To all our customers
Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corporation product best suited to the customer's application; they do not convey any
license under any intellectual property rights, or any other rights, belonging to Renesas Technology
Corporation or a third party.
2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any
third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corporation without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corporation
or an authorized Renesas Technology Corporation product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss
rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various
means, including the Renesas Technology Corporation Semiconductor home page
(http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams,
charts, programs, and algorithms, please be sure to evaluate all information as a total system before
making a final decision on the applicability of the information and products. Renesas Technology
Corporation assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device
or system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor
when considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be
exported under a license from the Japanese government and cannot be imported into a country other
than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corporation for further details on these materials or the products
contained therein.
HN58X25128I/HN58X25256I
Serial Peripheral Interface
128k EEPROM (16-kword
×
8-bit)
256k EEPROM (32-kword
×
8-bit)
Electrically Erasable and Programmable Read Only Memory
ADE-203-1371 (Z)
Preliminary
Rev. 0.0
Nov. 15, 2002
Description
HN58X25xxx Series is the Serial Peripheral Interface (SPI) EEPROM (Electrically Erasable and
Programmable ROM). It realizes high speed, low power consumption and a high level of reliability by
employing advanced MONOS memory technology and CMOS process and low voltage circuitry technology.
It also has a 64-byte page programming function to make it’s write operation faster.
Note: Hitachi’s serial EEPROM are authorized for using consumer applications such as cellular phones,
camcorders, audio equipments. Therefore, please contact Hitachi’s sales office before using
industrial applications such as automotive systems, embedded controllers, and meters.
Features
•
Single supply: 1.8 V to 5.5 V
•
Serial peripheral interface (SPI bus)
SPI mode 0 (0,0), 3 (1,1)
•
Clock frequency: 5 MHz (2.5 V to 5.5 V), 3 MHz (1.8 V to 5.5 V)
•
Power dissipation:
Standby: 3
µA
(max)
Active (Read): 5 mA (max)
Active (Write): 5 mA (max)
•
Automatic page write: 64-byte/page
•
Write cycle time: 5 ms (2.5 V min), 8 ms (1.8 V min)
•
Endurance: 10 Cycles
5
•
Data retention: 10 Years
Preliminary: The specifications of this device are subject to change without notice. Please contact your
nearest Hitachi’s Sales Dept. regarding specifications.
HN58X25128I/HN58X25256I
•
Small size packages: SOP-8pin and TSSOP-14pin
•
Shipping tape and reel
TSSOP-14pin : 2,000 IC/reel
SOP-8pin
: 2,500 IC/reel
•
Temperature range:
−40
to
+85 °C
Ordering Information
Type No.
HN58X25128FPI
HN58X25256FPI
HN58X25128TI
HN58X25256TI
Internal organization
128-kbit (16834
×
8-bit)
256-kbit (32768
×
8-bit)
128-kbit (16834
×
8-bit)
256-kbit (32768
×
8-bit)
1.8 V to 5.5 V
Operating voltage Frequency
1.8 V to 5.5 V
5 MHz
(2.5 V to 5.5 V)
3 MHz
(1.8 V to 5.5 V)
5 MHz
(2.5 V to 5.5 V)
3 MHz
(1.8 V to 5.5 V)
14-pin plastic
TSSOP (TTP-14D)
Package
150mil 8-pin plastic
SOP (FP-8DB)
Rev.0.0, Nov. 2002, page 2 of 27
HN58X25128I/HN58X25256I
Pin Arrangement
8-pin SOP
14-pin TSSOP
8
7
6
5
V
CC
S
Q
1
2
3
4
S
Q
NC
NC
NC
1
2
3
4
5
6
7
14
13
12
11
10
9
8
V
CC
HOLD
C
D
HOLD
NC
NC
NC
W
V
SS
(Top view)
W
V
SS
C
D
(Top view)
Pin Description
Pin name
C
D
Q
S
W
HOLD
V
CC
V
SS
Function
Serial clock
Serial data input
Serial data output
Chip select
Write protect
Hold
Supply voltage
Ground
Rev.0.0, Nov. 2002, page 3 of 27
