creat by ART
HS3AB - HS3MB
3.0AMPS High Efficient Surface Mount Rectifiers
SMB/DO-214AA
Features
Glass passivated junction chip.
For surface mounted application
Low forward voltage drop
Low profile package
Built-in stain relief, ideal for automatic
placement
Fast switching for high efficiency
High temperature soldering:
260℃/10 seconds at terminals
Meet MSL level 1, per J-STD-020D,
lead free maximum peak of 260℃
Plastic material used carries Underwriters
Laboratory Classification 94V-0
Green compound with suffix "G" on packing
code & prefix "G" on datecode
Mechanical Data
Case: Molded plastic
Terminal: Pure tin plated, lead free
Polarity: Indicated by cathode band
Packing: 12mm tape per EIA STD RS-481
Weight: 0.093 grams
Ordering Information (example)
Part No.
HS3AB
Package
SMB
Packing
850 / 7" REEL
Packing code
R5
Packing code
(Green)
R5G
Maximum Ratings and Electrical Characteristics
Rating at 25
℃
ambient temperature unless otherwise specified.
Parameter
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
Peak Forward Surge Current, 8.3 ms Single Half Sine-wave
Superimposed on Rated Load (JEDEC method)
Maximum Instantaneous Forward Voltage (Note 1)
@3A
Maximum Reverse Current @ Rated VR
T
A
=25
℃
T
A
=125
℃
Symbol
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
I
R
Trr
Cj
R
θjA
T
J
T
STG
HS
3AB
50
35
50
HS
3BB
100
70
100
HS
3DB
200
140
200
HS
3FB
300
210
300
3
HS
3GB
400
280
400
HS
3JB
600
420
600
HS
3KB
800
560
800
HS
3MB
1000
700
1000
Unit
V
V
V
A
A
100
1.0
10
250
50
80
60
- 55 to + 150
- 55 to + 150
75
50
O
1.3
1.7
V
uA
nS
pF
C/W
O
O
Maximum Reverse Recovery Time (Note 2)
Typical Junction Capacitance (Note 3)
Typical Thermal Resistance
Operating Temperature Range
Storage Temperature Range
Note 1: Pulse Test with PW=300 usec, 1% Duty Cycle
C
C
Note 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
Version:I13
RATINGS AND CHARACTERISTIC CURVES (HS3AB THRU HS3MB)
FIG.1 FORWARD CURRENT DERATING CURVE
3.5
3
AVERAGE FORWARD
CURRENT (A)
1000
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
2.5
INSTANTANEOUS REVERSE CURRENT (uA)
2
100
TA=125℃
1.5
1
RESISTIVE OR
INDUCTIVE LOAD
0.5
0
0
10
TA=25℃
25
50
75
100
125
150
175
LEAD TEMPERATURE (
o
C)
PEAK FORWARD SURGE URRENT
(A)
300
250
200
150
100
50
0
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
8.3mS Single Half Sine Wave
JEDEC Method
1
0.1
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
TA=25℃
FIG. 5 TYPICAL FORWARD CHARACTERISTICS
100
TA=25℃
INSTANTANEOUS FORWARD CURRENT (A)
1
10
100
1000
NUMBER OF CYCLES AT 60 Hz
175
150
125
CAPACITANCE (pF)
100
75
50
FIG. 4 TYPICAL JUNCTION CAPACITANCE
10
HS3AB-HS3DB
TA=25℃
HS3AB-HS3GB
1
HS3GB
HS3JB-HS3MB
25
0
0.1
1
10
REVERSE VOLTAGE (V)
100
1000
0.1
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
FORWARD VOLTAGE (V)
HS3JB-HS3MB
Version:I13
Ordering information
Part No.
HS3XB
(Note)
Package
SMB
SMB
Packing
850 / 7" REEL
3K / 13" REEL
Packing code
R5
R4
M4
Packing code
(Green)
R5G
R4G
M4G
3K / 13" Plastic REEL
SMB
Note: "x" is Device Code from "A" thru "B".
Tape & Reel specification
Reel Size Tape Size
7"
12mm
Reel Size Tape Size
13"
12mm
A
±2.0
178
A
max
330
B
±0.4
1.9
B
±0.5
2
C
+0.5;-0.2
13
C
±0.5
13
D
min
21
D
min
20.2
N
±1.0
62
N
±0.5
75
G
+0.8;-0
12.2
G
+2.0;-0
12.4
T
max
14.6
T
max
18.4
Unit (mm)
Suggested PAD Layout
Symbol
A
B
C
D
E
Unit(mm)
2.3
2.5
4.3
1.8
6.7
Version:I13
Dimensions
DIM.
A
B
C
D
E
F
G
H
I
Unit(mm)
Min
1.95
3.48
4.25
1.99
0.90
5.10
0.10
0.15
0.15
Max
2.10
3.73
4.75
2.61
1.41
5.30
0.20
0.31
0.31
Unit(inch)
Min
0.077
0.137
0.167
0.078
0.035
0.201
0.004
0.006
0.006
Max
0.083
0.147
0.187
0.103
0.056
0.209
0.008
0.012
0.012
Marking Diagram
P/N
G
YW
F=
= Specific Device Code
= Green Compound
= Date Code
Factory Code
Version:I13
FPGA/CPLD
