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HIP4086ABT

IC DRIVER MOSFET N-CH 3PH 24SOIC

器件类别:模拟混合信号IC    驱动程序和接口   

厂商名称:Renesas(瑞萨电子)

厂商官网:https://www.renesas.com/

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器件参数
参数名称
属性值
Brand Name
Intersil
厂商名称
Renesas(瑞萨电子)
零件包装代码
PDIP, SOIC
包装说明
,
针数
24, 24
Reach Compliance Code
unknown
ECCN代码
EAR99
Factory Lead Time
1 week
其他特性
JUNCTION TEMPERATURE FOR TEST
高边驱动器
YES
输入特性
STANDARD
接口集成电路类型
HALF BRIDGE BASED MOSFET DRIVER
JESD-30 代码
R-PDSO-G24
功能数量
3
端子数量
24
最高工作温度
125 °C
最低工作温度
-40 °C
输出特性
TOTEM-POLE
标称输出峰值电流
1.7 A
输出极性
TRUE
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
认证状态
Not Qualified
表面贴装
YES
技术
MOS
温度等级
AUTOMOTIVE
端子形式
GULL WING
端子位置
DUAL
断开时间
0.1 µs
接通时间
0.1 µs
Base Number Matches
1
文档预览
DATASHEET
HIP4086, HIP4086A
80V, 500mA, 3-Phase MOSFET Driver
The
HIP4086
and
HIP4086A
(referred to as the HIP4086/A)
are 3-phase N-channel MOSFET drivers. Both parts are
specifically targeted for PWM motor control. These drivers
have flexible input protocol for driving every possible switch
combination. The user can even override the shoot-through
protection for switched reluctance applications.
The HIP4086/A have a wide range of programmable dead
times (0.5µs to 4.5µs) which makes them very suitable for the
low frequencies (up to 100kHz) typically used for motor drives.
The only difference between the HIP4086 and the HIP4086A
is that the HIP4086A has the built-in charge pumps disabled.
This is useful in applications that require very quiet EMI
performance (the charge pumps operate at 10MHz). The
advantage of the HIP4086 is that the built-in charge pumps
allow indefinitely long on times for the high-side drivers.
To insure that the high-side driver boot capacitors are fully
charged prior to turning on, a programmable bootstrap refresh
pulse is activated when VDD is first applied. When active, the
refresh pulse turns on all three of the low-side bridge FETs
while holding off the three high-side bridge FETs to charge the
high-side boot capacitors. After the refresh pulse clears,
normal operation begins.
Another useful feature of the HIP4086/A is the programmable
undervoltage set point. The set point range varies from 6.6V to
8.5V.
TABLE 1. KEY DIFFERENCES BETWEEN FAMILY OF PARTS
PART NUMBER
HIP4086
HIP4086A
CHARGE
PUMP
Yes
No
FN4220
Rev 1.00
January 12, 2017
Features
• Independently drives 6 N-channel MOSFETs in 3-phase
bridge configuration
• Bootstrap supply maximum voltage up to 95VDC with bias
supply from 7V to 15V
• 1.25A peak turn-off current
• User programmable dead time (0.5µs to 4.5µs)
• Bootstrap and optional charge pump maintain the high-side
driver bias voltage.
• Programmable bootstrap refresh time
• Drives 1000pF load with typical rise time of 20ns and fall
time of 10ns
• Programmable undervoltage set point
Applications
• Brushless Motors (BLDC)
• 3-phase AC motors
• Switched reluctance motor drives
• Battery powered vehicles
• Battery powered tools
Related Literature
AN9642,
“HIP4086 3-Phase Bridge Driver Configurations
and Applications”
AN1829,
“HIP4086 3-Phase BLDC Motor Drive
Demonstration Board, User Guide”
VDD
VDD
RDEL
CHB
BHB
AHB
200
V
xHB
- V
xHS
= 10V
OUTPUT CURRENT (µA)
Battery
24V...48V
AHO
Speed
HIP4086/A
BHO
CHO
CHS
BHS
AHS
150
AHI
ALI
BHI
BLI
CHI
CLI
Controller
Brake
100
VSS
ALO
BLO
CLO
50
0
-60
-40
-20
0
20
40
60
80
100 120 140 160
JUNCTION TEMPERATURE (°C)
FIGURE 1. TYPICAL APPLICATION
FIGURE 2. CHARGE PUMP OUTPUT CURRENT
FN4220 Rev 1.00
January 12, 2017
Page 1 of 17
HIP4086, HIP4086A
Block Diagram
(for clarity, only one phase is shown)
CHARGE
PUMP*
EN
If undervoltage is active or if
DRIVE ENABLE
DIS is asserted, the high and
low-side drivers are turned off.
COMMON WITH
ALL PHASES
ADJUSTABLE
TURN-ON
DELAY
VDD
16
xHB
xHI
5
10ns
DELAY
UNDERVOLTAGE
DETECTOR
DIS 10
VDD 20
UVLO
RFSH
LEVEL
SHIFTER
17 xHO
8
9
*The charge pump is
permanently disabled
in the HIP4086A.
DELAY DISABLE
18 xHS
REFRESH
PULSE
COMMON
WITH ALL
PHASES
COMMON WITH
ALL PHASES
VDD
xLI
RDEL
4
7
ADJUSTABLE
TURN-ON
DELAY
21 xLO
COMMON WITH
ALL PHASES
2µs Delay
6
VSS
100mV
If the voltage on RDEL is less than 100mV, the
turn-on delay timers are disabled and the high and
low-side drivers can be turned on simultaneously.
FIGURE 3. BLOCK DIAGRAM
Truth Table
INPUT
ALI, BLI, CLI
X
X
1
0
0
1
AHI, BHI, CHI
X
X
X
0
1
0
UV
X
1
0
0
0
0
DIS
1
X
0
0
0
0
RDEL
X
X
>100mV
X
X
<100mV
OUTPUT
ALO, BLO, CLO
0
0
1
0
0
1
AHO, BHO, CHO
0
0
0
1
0
1
NOTE: X signifies that input can be either a “1” or “0”.
FN4220 Rev 1.00
January 12, 2017
Page 2 of 17
HIP4086, HIP4086A
Pin Configuration
HIP4086, HIP4086A
(24 LD PDIP, SOIC)
TOP VIEW
BHB
1
BHI
2
BLI
3
ALI
4
AHI
5
VSS
6
RDEL
7
UVLO
8
RFSH
9
DIS
10
CLI
11
CHI
12
24
BHO
23
BHS
22
BLO
21
ALO
20
VDD
19
CLO
18
AHS
17
AHO
16
AHB
15
CHS
14
CHO
13
CHB
Pin Descriptions
PIN NUMBER
16
1
13
18
23
15
5
2
12
SYMBOL
AHB
BHB
CHB
(xHB)
AHS
BHS
CHS
(xHS)
AHI
BHI
CHI
(xHI)
DESCRIPTION
High-Side Bias Connections. One external bootstrap diode and one capacitor are required for
each. Connect cathode of bootstrap diode and positive side of bootstrap capacitor to each xHB
pin.
High-Side Source Connections. Connect the sources of the high-side power MOSFETs to these
pins. The negative side of the bootstrap capacitors are also connected to these pins.
High-Side Logic Level Inputs. Logic at these three pins controls the three high-side output drivers,
AHO (Pin 17), BHO (Pin 24) and CHO (Pin 14). When xHI is low, xHO is high. When xHI is high,
xHO is low. Unless the dead time is disabled by connecting RDEL (Pin 7) to ground, the low-side
input of each phase will override the corresponding high-side input on that phase - see
“Truth
Table” on page 2.
If RDEL is tied to ground, dead time is disabled and the outputs follow the
inputs with no shoot-through protection. DIS (Pin 10) also overrides the high-side inputs. xHI can
be driven by signal levels of 0V to 15V (no greater than V
DD
).
Low-Side Logic Level Inputs. Logic at these three pins controls the three low-side output drivers
ALO (Pin 21), BLO (Pin 22) and CLO (Pin 19). If the upper inputs are grounded then the lower
inputs control both xLO and xHO drivers, with the dead time set by the resistor at RDEL (Pin 7).
DIS (Pin 10) high level input overrides xLI, forcing all outputs low. xLI can be driven by signal
levels of 0V to 15V (no greater than V
DD
).
Ground. Connect the sources of the low-side power MOSFETs to this pin.
Delay Time Set Point. Connect a resistor from this pin to V
DD
to set timing current that defines
the dead time between drivers - see
Figure 19 on page 10.
All drivers turn off with minimal
delay, RDEL resistor prevents shoot-through by delaying the turn-on of all drivers. When RDEL is
tied to VSS, both upper and lowers can be commanded on simultaneously. While not necessary
in most applications, a decoupling capacitor of 0.1µF or smaller may be connected between
RDEL and VSS.
Undervoltage Set Point. A resistor can be connected between this pin and VSS to program the
undervoltage set point - see
Figure 20 on page 10.
With this pin not connected, the under
voltage disable is typically 6.6V. When this pin is tied to VDD, the under voltage disable is
typically 6.2V.
Refresh Pulse Setting. An external capacitor can be connected from this pin to VSS to increase
the length of the start up refresh pulse - see
Figure 18 on page 9.
If this pin is not connected, the
refresh pulse is typically 1.5µs.
4
3
11
ALI
BLI
CLI
(xLI)
VSS
RDEL
6
7
8
UVLO
9
RFSH
FN4220 Rev 1.00
January 12, 2017
Page 3 of 17
HIP4086, HIP4086A
Pin Descriptions
(Continued)
PIN NUMBER
10
SYMBOL
DIS
DESCRIPTION
Disable Input. Logic level input that when taken high sets all six outputs low. DIS high overrides
all other inputs. With DIS low, the outputs are controlled by the other inputs. DIS can be driven
by signal levels of 0V to 15V (no greater than V
DD
).
High-Side Outputs. Connect to the gates of the high-side power MOSFETs in each phase.
17
24
14
20
21
22
19
NOTE: x = A, B or C.
AHO
BHO
CHO
(xHO)
VDD
ALO
BLO
CLO
(xLO)
Positive Supply. Decouple this pin to VSS (Pin 6).
Low-Side Outputs. Connect the gates of the low-side power MOSFETs to these pins.
Ordering Information
PART NUMBER
(Note
3)
HIP4086AB (Note
1)
HIP4086ABZ (Notes
1, 2)
HIP4086APZ (Note
2)
PART
MARKING
HIP4086AB
HIP4086ABZ
HIP4086APZ
TEMP RANGE
(°C)
-40 to +125
-40 to +125
-40 to +125
-40 to +125
CHARGE
PUMP
Yes
Yes
Yes
No
PACKAGE
24 Ld SOIC
24 Ld SOIC (RoHS Compliant)
24 Ld PDIP (RoHS Compliant)
24 Ld SOIC (RoHS Compliant)
PKG.
DWG. #
M24.3
M24.3
E24.3
M24.3
HIP4086AABZ (Notes
1, 2)
HIP4086AABZ
HIP4086DEMO1Z
NOTES:
HIP4086 Demonstration Board
1. Add “T”, suffix for 1k unit tape and reel option. Please refer to
TB347
for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for
HIP4086, HIP4086A.
For more information on MSL, please see Technical
Brief
TB363.
FN4220 Rev 1.00
January 12, 2017
Page 4 of 17
HIP4086, HIP4086A
Absolute Maximum Ratings
(Note
7)
Thermal Information
Thermal Resistance (Typical)
JA
(°C/W)
JC
(°C/W)
SOIC Package (Notes
4, 6)
. . . . . . . . . . . . .
75
22
SOIC Package HIP4086AABZ (Notes
5, 6)
51
22
PDIP* Package (Notes
4, 6)
. . . . . . . . . . . .
70
29
Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Operating Junction Temp Range . . . . . . . . . . . . . . . . . . . .-40°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see
TB493
*Pb-free PDIPs can be used for through-hole wave solder processing only.
They are not intended for use in Reflow solder processing applications.
Supply Voltage, V
DD
Relative to GND. . . . . . . . . . . . . . . . . . . . . -0.3V to 16V
Logic Inputs (xLI, xHI) . . . . . . . . . . . . . . . . . . . . . (GND - 0.3V) to V
DD
+ 0.3V
Voltage on xHS . . . . . . . . . . . . . . -6V (Transient) to 85V (-40
°
C to +150
°
C)
Voltage on xHB . . . . . . . . . . . . . . . . . . . . . . . . . . . . (V
xHS
- 0.3V) to V
xHS
+V
DD
Voltage on xLO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (V
SS
- 0.3V) to V
DD
+0.3V
Voltage on xHO . . . . . . . . . . . . . . . . . . . . . . . . . . . (V
xHS
- 0.3V) to V
xHB
+0.3V
Phase Slew Rate (on xHS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V/ns
Maximum Recommended Operating
Conditions
Supply Voltage, V
DD
Relative to GND. . . . . . . . . . . . . . . . . . . . . . . 7V to 15V
Logic Inputs (xLI, xHI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to VDD
Voltage on xHB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VxHS + VDD
Voltage on xHS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to 80V
Ambient Temperature Range . . . . . . . . . . . . . . . . . . . . . . .-40°C to +125°C
Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . .-40°C to +150°C
RDEL range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10kΩ to 100kΩ
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4.
JA
is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief
TB379
for details.
5.
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
TB379
for details.
6. For
JC
, the “case temp” location is taken at the package top center.
7. Replace x with A, B, or C.
V
DD
= V
xHB
= 12V, V
SS
= V
xHS
= 0V, R
DEL
= 20k, R
UV
=
,
Gate Capacitance (C
GATE
) = 1000pF, unless
otherwise specified. Boldface limits apply across the operating junction temperature range, -40°C to +150°C.
T
J
= +25°C
PARAMETER
SUPPLY CURRENTS
V
DD
Quiescent Current
V
DD
Operating Current
xHB On Quiescent Current
xHB Off Quiescent Current
xHB Operating Current
xHB, xHS Leakage Current
Charge Pump, HIP4086 Only, (Note
8)
Q
PUMP
Output Voltage
Q
PUMP
Output Current
UNDERVOLTAGE PROTECTION
V
DD
Rising Undervoltage Threshold
V
DD
Falling Undervoltage Threshold
Minimum Undervoltage Threshold
R
UV
open
R
UV
open
R
UV
= V
DD
6.2
5.75
5
7.1
6.6
6.2
8.0
7.5
6.8
6.1
5.6
4.8
8.1
7.6
6.9
V
V
V
No Load
V
xHS
= 12V, V
xHB
= 22V
11
40
12.5
100
14.6
160
10
-
14.75
185
V
µA
xHI = 5V, xLI = 5V (HIP4086)
xHI = 5V, xLI = 5V (HIP4086A)
f = 20kHz, 50% Duty Cycle (HIP4086)
f = 20kHz, 50% Duty Cycle (HIP4086A)
xHI = 0V (HIP4086)
xHI = 0V (HIP4086A)
xHI = V
DD
(HIP4086)
xHI = V
DD
(HIP4086A)
f = 20kHz, 50% Duty Cycle (HIP4086)
f = 20kHz, 50% Duty Cycle (HIP4086A)
V
xHS
= 80V, V
xHB
= 93V
2.7
2.3
5.4
3.1
-
-
0.6
0.8
0.7
0.8
7
3.4
2.8
8.25
4.0
40
90
0.8
1.0
0.9
0.9
30
5.1
3.1
13
4.6
110
115
1.3
1.2
1.3
1.1
45
1.96
1.8
4
2.7
-
-
0.5
0.7
-
-
-
5.3
3.3
13.5
5.1
140
225
1.4
1.25
2.0
1.25
50
mA
mA
mA
mA
µA
µA
mA
mA
mA
mA
µA
TEST CONDITIONS
MIN
(Note
9)
TYP
MAX
(Note
9)
T
J
= -40°C TO +150°C
MIN
(Note
9)
MAX
(Note
9)
UNIT
DC Electrical Specifications
FN4220 Rev 1.00
January 12, 2017
Page 5 of 17
查看更多>
参数对比
与HIP4086ABT相近的元器件有:HIP4086AB、HIP4086EVAL、HIP4086AABZT、HIP4086ABZT。描述及对比如下:
型号 HIP4086ABT HIP4086AB HIP4086EVAL HIP4086AABZT HIP4086ABZT
描述 IC DRIVER MOSFET N-CH 3PH 24SOIC IC DRIVER 3-PHASE FET 24-SOIC EVALUATION BOARD GP HIP4086 IC DVR MOSFET N-CH 3PHASE 24SOIC IC DRIVER 3PHASE 80V 0.5A 24SOIC
Brand Name Intersil Intersil - - Intersil
零件包装代码 PDIP, SOIC PDIP, SOIC - - PDIP, SOIC
针数 24, 24 24, 24 - - 24, 24
Reach Compliance Code unknown not_compliant - - compliant
其他特性 JUNCTION TEMPERATURE FOR TEST JUNCTION TEMPERATURE FOR TEST - - JUNCTION TEMPERATURE FOR TEST
高边驱动器 YES YES - - YES
接口集成电路类型 HALF BRIDGE BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER - - HALF BRIDGE BASED MOSFET DRIVER
JESD-30 代码 R-PDSO-G24 R-PDSO-G24 - - R-PDSO-G24
功能数量 3 3 - - 1
端子数量 24 24 - - 24
最高工作温度 125 °C 125 °C - - 125 °C
最低工作温度 -40 °C -40 °C - - -40 °C
标称输出峰值电流 1.7 A 1.7 A - - 1.1 A
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY - - PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR - - RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE - - SMALL OUTLINE
认证状态 Not Qualified Not Qualified - - Not Qualified
表面贴装 YES YES - - YES
技术 MOS MOS - - MOS
温度等级 AUTOMOTIVE AUTOMOTIVE - - AUTOMOTIVE
端子形式 GULL WING GULL WING - - GULL WING
端子位置 DUAL DUAL - - DUAL
断开时间 0.1 µs 0.1 µs - - 0.1 µs
接通时间 0.1 µs 0.1 µs - - 0.1 µs
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