MLO
TM
Hi-Q Inductors
The Multilayer Organic Hi-Q Inductor is a low profile organic based
inductor that can support mobile communications, satellite applications,
GPS, matching networks, and collision avoidance. The MLO
TM
Hi-Q
Inductor series of components are based on AVX’s patented multilayer
organic technology (US patent 6,987,307 and 7,439,840). MLO
TM
Hi-Q
Inductors incorporate very low loss organic materials and low profile
copper which allow for high Q and high stability over frequency. MLO
TM
Hi-
Q Inductors are surface mountable and are expansion matched to FR4
printed wiring boards. MLO
TM
Hi-Q Inductors utilize fine line high density
interconnect technology thereby allowing for tight tolerance control and
high repeatability. Reliability testing is performed to JEDEC and mil
standards. Finishes are available in RoHS compliant Sn.
APPLICATIONS
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Mobile communications
Satellite Applications
GPS
Collision Avoidance
Wireless LAN’s
FEATURES
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High Q
High SRF
High Frequency
Low DC Resistance
Surface Mountable
0402 Case Size
RoHS Compliant Finishes
Available in Tape and Reel
SURFACE MOUNT
ADVANTAGES
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Inherent Low Profile
Excellent Solderability
Low Parasitics
Better Heat Dissipation
Expansion Matched to PCB
HOW TO ORDER
HLQ
Type
HLQ = High Q
02
Size
02 = 0402
XXX
Inductance
Expressed in nH
(2 significant digits + number of zeros)
for values <10nH,
letter R denotes decimal point.
Example:
22nH = 220
4.7nH = 4R7
X
Tolerance
B = ±0.1nH
C = ±0.2nH
H = ±3%
T
Termination
Sn100
TR
Packaging
Tape & Reel
DIMENSIONS
R
T
QUALITY INSPECTION
Finished parts are 100% tested for electrical parameters and
visual characteristics.
TERMINATION
L
W
mm (inches)
RoHS compliant Sn finish.
OPERATING TEMPERATURE
-55ºC to +125ºC
R
0.125±0.050
(0.005±0.002)
L
1.00±0.10
(0.040±0.004)
W
0.58±0.075
(0.023±0.003)
T
0.35±0.10
(0.014±0.004)
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MLO
TM
Hi-Q Inductors
0402 ELECTRICAL SPECIFICATIONS
L (nH)
450MHz
0.8
0.9
1
1.1
1.2
1.3
1.5
1.6
1.8
2
2.2
2.4
2.7
3
3.3
3.6
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
30
32
Available
Inductance Tolerance
B = ±0.1nH, C = ±0.2nH
H = ±3%
±0.1nH, ±0.2nH
±0.1nH, ±0.2nH
±0.1nH, ±0.2nH
±0.1nH, ±0.2nH
±0.1nH, ±0.2nH
±0.1nH, ±0.2nH
±0.1nH, ±0.2nH
±0.1nH, ±0.2nH
±0.1nH, ±0.2nH
±0.1nH, ±0.2nH
±0.1nH, ±0.2nH
±0.1nH, ±0.2nH
±0.1nH, ±0.2nH
±0.1nH, ±0.2nH
±0.1nH, ±0.2nH
±0.1nH, ±0.2nH
±0.1nH, ±0.2nH
±0.1nH, ±0.2nH
±0.1nH, ±0.2nH
±3%
±3%
±3%
±3%
±3%
±3%
±3%
±3%
±3%
±3%
Q min
450MHz
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
17
SRF min
(GHz)
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
6
5
4
4
3
3
3
2
2
Rdc max
(mΩ)
100
100
100
100
110
130
150
150
160
180
200
200
250
300
340
350
400
480
500
600
800
1000
1100
1200
1500
1900
2100
2200
2200
Idc max
(mA)
350
350
330
330
330
330
330
300
300
245
245
245
245
225
225
200
200
195
170
160
130
120
110
110
110
95
95
85
85
Specifications based on performance of component assembled properly on printed circuit board with 50Ω nominal impedance.
Idc max: Maximum 15ºC rise in component temperature over ambient.
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