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HM62256BP-50

Standard SRAM, 32KX8, 50ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28

器件类别:存储    存储   

厂商名称:Hualon Microelectronics Corp

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器件参数
参数名称
属性值
厂商名称
Hualon Microelectronics Corp
零件包装代码
DIP
包装说明
DIP,
针数
28
Reach Compliance Code
unknow
ECCN代码
EAR99
最长访问时间
50 ns
JESD-30 代码
R-PDIP-T28
长度
36.705 mm
内存密度
262144 bi
内存集成电路类型
STANDARD SRAM
内存宽度
8
功能数量
1
端口数量
1
端子数量
28
字数
32768 words
字数代码
32000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
32KX8
输出特性
3-STATE
可输出
YES
封装主体材料
PLASTIC/EPOXY
封装代码
DIP
封装形状
RECTANGULAR
封装形式
IN-LINE
并行/串行
PARALLEL
认证状态
Not Qualified
座面最大高度
6.35 mm
最小待机电流
2 V
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
NO
技术
CMOS
温度等级
COMMERCIAL
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
宽度
15.24 mm
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参数对比
与HM62256BP-50相近的元器件有:HM62256BWM-50、HM62256BJ-50、HM62256BM-50、HM62256BP-70、HM62256BWM-70、HM62256BK-50、HM62256BJ-70、HM62256BK-70、HM62256BM-70。描述及对比如下:
型号 HM62256BP-50 HM62256BWM-50 HM62256BJ-50 HM62256BM-50 HM62256BP-70 HM62256BWM-70 HM62256BK-50 HM62256BJ-70 HM62256BK-70 HM62256BM-70
描述 Standard SRAM, 32KX8, 50ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Standard SRAM, 32KX8, 50ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, SOP-28 Standard SRAM, 32KX8, 50ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 Standard SRAM, 32KX8, 50ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOP-28 Standard SRAM, 32KX8, 70ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, SOP-28 Standard SRAM, 32KX8, 50ns, CMOS, PDIP28, 0.300 INCH, SKINNY, PLASTIC, DIP-28 Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 Standard SRAM, 32KX8, 70ns, CMOS, PDIP28, 0.300 INCH, SKINNY, PLASTIC, DIP-28 Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOP-28
厂商名称 Hualon Microelectronics Corp Hualon Microelectronics Corp Hualon Microelectronics Corp Hualon Microelectronics Corp Hualon Microelectronics Corp Hualon Microelectronics Corp Hualon Microelectronics Corp Hualon Microelectronics Corp Hualon Microelectronics Corp Hualon Microelectronics Corp
零件包装代码 DIP SOIC SOJ SOIC DIP SOIC DIP SOJ DIP SOIC
包装说明 DIP, SOP, SOJ, SOP, DIP, SOP, DIP, SOJ, DIP, SOP,
针数 28 28 28 28 28 28 28 28 28 28
Reach Compliance Code unknow unknown unknow unknow unknow unknow unknow unknow unknow unknow
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 50 ns 50 ns 50 ns 50 ns 70 ns 70 ns 50 ns 70 ns 70 ns 70 ns
JESD-30 代码 R-PDIP-T28 R-PDSO-G28 R-PDSO-J28 R-PDSO-G28 R-PDIP-T28 R-PDSO-G28 R-PDIP-T28 R-PDSO-J28 R-PDIP-T28 R-PDSO-G28
内存密度 262144 bi 262144 bit 262144 bi 262144 bi 262144 bi 262144 bi 262144 bi 262144 bi 262144 bi 262144 bi
内存集成电路类型 STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
内存宽度 8 8 8 8 8 8 8 8 8 8
功能数量 1 1 1 1 1 1 1 1 1 1
端口数量 1 1 1 1 1 1 1 1 1 1
端子数量 28 28 28 28 28 28 28 28 28 28
字数 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words
字数代码 32000 32000 32000 32000 32000 32000 32000 32000 32000 32000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8 32KX8
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
可输出 YES YES YES YES YES YES YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP SOP SOJ SOP DIP SOP DIP SOJ DIP SOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最小待机电流 2 V 2 V 2 V 2 V 2 V 2 V 2 V 2 V 2 V 2 V
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO YES YES YES NO YES NO YES NO YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 THROUGH-HOLE GULL WING J BEND GULL WING THROUGH-HOLE GULL WING THROUGH-HOLE J BEND THROUGH-HOLE GULL WING
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
长度 36.705 mm 18.05 mm - 17.9 mm 36.705 mm 18.05 mm 35.675 mm - 35.675 mm 17.9 mm
座面最大高度 6.35 mm 2.9 mm - 2.65 mm 6.35 mm 2.9 mm 5.334 mm - 5.334 mm 2.65 mm
端子节距 2.54 mm 1.27 mm - 1.27 mm 2.54 mm 1.27 mm 2.54 mm - 2.54 mm 1.27 mm
宽度 15.24 mm 8.4 mm - 7.5 mm 15.24 mm 8.4 mm 7.62 mm - 7.62 mm 7.5 mm
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