | HI1-201HS/883 | 5962-8671601EA | 5962-8671601EX | 5962-86716012X | 5962-86716012A | HI4-201HS/883 |
|---|---|---|---|---|---|---|
| 描述 | SPST, 4 Func, 1 Channel, CMOS, CDIP16, | SPST, 4 Func, 1 Channel, CMOS, CDIP16, | SPST, 4 Func, 1 Channel, CMOS, CDIP16, | SPST, 4 Func, 1 Channel, CMOS, CQCC20 | SPST, 4 Func, 1 Channel, CMOS, CQCC20 | SPST, 4 Func, 1 Channel, CMOS, CQCC20 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown |
| 模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST | SPST |
| JESD-30 代码 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | S-CQCC-N20 | S-CQCC-N20 | S-CQCC-N20 |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 16 | 16 | 16 | 20 | 20 | 20 |
| 最大通态电阻 (Ron) | 50 Ω | 50 Ω | 50 Ω | 50 Ω | 50 Ω | 50 Ω |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | YES | YES | YES |
| 最长断开时间 | 50 ns | 50 ns | 50 ns | 50 ns | 50 ns | 50 ns |
| 最长接通时间 | 50 ns | 50 ns | 50 ns | 50 ns | 50 ns | 50 ns |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD |
| 最大供电电流 (Isup) | 10 mA | 10 mA | - | - | 10 mA | 10 mA |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 |