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HM624100HLJP-12

4M High Speed SRAM (1-Mword x 4-bit)

器件类别:存储    存储   

厂商名称:Hitachi (Renesas )

厂商官网:http://www.renesas.com/eng/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
零件包装代码
SOJ
包装说明
SOJ, SOJ32,.44
针数
32
Reach Compliance Code
unknow
ECCN代码
3A991.B.2.A
最长访问时间
12 ns
I/O 类型
COMMON
JESD-30 代码
R-PDSO-J32
JESD-609代码
e0
长度
20.71 mm
内存密度
4194304 bi
内存集成电路类型
CACHE SRAM
内存宽度
4
功能数量
1
端子数量
32
字数
1048576 words
字数代码
1000000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
1MX4
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
SOJ
封装等效代码
SOJ32,.44
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
并行/串行
PARALLEL
电源
5 V
认证状态
Not Qualified
座面最大高度
3.76 mm
最小待机电流
2 V
最大压摆率
0.18 mA
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
J BEND
端子节距
1.27 mm
端子位置
DUAL
宽度
10.16 mm
Base Number Matches
1
文档预览
HM624100H Series
4M High Speed SRAM (1-Mword
×
4-bit)
ADE-203-789D (Z)
Rev. 1.0
Sep. 15, 1998
Description
The HM624100H is a 4-Mbit high speed static RAM organized 1-Mword
×
4-bit. It has realized high speed
access time by employing CMOS process (4-transistor + 2-poly resistor memory cell) and high speed circuit
designing technology. It is most appropriate for the application which requires high speed and high density
memory, such as cache and buffer memory in system. The HM624100H is packaged in 400-mil 32-pin SOJ
for high density surface mounting.
Features
Single 5.0 V supply : 5.0 V
±
10 %
Access time 10/12/15 ns (max)
Completely static memory
No clock or timing strobe required
Equal access and cycle times
Directly TTL compatible
All inputs and outputs
Operating current : 200/180/160 mA (max)
TTL standby current : 70/60/50 mA (max)
CMOS standby ccurrent : 5 mA (max)
: 1.2 mA (max) (L-version)
Data retension current : 0.8 mA (max) (L-version)
Data retension voltage : 2.0 V (min) (L-version)
Center V
CC
and V
SS
type pinout
HM624100H Series
Ordering Information
Type No.
HM624100HJP-10
HM624100HJP-12
HM624100HJP-15
HM624100HLJP-10
HM624100HLJP-12
HM624100HLJP-15
Access time
10 ns
12 ns
15 ns
10 ns
12 ns
15 ns
Package
400-mil 32-pin plastic SOJ (CP-32DB)
Pin Arrangement
HM624100HJP/HLJP Series
A0
A1
A2
A3
A4
CS
I/O1
V
CC
V
SS
I/O2
WE
A5
A6
A7
A8
A9
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
(Top view)
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A19
A18
A17
A16
A15
OE
I/O4
V
SS
V
CC
I/O3
A14
A13
A12
A11
A10
NC
2
HM624100H Series
Pin Description
Pin name
A0 to A19
I/O1 to I/O4
CS
OE
WE
V
CC
V
SS
NC
Function
Address input
Data input/output
Chip select
Output enable
Write enable
Power supply
Ground
No connection
Block Diagram
(LSB)
A1
A17
A7
A11
A16
A2
A6
A5
(MSB)
Internal
voltage
generater
Row
decoder
Memory matrix
256 rows
×
16 columns
×
256 blocks
×
4 bit
(4,194,304 bits)
V
CC
V
SS
CS
I/O1
.
.
.
I/O4
Column I/O
Input
data
control
Column decoder
CS
A10 A8 A9 A19 A12 A13 A14 A0 A18 A15 A3 A4
WE
CS
(LSB)
(MSB)
OE
CS
3
HM624100H Series
Operation Table
CS
H
L
L
L
L
Note:
OE
×
H
L
H
L
×:
H or L
WE
×
H
H
L
L
Mode
Standby
Output disable
Read
Write
Write
V
CC
current
I
SB
, I
SB1
I
CC
I
CC
I
CC
I
CC
I/O
High-Z
High-Z
Dout
Din
Din
Ref. cycle
Read cycle (1) to (3)
Write cycle (1)
Write cycle (2)
Absolute Maximum Ratings
Parameter
Supply voltage relative to V
SS
Voltage on any pin relative to V
SS
Power dissipation
Operating temperature
Storage temperature
Storage temperature under bias
Symbol
V
CC
V
T
P
T
Topr
Tstg
Tbias
Value
–0.5 to +7.0
–0.5*
1
to V
CC
+0.5*
2
1.0
0 to +70
–55 to +125
–10 to +85
Unit
V
V
W
°C
°C
°C
Notes: 1. V
T
(min) = –2.0 V for pulse width (under shoot)
8 ns
2. V
T
(max) = V
CC
+ 2.0 V for pulse width (over shoot)
8 ns
Recommended DC Operating Conditions
(Ta = 0 to +70°C)
Parameter
Supply voltage
Symbol
V
CC
*
3
V
SS
*
4
Input voltage
V
IH
V
IL
Notes: 1.
2.
3.
4.
Min
4.5
0
2.2
–0.5*
1
Typ
5.0
0
Max
5.5
0
V
CC
+ 0.5*
2
0.8
Unit
V
V
V
V
V
IL
(min) = –2.0 V for pulse width (under shoot)
8 ns
V
IH
(max) = V
CC
+ 2.0 V for pulse width (over shoot)
8 ns
The supply voltage with all V
CC
pins must be on the same level.
The supply voltage with all V
SS
pins must be on the same level.
4
HM624100H Series
DC Characteristics
(Ta = 0 to +70°C, V
CC
= 5.0 V
±
10 %, V
SS
= 0V)
Parameter
Input leakage current
Output leakage current
Operation power
supply current
Symbol Min
II
LI
I
II
LO
I
10 ns cycle I
CC
Typ*
1
Max
2
2
200
Unit
µA
µA
mA
Test conditions
Vin = V
SS
to V
CC
Vin = V
SS
to V
CC
Min cycle
CS
= V
IL
, lout = 0 mA
Other inputs = V
IH
/V
IL
12 ns cycle I
CC
15 ns cycle I
CC
Standby power supply
current
10 ns cycle I
SB
12 ns cycle I
SB
15 ns cycle I
SB
I
SB1
0.1
180
160
70
60
50
5
mA
f = 0 MHz
V
CC
CS
V
CC
- 0.2 V,
(1) 0 V
Vin
0.2 V or
(2) V
CC
Vin
V
CC
- 0.2 V
mA
Min cycle,
CS
= V
IH
,
Other inputs = V
IH
/V
IL
—*
2
Output voltage
V
OL
V
OH
2.4
0.1*
2
1.2*
2
0.4
V
V
I
OL
= 8 mA
I
OH
= –4 mA
Notes: 1. Typical values are at V
CC
= 5.0 V, Ta = +25°C and not guaranteed.
2. This characteristics is guaranteed only for L-version.
Capacitance
(Ta = +25°C, f = 1.0 MHz)
Parameter
Input capacitance*
1
Input/output capacitance*
1
Note:
Symbol
Cin
C
I/O
Min
Typ
Max
6
8
Unit
pF
pF
Test conditions
Vin = 0 V
V
I/O
= 0 V
1. This parameter is sampled and not 100% tested.
5
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参数对比
与HM624100HLJP-12相近的元器件有:HM624100H、HM624100HJP-15、HM624100HLJP-10、HM624100HJP-10、HM624100HJP-12、HM624100HLJP-15。描述及对比如下:
型号 HM624100HLJP-12 HM624100H HM624100HJP-15 HM624100HLJP-10 HM624100HJP-10 HM624100HJP-12 HM624100HLJP-15
描述 4M High Speed SRAM (1-Mword x 4-bit) 4M High Speed SRAM (1-Mword x 4-bit) 4M High Speed SRAM (1-Mword x 4-bit) 4M High Speed SRAM (1-Mword x 4-bit) 4M High Speed SRAM (1-Mword x 4-bit) 4M High Speed SRAM (1-Mword x 4-bit) 4M High Speed SRAM (1-Mword x 4-bit)
零件包装代码 SOJ - SOJ SOJ SOJ SOJ SOJ
包装说明 SOJ, SOJ32,.44 - SOJ, SOJ32,.44 SOJ, SOJ32,.44 SOJ, SOJ32,.44 SOJ, SOJ32,.44 SOJ, SOJ32,.44
针数 32 - 32 32 32 32 32
Reach Compliance Code unknow - unknow unknow unknow unknow unknow
最长访问时间 12 ns - 15 ns 10 ns 10 ns 12 ns 15 ns
I/O 类型 COMMON - COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 R-PDSO-J32 - R-PDSO-J32 R-PDSO-J32 R-PDSO-J32 R-PDSO-J32 R-PDSO-J32
长度 20.71 mm - 20.71 mm 20.71 mm 20.71 mm 20.71 mm 20.71 mm
内存密度 4194304 bi - 4194304 bi 4194304 bi 4194304 bi 4194304 bi 4194304 bi
内存集成电路类型 CACHE SRAM - CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM
内存宽度 4 - 4 4 4 4 4
功能数量 1 - 1 1 1 1 1
端子数量 32 - 32 32 32 32 32
字数 1048576 words - 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
字数代码 1000000 - 1000000 1000000 1000000 1000000 1000000
工作模式 ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C - 70 °C 70 °C 70 °C 70 °C 70 °C
组织 1MX4 - 1MX4 1MX4 1MX4 1MX4 1MX4
输出特性 3-STATE - 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOJ - SOJ SOJ SOJ SOJ SOJ
封装等效代码 SOJ32,.44 - SOJ32,.44 SOJ32,.44 SOJ32,.44 SOJ32,.44 SOJ32,.44
封装形状 RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE - SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
并行/串行 PARALLEL - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
电源 5 V - 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 3.76 mm - 3.76 mm 3.76 mm 3.76 mm 3.76 mm 3.76 mm
最小待机电流 2 V - 4.5 V 2 V 4.5 V 4.5 V 2 V
最大压摆率 0.18 mA - 0.16 mA 0.2 mA 0.2 mA 0.18 mA 0.16 mA
最大供电电压 (Vsup) 5.5 V - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V - 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V - 5 V 5 V 5 V 5 V 5 V
表面贴装 YES - YES YES YES YES YES
技术 CMOS - CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL - COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 J BEND - J BEND J BEND J BEND J BEND J BEND
端子节距 1.27 mm - 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 DUAL - DUAL DUAL DUAL DUAL DUAL
宽度 10.16 mm - 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm
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