protection triggers an external SCR to crowbar the input
supply. The HIP6004E monitors the current by using the
r
DS(ON)
of the upper MOSFET which eliminates the need for
a current sensing resistor.
FN4997
Rev 3.00
November 10, 2015
Features
• Drives two N-Channel MOSFETs
• Operates from +5V or +12V Input
• Simple single-loop control design
- Voltage-mode PWM control
• Fast transient response
- High-bandwidth error amplifier
- Full 0% to 100% Duty Ratio
• Excellent output voltage regulation
-
1%
Over Line Voltage and Temperature
• 5-Bit digital-to-analog output
Voltage Selection
- 25mV binary steps . . . . . . . . . . . 1.05V
DC
to 1.825V
DC
• Power good output voltage monitor
• Overvoltage and overcurrent fault monitors
- Does not require extra current sensing element,
Uses MOSFET’s r
DS(ON)
• Small Converter Size
- Constant Frequency Operation
- 200kHz Free-Running Oscillator Programmable from
50kHz to over 1MHz
• Pb-free available
Applications
• VRM8.5 modules for Pentium III and Other
Microprocessors
• High-Power DC-DC Regulators
• Low-Voltage Distributed Power Supplies
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
Pinout
HIP6004E
TOP VIEW
VSEN
OCSET
SS
VID25mV
VID0
VID1
VID2
VID3
COMP
1
2
3
4
5
6
7
8
9
20 RT
19 OVP
18 VCC
17 LGATE
16 PGND
15 BOOT
14 UGATE
13 PHASE
12 PGOOD
11 GND
FB 10
FN4997 Rev 3.00
November 10, 2015
Page 1 of 14
HIP6004E
Ordering Information
PART NUMBER
HIP6004ECBZ
(See Note)
HIP6004ECVZ
(See Note)
No longer available or
supported, recommended replacement
HIP6004ECBZ
*Add “-T” suffix to part number for tape and reel packaging.
NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which is compatible with
both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of
Maximum storage temperature range . . . . . . . . . . . -65
o
C to 150
o
C
Maximum lead temperature (soldering 10s) . . . . . . . . . . . . . 300
o
C
(lead tips only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
JA
is measured with the component mounted on a high-effective thermal conductivity test board in free air. See Tech Brief TB379 for details.