HLMP-HD57
5 mm Standard Oval
Precision Optical Performance Red LED
Data Sheet
Description
This Precision Optical Performance Oval LED is specifi-
cally designed for Full Color/Video and Passenger Infor-
mation Signs. The Oval shaped radiation pattern and high
luminous intensity ensure that this device is excellent
for wide field of view outdoor applications where a wide
viewing angle and readability in sunlight are essential.
This lamp has very smooth, matched radiation patterns
ensuring consistent color mixing in full color applica-
tions, message uniformity across the viewing angle of
the sign. High efficiency LED material is used in this lamp:
Aluminium Indium Gallium Phosphide (AlInGaP) for Red
Color. The higher performance AlInGaP II is used.
The package epoxy contains both UV-A and UV-B inhibi-
tors to reduce the effects of long term exposure to direct
sunlight.
Features
•
Well defined spatial radiation pattern
•
High brightness material
•
Red AlInGaP 630 nm
•
Tinted and diffused
•
Typical viewing angle 40°x100°
Benefits
•
Viewing angle designed for wide field of view
applications
•
Superior performance for outdoor environments
Applications
•
Full color signs
•
Commercial outdoor advertising
Package Dimensions
1.0 MAX.
(0.039)
10.85 ± 0.50
(0.427 ± 0.019)
1.50 ± 0.15
(0.059 ± 0.006)
0.70 MAX.
(0.028)
5.20
(0.204)
0.50 ± 0.10 SQ. TYP.
(0.020 ± 0.004)
NOTE:
MEASURED AT BASE OF LENS.
3.80
(0.150)
2.54
(0.10)
7.00
(0.275)
24.00 MIN.
(0.945)
1.00 MIN.
(0.039)
NOTES:
1. DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE ± 0.25 mm UNLESS OTHERWISE NOTED.
Device Selection Guide
Color and
Dominant
Wavelength
λ
d
(nm) Typ.
Red 630
Luminous
Intensity
Iv (mcd) at
20 mA Min.
680
Luminous
Intensity
Iv (mcd) at
20 mA Max.
1900
Tinting
Type
Red
Part Number
HLMP-HD57-NR0xx
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength,
λ
d
, is derived from the Chromaticity Diagram and represents the color of the lamp.
4. Tolerance for luminous intensity is ± 15%.
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Options
00: Bulk Packaging
zz: Flexi-bin; Ammo Packs
Color Bin Selections
0: No Color Bin Limitation
Maximum Intensity Bin
0: No Iv Bin Limitation
Minimum Intensity Bin
Refer to Device Selection Guide
Color
D: 630 nm Red
Package
H: 5 mm Oval 40º x 100º
Note: Please refer to AB 5337 for complete information about part numbering system.
Absolute Maximum Ratings at T
A
= 25˚C
Parameter
DC Forward Current
[1]
Peak Pulsed Forward Current
[]
Average Forward Current
Power Dissipation
Reverse Voltage
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Notes:
1. Derate linearly as shown in Figure 3.
. Duty Factor 30%, Frequency 1 KHz.
Value
50 mA
100 mA
30 mA
10 mW
5 V (I
R
= 100 µA)
130˚C
–40˚C to +100˚C
–40˚C to +10˚C
Electrical/Optical Characteristics
T
A
= 25˚C
Parameter
Forward Voltage
Reverse Voltage
Capacitance
Thermal Resistance
Symbol
V
F
V
R
C
Rθ
J-PIN
Min.
5
40
40
6
630
639
634
pF
˚C/W
nm
nm
Typ.
.
Max.
.4
Units
V
Test Conditions
I
F
= 0 mA
I
R
= 100 µA
V
F
= 0, f = 1 MHz
LED Junction-to-Cathode
Lead
I
F
= 0 mA
Peak of Wavelength of
Spectral Distribution at
I
F
= 0 mA
Wavelength Width at
Spectral Distribution
1
/
Power
Point at I
F
= 0 mA
Emitted luminous power/
Emitted radiant power
I
F
= 0 mA
Luminous Flux/Electrical Power
I
F
= 0 mA
Dominant Wavelength
[1]
λ
d
Peak Wavelength
λ
p
Spectral Halfwidth
∆λ
1/
η
v
j
V
ηe
17
nm
Luminous Efficacy
[]
Luminous Flux
Luminous Efficiency
[3]
155
1300
30
lm/W
mlm
lm/W
Notes:
1. The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp.
. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = Iv/η
v
where Iv is the luminous intensity in candelas and
η
v
is
the luminous efficacy in lumens/watt.
3.
η
e
=
j
V
/ I
F
x V
F
, where
j
V
is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.
MAXIMUM FORWARD CURRENT - mA
MAX.
-
1.0
RELATIVE INTENSITY
(NORMALIZED AT 20 mA)
2.5
2.0
1.5
1.0
0.5
0
60
50
40
30
20
10
0
RELATIVE INTENSITY
0.5
0
550
600
650
700
0
10
20
30
40
50
Figure 1. Relative intensity vs. wavelength.
HLMP-HD57 fig 1
Figure 2. Relative luminous intensity vs. forward
current.
HLMP-HD57 fig 2
3
I
F
WAVELENGTH – nm
FORWARD CURRENT – mA
0
20
40
60
80
100
T
A
- AMBIENT TEMPERATURE -
o
C
Figure 3. Forward current vs. ambient
temperature.
50
I
F
– FORWARD CURRENT – mA
40
30
20
10
0
1.0
RELATIVE INTENSITY
0
0.5
1.0
1.5
2.0
2.5
3.0
0.5
0
-90
-70
-50
-30
-10
10
30
50
70
90
V
F
– FORWARD VOLTAGE – V
ANGLE – DEGREES
Figure 4. Forward current vs. forward voltage.
HLMP-HD57 fig 4
Figure 5. Spatial radiation pattern-minor axis.
HLMP-HD57 fig 5
1.0
Intensity Bin Limits
(mcd at 20 mA)
Bin Name
N
P
Q
R
RELATIVE INTENSITY
0.5
Min.
680
880
1150
1500
Max.
880
1150
1500
1900
0
-90
-70
-50
-30
-10
10
30
50
70
90
Tolerance will be ± 15% of these limits.
Note:
1. Bin categories are established for classifi-
cation of products. Products may not be
available in all bin categories.
ANGLE – DEGREES
Figure 6. Spatial radiation pattern-major axis.
HLMP-HD57 fig 6
10
RELATIVE LIGHT OUTPUT
(NORMALIZED AT T
J
= 25°C
1
0.1
-40
-20
0
20
40
60
80
100
120
T
J
- JUNCTION TEMPERATURE - °C
Figure 7. Relative Light Output vs Junction Temperature
4
Precautions:
Lead Forming:
•
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
•
For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
•
If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 50°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED during
soldering process might cause premature failure to the LED due to
delamination.
Avago Technologies LED configuration
Soldering and Handling:
•
Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
•
LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
1.59mm
CATHODE
Note: Electrical connection between bottom surface of LED die and
AllnGaP Device
the lead frame is achieved through conductive paste.
•
Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
•
At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
•
If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
•
Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size
Diagonal
Plated through
hole diameter
•
ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 114 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
•
Recommended soldering condition:
Wave
Soldering
[1, 2]
Manual Solder
Dipping
Pre-heat temperature
Preheat time
Peak temperature
Dwell time
105 °C Max.
60 sec Max
250 °C Max.
3 sec Max.
-
-
260 °C Max.
5 sec Max
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.636 mm
(0.025 inch)
0.707 mm
(0.028 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
•
Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
•
Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
