HMC226
/
226E
v03.0505
Typical Applications
• 900 MHz ISM/Cellular
• 1900 MHz PCS
The HMC226 / HMC226E is ideal for:
Functional Diagram
D
E
U
IN
T
N
O
T
C
C
S
U
I
D
D
O
R
P
Features
Low Insertion Loss: 0.6 dB
Ultra Small Package: SOT26
High Input P1dB: +35 to +38 dBm
High Input IP3: +55 to +61 dBm
GaAs MMIC +3V SOT26 TRANSMIT /
RECEIVE SWITCH, DC - 2 GHz
s
ign
Positive Control: 0/+3V to 0/+8V
s
e
D
Designer’s Kit
Included in the HMC-DK005
New
for
ded
General Description
men
m
eco
The HMC226 & HMC226E are low-cost SPDT swit-
ot R
ches in 6-lead SOT26 packages for use in transmit-
N
receive applications which require very low distortion
at high signal power levels. The device can control
signals from DC to 2.0 GHz and is especially suited
for 450 MHz, 900 MHz, and 1.8 - 2 GHz applications
with 0.5 to 0.8 dB loss. The design provides excep-
tional P1dB and intermodulation performance; a
+35 dBm 1dB compression point and +55 dBm
third order intercept at +3 volt bias. RF1 and RF2
are reflective opens when “Off”. On-chip circuitry
allows single positive supply operation at very low DC
current with control inputs compatible with CMOS
and most TTL logic families.
11
SWITCHES - SPDT T/R - SMT
Electrical Specifi cations,
T
A
= +25° C, Vctl = 0/+3 Vdc, 50 Ohm System
Parameter
Frequency
DC - 0.5 GHz
DC - 1.0 GHz
DC - 2.0 GHz
DC - 0.5 GHz
DC - 1.0 GHz
DC - 2.0 GHz
DC - 0.5 GHz
DC - 1.0 GHz
DC - 2.0 GHz
0/5V Control
0/3V Control
0/5V Control
0/3V Control
0.3 - 2.0 GHz
0.3 - 2.0 GHz
DC - 2.0 GHz
tRISE, tFALL (10/90% RF)
tON, tOFF (50% CTL to 10/90% RF)
70
140
ns
ns
23
17
12
23
21
14
34
31
Min.
Typ.
0.5
0.6
0.8
26
20
15
27
25
18
38
35
61
55
Max.
0.8
0.9
1.2
Units
dB
dB
dB
dB
dB
dB
dB
dB
dB
dBm
dBm
dBm
dBm
Insertion Loss
Isolation
Return Loss
Input Power for 1 dB Compression
Input Third Order Intercept
(Two-Tone Input Power = +26 dBm Each Tone)
Switching Characteristics
11 - 2
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC226
/
226E
v03.0505
Insertion Loss vs Temperature
0
-0.5
INSERTION LOSS (dB)
-1
-1.5
-2
-2.5
-3
0
D
E
U
IN
T
N
O
T
C
C
S
U
I
D
D
O
R
P
Isolation
0
-10
ISOLATION (dB)
-20
+25 C
+85 C
-40 C
GaAs MMIC +3V SOT26 TRANSMIT /
RECEIVE SWITCH, DC - 2 GHz
0.5
1
1.5
FREQUENCY (GHz)
New
for
ded
men
com
t Re
No
-40
-50
2
2.5
0
0.5
1
40
INPUT COMPRESSION (dBm)
-30
s
ign
Des
1.5
2
2.5
FREQUENCY (GHz)
Return Loss
0
-5
RETURN LOSS (dB)
-10
-15
-20
-25
-30
-35
0
0.5
1
1.5
2
2.5
FREQUENCY (GHz)
RFC
RF1,RF2
Input 0.1 and 1.0 dB Compression
vs. Control Voltage @ 900 MHz
11
SWITCHES - SPDT T/R - SMT
11 - 3
35
30
25
0.1 dB Compression
1 dB Compression
20
2
3
4
5
6
7
8
Control Voltage (Vdc)
Compression vs.
Control Voltage @ 900 MHz
Control
Input
(Vdc)
+3
+5
+7
Input Power for 0.1 dB
Compression
(dBm)
30
33
35
Input Power for 1.0 dB
Compression
(dBm)
35
38
38.5
Truth Table
*Control Input Voltage Tolerances are ± 0.2 Vdc.
Control Input*
A
(Vdc)
0
+3
0
+5
0
+8
B
(Vdc)
+3
0
+5
0
+8
0
Control Current
Ia
(uA)
-5
5
-10
10
-45
45
Ib
(uA)
5
-5
10
-10
45
-45
Signal Path State
RF to
RF1
ON
OFF
ON
OFF
ON
OFF
RF to
RF2
OFF
ON
OFF
ON
OFF
ON
Caution: Do not operate continuously at power levels >1 dB com-
pression and do not “hot switch” power levels greater than +23dBm
(V
CTL
= +3Vdc).
Absolute Maximum Ratings
Max. Input Power
(V
CTL
= 0/+3V)
Storage Temperature
Operating Temperature
ESD Sensitivity (HBM)
0.05 GHz
0.5 - 2 GHz
+27 dBm
+36 dBm
-0.2 to +12 Vdc
-65 to +150 °C
-40 to +85 °C
Class 1A
Control Voltage Range (A & B)
DC Blocks are required at ports RFC, RF1 and RF2.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC226
/
226E
v03.0505
Outline Drawing
D
E
U
IN
T
N
O
T
C
C
S
U
I
D
D
O
R
P
New
for
ded
men
com
t Re
No
NOTES:
GaAs MMIC +3V SOT26 TRANSMIT /
RECEIVE SWITCH, DC - 2 GHz
s
ign
Des
11
SWITCHES - SPDT T/R - SMT
Package Information
Part Number
HMC226
HMC226E
Package Body Material
Low Stress Injection Molded Plastic
RoHS-compliant Low Stress Injection Molded Plastic
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS].
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Lead Finish
Sn/Pb Solder
100% matte Sn
MSL Rating
MSL1
MSL1
[1]
Package Marking
[3]
H226
XXXX
226E
XXXX
[2]
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Typical Application Circuit
Notes:
1. Set logic gate and switch Vdd = +3V to +5V and use
HCT series logic to provide a TTL driver interface.
2. Control inputs A/B can be driven directly with CMOS
logic (HC) with Vdd of 3 to 8 Volts applied to the CMOS
logic gates.
3. DC Blocking capacitors are required for each RF port as
shown. Capacitor value determines lowest frequency of
operation.
4. Highest RF signal power capability is achieved with V
set to +10V. The switch will operate properly (but at
lower RF power capability) at bias voltages down to +3V.
11 - 4
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC226
/
226E
v03.0505
Evaluation Circuit Board
D
E
U
IN
T
N
O
T
C
C
S
U
I
D
D
O
R
P
New
for
ded
men
com
t Re
No
s
ign
Des
GaAs MMIC +3V SOT26 TRANSMIT /
RECEIVE SWITCH, DC - 2 GHz
11
SWITCHES - SPDT T/R - SMT
11 - 5
List of Materials for Evaluation PBC 101675
[1]
Item
J1 - J3
J4 - J7
C1 - C3
U1
PCB
[2]
Description
PCB Mount SMA RF Connector
DC Pin
330 pF capacitor, 0402 Pkg.
HMC226 / HMC226E T/R Switch
101659 Evaluation PCB
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: Rogers 4350
The circuit board used in the final application should
be generated with proper RF circuit design tech-
niques. Signal lines at the RF port should have 50
ohm impedance and the package ground leads and
package bottom should be connected directly to the
ground plane similar to that shown above. The eval-
uation circuit board shown above is available from
Hittite Microwave Corporation upon request.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
