HLMP-Yxxx
T-1 (3 mm) AlInGaP LED Lamps
Data Sheet
Description
This family of T-1 lamps is widely used in general purpose
indicator and back lighting applications. The optical
design is balanced to yield superior light output and wide
viewing angles. Several intensity choices are available in
each color for increased design flexibility.
Features
x
High luminous intensity output
x
Low power consumption
x
Choice of bright colors
– Deep Red
– Red
– Red-Orange
– Orange
– Amber
– Green
x
High efficiency
x
Versatile mounting on PCB or panel
x
I.C. Compatible/low current requirement
x
Popular T-1 diameter package
x
Reliable and rugged
x
RoHS compliant
Applications
x
Status indicator
x
Backlighting front panels
x
Light pipe sources
x
Lighted switches
Package Dimension
5.2
0.205
4.1 ± 0.2
0.161 ± 0.008
3.8 3.5
3.1 ± 0.2
0.15 0.138 0.122 ± 0.008
0.45 x 0.4 TYP
(0.018 x 0.016)
Notes:
1. All dimensions are in millimeter (inches).
2. Tolerance is ±0.25mm (.010) unless otherwise stated.
3. Lead spacing is measured where the leads emerge from the package.
1.0 (MAX)
0.04
24.0 (MIN)
0.945
CATHODE
1.0 (MIN)
0.04
2.54
0.1
Selection Guide
Luminous Intensity, Iv (mcd) @ 20 mA
Color
Deep Red
Red
Red-Orange
Yellow Orange
Part Number
HLMP-Y651-G00xx
HLMP-Y601-J00xx
HLMP-Y951-K00xx
HLMP-Y901-J00xx
HLMP-Y902-J00xx
Package Description
Untinted, Non-diffused
Untinted, Non-diffused
Untinted, Non-diffused
Untinted, Non-diffused
Tinted, Non-diffused
Untinted, Non-diffused
Tinted, Non-diffused
Min.
140
240
310
240
240
140
110
Typ.
300
680
680
680
680
400
240
Max.
Viewing Angle,
2T½ (°)
45
Amber
Green
HLMP-Y701-G00xx
HLMP-Y802-F00xx
Part Numbering System
HLMP - Y x x x - x x x xx
Mechanical Options
00: Bulk
Color Bin Options
0: Full Color Bin Distribution
Maximum IV Bin Options
0: Open (no max. limit)
Others: Please refer to the IV Bin Table
Minimum IV Bin Options
Please refer to the IV Bin Table
2
Absolute Maximum Ratings at T
A
= 25°C
Parameter
DC Forward Current
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
Reverse Voltage (I
R
= 100PA)
Junction Temperature
Power Dissipation
Storage Temperature Range
Operating Temperature Range
Solder Temperature
HLMP-Yxxx
20
60
5
110
48
-40 to +100
-40 to +100
260°C 5 sec
Units
mA
mA
V
°C
mW
°C
°C
Electrical /Optical Characteristic at T
A
= 25°C
Description
Peak Wavelength
Symbol
O
PEAK
Part Number
HLMP-Y651
HLMP-Y601
HLMP-Y951
HLMP-Y90x
HLMP-Y701
HLMP-Y802-F00xx
HLMP-Y651
HLMP-Y601
HLMP-Y951
HLMP-Y90x
HLMP-Y701
HLMP-Y802-F00xx
HLMP-Y651
HLMP-Y601
HLMP-Y951
HLMP-Y90x
HLMP-Y701
HLMP-Y802-F00xx
HLMP-Y651
HLMP-Y601
HLMP-Y951
HLMP-Y90x
HLMP-Y701
HLMP-Y802-F00xx
Min.
Typ.
652
633
622
611
595
575
Max.
Units
nm
Test Conditions
Measurement at peak
Dominant Wavelength
O
d
635.0
620.0
610.0
599.5
582.0
564.5
638.0
627.0
615.0
605.0
592.0
572.0
15
15
17
17
15
11
2.0
2.0
2.0
2.0
2.0
2.1
646.0
635.0
620.0
610.5
597.0
576.5
nm
Note 1
Spectrum Half Width
'O
nm
Forward Voltage
V
F
2.2
2.2
2.2
2.4
2.2
2.4
V
I
F
= 20mA
(Figure 1)
Notes:
1. The dominant wavelength,
O
d
, is derived from the Chromaticity Diagram and represents the color of the lamp.
3
20
18
16
14
12
10
8
6
4
2
0
1
RELATIVE
LUMINOUS
INTENSITY
(NORMALIZED AT 20mA)
2
2.5
GREEN
0.8
0.6
0.4
0.2
0
FORWARD
CURRENT-mA
DEEP
RED, RED
RED-ORANGE,
AMBER
YELLOW-ORANGE
0
0.5
1
1.5
FORWARD
VOLTAGE-V
0
5
10
15
DC
FORWARD
CURRENT
-
mA
20
Figure 1. Forward Current vs. Forward Voltage.
25
20
15
10
5
0
0
10
20
30
40
50
60
70
80
90
100 110
Figure 2. Relative Luminous Intensity vs. Forward Current.
1
NORMALIZED
INTENSITY
0.75
0.5
0.25
0
FORWARD
CURRENT
-
mA
-90
-60
AMBIENT
TEMPERATURE - °C
Figure 3. Ambient Temperature vs. Maximum DC Forward Current.
-30
0
30
60
ANGULAR DISPLACEMENT
-
DEGREES
90
Figure 4. Relative Luminous Intensity vs. Angular Displacement for
HLMP-Y651, HLMP-Y601, HLMP-Y951 and HLMP-Y701.
1
NORMALIZED
INTENSITY
0.75
0.5
0.25
0
-90
-60
-30
0
30
60
ANGULAR DISPLACEMENT
-
DEGREES
90
Figure 6. Wavelength vs. Relative Luminous Intensity.
Figure 5. Relative Luminous Intensity vs. Angular Displacement for
HLMP-Y90x and HLMP-Y80x.
4
Intensity Bin Limits
Intensity Range (mcd)
Bin
F
G
H
J
K
L
M
N
P
Q
Precautions:
Assembly method:
Max.
140.0
180.0
240.0
310.0
400.0
520.0
680.0
880.0
1150.0
1500
Min.
110.0
140.0
180.0
240.0
310.0
400.0
520.0
680.0
880.0
1150
This product is not meant for auto-insertion.
Lead Forming:
x
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
x
If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
x
During lead forming, the leads should be bent at a
point at least 3mm from the base of the lens. Do not
use the base of the lead frame as a fulcrum during
forming. Lead forming must be done before soldering
at normal temperature.
x
It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Tolerance for each bin limit is 15%.
Color Bin Limits Table
Lambda (nm)
Color
Red-Orange
Category #
1
2
3
Min.
610.5
613.5
616.5
599.5
602.0
604.5
607.5
584.5
587.0
589.5
592.0
594.5
573.5
570.5
567.5
564.5
Max.
613.5
616.5
619.5
602.0
604.5
607.5
610.5
587.0
589.5
592.0
594.5
597.0
576.5
573.5
570.5
567.5
Yellow-
Orange
2
3
4
5
Amber
1
2
4
6
7
Green
2
3
4
5
Tolerance for each bin limit is ±1.0 nm.
5
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