HPW Series
Mixed Signal & Power
Connectors
Product description
Mixed power & signal PCB connector
Approvals
Qualified at a system level on both civil and military
programs
Features
•
Rugged design
•
Signal & power contacts
•
High reliability contacts
Markets
Mil/Aero Space, Marine, Rail & Industrial
HPW PART NUMBER CONFIGURATOR
PERFORMANCE/SPECIFICATION
MATERIAL
Insulator
Contact pin & socket
Socket wires
Polyphenylene sulphide
Copper alloy
Beryllium copper
CURRENT RATING
INSULATION
MECHANICAL ENDURANCE
ENGAGEMENT/WITHDRAWAL FORCES
TEMPERATURE RANGE
Guides
Contact Plating
Contact Resistance
Stainless steel
MIL-G-45204 gold plate
Size 22:
Size 16:
11.0 milliohms maximum
4.5 milliohms maximum
VOLTAGE RATING
Size 22:
Size 16:
5 Amp
15 Amp
5 Gigohms minimum at 500Vdc
In excess of 2000 operations
0.42 N (1.5 oz) nominal per contact
-55°C to +125°C
400 V dc or ac peak nominal (@sealevel)
Size 22:
Size 16:
0.75 mm nominal
1.56 mm nominal
MALE PIN DIAMETER
JUNE
2007
1
HPW Series
ORDERING INFORMATION
H P W
0 6 3
S
M
M
C A
0 P 0
PREFIX
No. of CAVITIES
63, 92, 100, 107
CONTACT PLATING
U = See below
S = U Plating with tin dipped termination
CONTACT GENDER
M = Male
F = Female
CONTACT TERMINATION
0 = No contacts
C = Crimp bucket
X = Through board solder - 180°
B = Through board solder - 90°
M = Mixed
Note: not all combinations are available
STANDARD VARIATIONS
000 = Standard
0P0 = Back potting
Non Readable Code = Contact mix configuraion etc.
POLARISING/GUIDES
CA = Male jacking, polarised, free rotating
TA = Female jacking, polarised, vertical mount
NB = Male polarised, vertical mount
FE = Female polarised, vertical mount
FB = Female polarised, float mount
NC = Male polarised, transverse mount
FF = Female polarised, transverse mount
CONTACT PLATING FINISHES
Connector Finish
Ordering Code
Description
Component
Component Finish
Ordering Code
Conforms to
Plating
Thickness*
Socket
U
Gold Plate
-/9
MIL-G-45204
(Type II, Grade C,
Class 1)
MIL-G-45204
(Type II, Grade C,
Class 1)
1.27 µm gold plate
50 µin gold plate
minimum
1.27 µm gold plate
50 µin gold plate
minimum
Pin
-/7
*PLATING THICKNESS
These values apply to mating surfaces.
Dimensions are in mm
2
JUNE
2007
HPW Series
HPW STANDARD INSULATORS
63 WAY Male Half
14.95 MAX
(0.589”)
13.55 MAX
10.97 MAX
(0.267”)
(0.533”)
5.48 MAX
71.12 (2.800”)
79.85 MAX
(3.144”)
8.05 MAX
(0.317”)
63 WAY Female Half
9.00 MAX
(0.354”)
(0.216”)
13.55 MAX
(4.319”)
(0.533”)
Size 16 Cavities
3 plcs
Size 22 Cavities
60 plcs
71.12 (2.800”)
79.85 MAX
(3.144”)
92;107 WAY Male Halves
92 WAY Half
Size 16 Cavities
23 plcs
Size 22 Cavities
46 plcs
Size 16 Cavities
23 plcs
15.35 MAX
(0.604”)
(0.315”)
16.00 MAX
(0.394”)
130.56 (5.140”)
18.35 MAX
8.00 MAX
140.00 MAX
(5.512”)
(0.722”)
6.77 MAX
107 WAY Half
Size 16 Cavities
15 plcs
Size 22 Cavities
77 plcs
Size 16 Cavities
15 plcs
8.05 MAX
(0.317”)
130.56 (5.140”)
140.00 MAX
(5.512”)
92;107 WAY Female Halves
92 WAY Half
10.00 MAX
(0.394”)
20.00 MAX
130.56 (5.140”)
10.00 MAX
139.90 MAX
(5.508”)
107 WAY Half
130.56 (5.140”)
139.90 MAX
(5.508”)
Dimensions are in mm
(0.787”)
(0.630”)
JUNE
2007
3
HPW Series
HPW STANDARD INSULATORS / TOOLING
100 WAY Male Half
14.95 MAX
(0.589”)
8.05 MAX
Size 16 Cavities
14 plcs
Size 22 Cavities
72 plcs
Size 16 Cavities
14 plcs
(0.317”)
13.35 MAX
10.97 MAX
9.00 MAX
(0.354”)
(0.533”)
91.50
(3.602”)
91.50
(3.602”)
192.15 MAX
(7.565”)
100 WAY Female Half
5.48 MAX
(0.216”)
JUNE
91.50
(3.602”)
91.50
(3.602”)
192.18 MAX
(7.566”)
Tooling
Crimp Tool
(Mil Specification)
Size 22
Contacts
Size 16
Contacts
Positioner
Extraction Tool
Insertion Tool
M22520/2-01
HPW-501
HPW-521
Pair of Non-ferrous
Tweezers
Pair of Non-ferrous
Tweezers
M22520/1-01
HPW-502
HPW-512
Dimensions are in mm
4
7.48 MAX
(0.294”)
2007
14.97 MAX
(0.589”)
(0.425”)
HPW Series
HPW STANDARD PCB TERMINATIONS
MALE HALF
TERMINATION B: Through Board Solder 90°
Size 16
63 Way & 100 Way
92 Way & 107 Way
Size 22
63 Way
92 Way & 107 Way
100 Way
TERMINATION X: Through Board Solder 180°
Size 16
63 Way & 100 Way
92 Way & 107 Way
Size 22
63 Way
92 Way & 107 Way
100 Way
3.80
2.80
3.80
2.80
Dimensions are in mm
JUNE
2007
5
模拟与混合信号
