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HLMP-PM00-N0000

Single Color LED, Green, Untinted Nondiffused, T-3/4, 1.78mm, PLASTIC PACKAGE-2

器件类别:光电子/LED    光电   

厂商名称:HP(Keysight)

厂商官网:http://www.semiconductor.agilent.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
HP(Keysight)
包装说明
PLASTIC PACKAGE-2
Reach Compliance Code
unknown
颜色
GREEN
颜色@波长
Blue-Green
配置
SINGLE
最大正向电流
0.03 A
最大正向电压
4.1 V
JESD-609代码
e0
透镜类型
UNTINTED NONDIFFUSED
标称发光强度
200.0 mcd
安装特点
AXIAL MOUNT
功能数量
1
端子数量
2
最高工作温度
85 °C
最低工作温度
-40 °C
光电设备类型
SINGLE COLOR LED
总高度
2.16 mm
包装方法
BULK
峰值波长
523 nm
最大反向电压
5 V
形状
CYLINDRICAL
尺寸
1.78 mm
表面贴装
NO
T代码
T-3/4
端子面层
Tin/Lead (Sn/Pb)
视角
85 deg
文档预览
Agilent HLMP-PB00-N0000,
HLMP-PM00-N0000, HLMP-QB00-S0000,
HLMP-QM00-S0000 Subminiature
Blue and Green InGaN LED Lamps
Data Sheet
Features
• Subminiature flat top package
Ideal for backlighting and light
piping applications
• Subminiature dome package
Nondiffused dome for high
brightness
• Colors: 468 nm blue, 525 nm green
• Ideal for space limited
applications
• Axial leads
• Available with lead configura-
tions for surface mount and
through hole PC board mounting
Applications
• Consumer
• Industrial
• Computer peripheral
• Communication
Description
Flat Top Package
Lead Configurations
The HLMP-Pxxx flat top lamps use
an untinted, nondiffused, truncated
lens to provide a wide radiation
pattern that is necessary for use in
backlighting applications. The flat
top lamps are also ideal for use as
emitters in light pipe applications.
Dome Package
The HLMP-Qxxx dome lamps use an
untinted, nondiffused lens to
provide a high luminous intensity
within a narrow radiation pattern.
All these devices are made by
encapsulating LED chip on axial
lead frames to form molded
epoxy subminiature lamps. A
variety of package configuration
options is available. These
include special surface mount
lead configurations, gull wing,
yoke lead, or Z-bend. Right angle
lead bend at 2.54 mm (0.100
inch) and 5.08 mm (0.200 inch)
center spacing are available for
through hole mounting. For more
information refer to Standard
SMT and Through Hole Lead
Bend Options for Subminiature
Lamps data sheet.
CAUTION:
HLMP-xB00 and HLMP-xM00 LEDs are Class 2 ESD sensitive. Please observe appropriate
precautions during handling and processing. Refer to Agilent Application Note AN-1142 for addi-
tional details.
Package Dimensions
(A)
Flat Top Lamps
0.50 (0.020) REF.
1.40 (0.055)
1.65 (0.065)
11.68 (0.460)
10.67 (0.420)
BOTH SIDES
CATHODE
ANODE
1.65 (0.065)
DIA.
1.91 (0.075)
0.20 (0.008) MAX.
0.46 (0.018)
0.56 (0.022)
0.25 (0.010) MAX.*
NOTE 2
2.21 (0.087)
1.96 (0.077)
1.14 (0.045)
1.40 (0.055)
0.63 (0.025)
0.38 (0.015)
2.44 (0.096)
1.88 (0.074)
0.79 (0.031) MAX.
0.18 (0.007)
0.23 (0.009)
2.08 (0.082)
2.34 (0.092)
CATHODE
STRIPE
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. PROTRUDING SUPPORT TAB IS CONNECTED TO CATHODE LEAD.
* REFER TO FIGURE 1 FOR DESIGN CONCERNS.
2
Package Dimensions
B) Domed Lamps
0.50 (0.020) REF.
11.68 (0.460)
10.67 (0.420)
BOTH SIDES
CATHODE
ANODE
1.65 (0.065)
DIA.
1.91 (0.075)
0.20 (0.008) MAX.
0.46 (0.018)
0.56 (0.022)
0.25 (0.010) MAX.*
NOTE 2
0.18 (0.007)
0.23 (0.009)
2.03 (0.080)
1.78 (0.070)
2.21 (0.087)
1.96 (0.077)
0.76 (0.030) R.
0.89 (0.035)
0.94 (0.037)
1.24 (0.049)
2.92 (0.115)
MAX.
0.63 (0.025)
0.38 (0.015)
2.08 (0.082)
2.34 (0.092)
0.79 (0.031)
0.53 (0.021)
CATHODE
STRIPE
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. PROTRUDING SUPPORT TAB IS CONNECTED TO CATHODE LEAD.
* REFER TO FIGURE 1 FOR DESIGN CONCERNS.
3
CATHODE
TAB
NO. ANODE DOWN.
YES. CATHODE DOWN.
Figure 1. Proper right angle mounting to a PC board to prevent protruding cathode tab from shorting to anode connection.
Device Selection Guide
Part Number
HLMP-PB00-N0000
HLMP-PM00-N0000
HLMP-QB00-S0000
HLMP-QM00-S0000
Color
Blue
Green
Blue
Green
Viewing Angle 2θ
1/2
85˚
20˚
Package Description
Flat Top, Nondiffused, Untinted
Domed, Nondiffused, Untinted
Package Outline
A
B
Ordering Information
HLMX-XXXX-X X X X X
Packaging
Option
Color Bin
Selection
Max. Iv Bin
Min. Iv Bin
4 x 4 Prod.
Part
Number
4
Absolute Maximum Ratings at T
A
= 25˚C
Parameter
Peak Forward Current
DC Forward Current
[1]
Power Dissipation
Reverse Voltage (I
R
= 10
µA)
Operating Temperature Range
Storage Temperature Range
LED Junction Temperature
Lead Soldering Temperature
[1.6 mm (0.063 in.) from body]
SMT Reflow Soldering Temperatures
Convective Reflow
Vapor Phase Reflow
Note:
1. Derate linearly as shown in Figure 5.
Value
90 mA
30 mA
110 mW
5V
–40˚C to +85˚C
–55˚C to +100˚C
110˚C
260˚C for 5 seconds
235˚C Peak, above 183˚C for 90 seconds
215˚C for 3 minutes
Optical Characteristics at T
A
= 25˚C
Luminous
Intensity
Iv (mcd) @
I
F
= 20 mA
Min.
Typ.
25
60
25
200
160
290
160
690
Peak
Wavelength
λ
PEAK
(nm)
Typ.
470
523
470
523
Color,
Dominant
Wavelength
λ
d
(nm)
Typ.
468
525
468
525
Spectral
Halfwidth
∆λ
1/2
(nm)
Typ.
26
36
26
36
Viewing
Angle 2
θ
1/2
Degrees
Typ.
85
85
20
20
Luminous
Efficacy
η
v
(lm/W)
70
500
70
500
Part Number
HLMP-PB00-N0000
HLMP-PM00-N0000
HLMP-QB00-S0000
HLMP-QM00-S0000
Electrical Characteristics at T
A
= 25˚C
Forward Voltage
V
F
(Volts) @ I
F
= 20 mA
Typ.
Max.
3.7
4.1
3.7
4.1
3.7
4.1
3.7
4.1
Reverse Breakdown
V
R
(Volts) @ I
R
= 100
µA
Min.
5
5
5
5
Capacitance C (pF),
V
F
= 0, f = 1 MHz
Typ.
52
52
52
52
Thermal Resistance
J-PIN
(˚C/W)
Typ.
170
170
170
170
Part Number
HLMP-PB00-N0000
HLMP-PM00-N0000
HLMP-QB00-S0000
HLMP-QM00-S0000
5
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