Amphenol
Amphenol
High Density HDB /HSB Connectors
3
3
TABLE OF CONTENTS
Amphenol High Density HDB
3
and HSB
3
Connectors
•
Table of Contents
.. . .. . .. . .. . .. . .. . .. . .. . .. . ..47
•
Introduction - Features, Options,
Performance
. . .. . .. . .. . .. . .. . .. . .. . .. . .. .
48, 49
HDB
3
•
•
•
•
HDB
3
Mother Board Connector
.. . .. . .. . .. . .. . ..50
HDB
3
Daughter Board Connector
.. . .. . .. . .. . ..51
HDB
3
I/O
Connector
. .. . .. . .. . .. . .. . .. . .. . .. . ..52
HDB
3
Stacker Connector..
. .. . .. . .. . .. . .. . .. . ..53
HSB
3
•
•
•
•
HSB
3
Mother Board Connector
.. . .. . .. . .. . .. . ..54
HSB
3
Daughter Board Connector.
.. . .. . .. . .. . ..55
HSB
3
Arrangements
. .. . .. . .. . .. . .. . .. . .. . .. . ..56
Recommended Board Layout -
HSB
3
Daughter Board..
. .. . .. . .. . .. . .. . .. . .. . ..57
•
Recommended Board Layout -
HSB
3
Mother Board
. .. . .. . .. . .. . .. . .. . .. . .. . ..58
• Hardware for both HDB
3
and HSB
3
Connectors
.. . .. . .. . .. . .. . .. . .. . .. . .. . .. . .. . ..59
HDB and HSB
3
Typical
LRM
3
Typical Markets: Markets:
•
•
•
•
Transportation
Military & Commercial Aviation
Medical Equipment
Military Vehicles
Military & Commercial Avionics
Missiles/Ordnance
C4ISR
• •
UAVs
C4ISR
• •
Naval
Space
• • High Definition Cameras
Radar
Amphenol
Aerospace
47
Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com
Amphenol
Aerospace
Introduction/
Pkg. Solutions/
Brush Contact
Amphenol
®
High Density HDB
3
and HSB
3
Connectors
INTRODUCTION: FEATURES & OPTIONS
AMPHENOL’S BRUSH CONTACT - THE SUPERIOR
CHOICE FOR BOARD LEVEL INTERCONNECTS
BRUSH CONTACT
New/Featured Product
Amphenol’s HDB
3
High Density Brush Series
with Tighter (.070 inch X .060 inch)
Staggered Grid Spacing
This new connector series of brush connectors incorpo-
rates a higher density contact pattern and lower mated
height than Amphenol’s standard low mating force
rectangular connectors. HDB
3
connectors utilize the
same durable and reliable B
3
brush contact in a tighter
.070” X .060” staggered grid pattern.
Options/ Hybrids - Fiber Optics/ Staggered/
Accessories Hi Speed/RF/Power
GEN-X
LRM (Line Replaceable Modules)
HDB
3
Advantages over Competitive
Connectors:
•
•
•
•
Higher density contact pattern
Uses less board space
Allows for shorter mated height
Provides the durability and performance of
the Brush contact
• Low cost
AMPHENOL HDB
3
COMPARED TO COMPETITION
Connector Features
Contact System
Durability, Mating Cycles
Contact Mating Forces (ounces)
Mother Board
Daughter Board
Connector Width
Mated Height, MB to 4th row of DB
Amphenol
HDB3
Brush
100,0000
1.5
.070 X .060
.070 X .060
.350
.680
Hypertronics
HPH
Hyperoloid
2,000
1.5
.075 X .075
.075 X .100
.443
.986
Airborn
RM4
Multiple strands of high tensile strength wire bundled together to
form brush-like contacts. See Brush Contact Technology section
of this catalog for further description.
CONVENTIONAL PIN AND SOCKET
CRIMP CONTACT
High Density
HSB
3
HDB
3
Hi Speed
Ruggedized
VME64x /
VITA 60, 66
Docking Conn./ Hybrids - Signal/Power/ Standard
Coax/Fiber Optics
Brush
Accessories/Install.
Low Mating Force MIL-DTL-55302
Pin & Socket
500
2.5
.075 X .070
.075 X .100
.400
.915
HIGH DENSITY STYLES
HDB
3
Daughter Board/Mother Board
HDB
3
Daughter
Board Connector
HDB
3
I/O
Connector
HDB
3
I/O
Connector
HDB
3
Mother
Board Connector
Rack & Panel
Brush
Ruggedized
HDB
3
Mother Board
Connector
HDB
3
Stacker
HDB
3
Stacker for Applications
that Need or Demand Parallel
Boards
HSB
3
High Speed
HSB
3
High Speed
Connectors
are Capable of 6.250
Gbps
Other
Rectangular
Interconnects
LMD/LMS
Rectangular
Interconnects
HDB
3
Mother Board Connector
48
Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com
Amphenol
®
High Density HDB
3
and HSB
3
Connectors
INTRODUCTION: FEATURES & PERFORMANCE
Amphenol
Aerospace
Introduction/
Pkg. Solutions/
Brush Contact
Staggered/ Hybrids - Fiber Optics/ Options/
GEN-X
Hi Speed/RF/Power Accessories
LRM (Line Replaceable Modules)
HBD
3
120 pin Mother Board and Daughter Board
HDB
3
& HSB
3
HIGH DENSITY CONNECTOR
PERFORMANCE:
Durability
Insertion/Extraction Force:
Operating Temperature:
Current Rating:
Insulation Resistance:
Dielectric Withstanding
Voltage:
100,000 mating cycles
1.5 ounce typical per contact
-65° to 125°C
2 amperes Hot swap 1 ampere
maximum (load dependent)
5 gigaohms minimum
750 volts, 60 hertz, rms @ Sea
Level, 250 volts, 60 hertz,
rms @ 70,000 feet elevation
MIL-STD-202, Method 208
48 Hours IAW MIL-STD-1344,
method 1001, test condition B
IAW MIL-STD-1344, method
1002, type II
4 hours in each of 3 mutually
perpendicular axes IAW MIL
STD-1344, method 2005, test
condition V, letter H
1 shock along each of three
mutually perpendicular axes
IAW MIL-STD-1344, method
2004,test condition G
Capable of up to 6.250 Gbps
(consult Amphenol for
arrangement)
HDB
3
Mother Board and Daughter Board Mated
Ruggedized
VME 64x/
VITA 60, 66
HDB
3
High Density
HSB
3
Hi Speed
Solderability:
Salt Fog:
Humidity:
Vibration:
HDB
3
& HSB
3
HIGH DENSITY CONNECTOR
FEATURES:
Polarization:
Keying:
Guide Pins
“D” shaped design
Optional keys offer 36 unique
keying combinations
Optional guide pins provide
additional alignment
Standard Hybrids - Signal/Power/ Docking Conn./
Brush
Coax/Fiber Optics
Accessories/Install.
Low Mating Force MIL-DTL-55302
Shock:
Radial Misalignment:
Capable of correcting up to a
020” initial radial misalignment
Angular Misalignment:
Capable of mating with up to a
2° initial angular misalignment
Data Rate (HSB
3
):
MATERIALS:
Insulator:
Contact: Wire:
Liquid crystal polymer, 30% glass
filled
Beryllium copper per ASTM B197;
finish is gold per ASTM B488 over
nickel per AMS-QQ-N-290
Brass similar to UNS C33500;
available finishes include gold per
MIL-G-45204, tin-lead per MIL-P-
81728 or tin per MIL-T-10727 (RoHS
Compliant)
Rack & Panel
Brush
Ruggedized
CUSTOM DESIGN AVAILABILITY:
LMD/LMS
Rectangular
Interconnects
Holder:
HSB
3
Hybrid Connector with Metal Shell
and RF Contacts supplied by SV Microwave*
* See more information on SMPM RF contacts in Other Rectangular Interconnects
Section, page 126. SMPM RF contacts can be supplied by Amphenol
SV Microwave. Phone: 561-840-1800
Website: www.svmicrowave.com
Other
Rectangular
Interconnects
Sleeve: Stainless steel per AMS-5514,
passivated IAW QQ-P-35 (Daughter-
board,
I/O
and Stacker connector)
Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com
49
Amphenol
Aerospace
Introduction/
Pkg. Solutions/
Brush Contact
Amphenol
®
High Density HDB
3
Mother Board Connector
DIMENSIONAL DRAWING & HOW TO ORDER
Mother Board
HDB
3
MOTHER BOARD - HOW TO ORDER
Mates with:
•
Daughter Board
•
I/O
•
Stacker
Daughter Board
Options/ Hybrids - Fiber Optics/ Staggered/
Accessories Hi Speed/RF/Power
GEN-X
LRM (Line Replaceable Modules)
1.
1.
Connector Type
HDB-M4
Designates HDB
3
Mother Board
2.
Number of
Contacts
-040
3.
Brush Wire
Plating
M
4.
Termination
24
5.
Contact Termination
Finish
2
6.
Less Hardware
(Purchased separately see
pg XX for hardware options)
HDB-M4
X
2.
Number of Contacts
Number of Dimension Dimension
Contacts
A
C
040
060
080
120
160
40
60
80
120
160
1.375
1.725
2.075
2.775
3.475
1.075
1.425
1.775
2.475
3.175
A
.335 MAX.
.150 ±.005
.350
.086 MIN. DIA.
THRU HOLE
(USE NO. 2 SCREW)
PIN 1
2
3
E ±.020
TYP.
C
Ruggedized
VME64x /
VITA 60, 66
3.
Brush Wire Plating
M
C
0.000050 Au Min. thick over Nickel
0.000020 Au Min. thick over Nickel
High Density
HSB
3
HDB
3
Hi Speed
Type
22
23
24
26
28
PCB, Straight, .016 Dia
PCB, Straight, .016 Dia
PCB, Straight, .016 Dia
PCB, Straight, .016 Dia
PCB, Straight, .016 Dia
A
.090 TYP.
.030 TYP.
Docking Conn./ Hybrids - Signal/Power/ Standard
Coax/Fiber Optics
Brush
Accessories/Install.
Low Mating Force MIL-DTL-55302
0.120
0.150
0.180
0.240
0.300
F
.195 MIN. HEX
.070 MIN DEEP
(USE 3/16 HEX HEAD)
Stickout
(Dim. E)
C
B
5.
Contact Termination Finish
2
Gold plated in accordance with
MIL-G-45204, Type II, .000030 Min.
thick Gold over .000050 Min. thick
Nickel
Tin plated in accordance with
ASTM B545, .00010 Min. thick
Matte Tin over .00010 Min. thick
Nickel
Tin-Lead plated in accordance with
SAE-AMS-P-81728, .00010 Min.
thick Tin-Lead over .00010 Min.
thick Copper
6.
Hardware
X
Less Hardware
Hardware is purchased
separately (see page 59 for
hardware options).
5
6
Rack & Panel
Brush
Ruggedized
Mother Board Layout
C
.110 ±.005
.205
.005
M
LMD/LMS
Rectangular
Interconnects
.030
.070
.035
FINISHED HOLE SIZE PER
CUSTOMER STANDARDS FOR
.016 PCB TAIL
A
Other
Rectangular
Interconnects
.060
50
Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com
E
D
4.
Termination
.016 ±.001
TYP.
1
6
5
4
Amphenol
®
High Density HDB
3
Daughter Board Connector
DIMENSIONAL DRAWING & HOW TO ORDER
HDB
3
DAUGHTER BOARD - HOW TO ORDER
Mates with:
•
Mother Board
Amphenol
Aerospace
Introduction/
Pkg. Solutions/
Brush Contact
1.
1.
Connector Type
HDB-D4
Designates HDB Daughter Board
3
2.
Number of
Contacts
-040
3.
Brush Wire
Plating
M
4.
Termination
01
5.
Contact Termination
Less Hardware
(Purchased separately see
Finish
pg X for hardware options)
Staggered/ Hybrids - Fiber Optics/ Options/
GEN-X
Hi Speed/RF/Power Accessories
LRM (Line Replaceable Modules)
HDB-D4
2
.540
.325
X
.086 MIN. DIA.
THRU HOLE
(USE NO. 2 SCREW)
2.
Number of Contacts
6
1
Number of
Contacts
040
060
080
120
160
40
60
80
120
160
Dimen-
sion A
1.375
1.725
2.075
2.775
3.475
Dimension
C
1.075
1.425
1.775
2.475
3.175
E ±.020
TYP
5
2
PIN 1
3
4
C
A
Ruggedized
VME 64x/
VITA 60, 66
3.
Brush Wire Plating
M
C
0.000050 Au Min. thick over Nickel
0.000020 Au Min. thick over Nickel
ORGANIZER
(TO MAINTAIN
PIN ALIGNMENT
DURING CUSTOMER
INSTALLATION)
F
A
E
B
4.
Termination
Type
01
02
03
04
06
PCB, Right Angle, .016 Dia.
PCB, Right Angle, .016 Dia.
PCB, Right Angle, .016 Dia.
PCB, Right Angle, .016 Dia.
PCB, Right Angle, .016 Dia.
Stickout
(Dim. E)
0.090
0.120
0.150
0.180
0.300
HDB
3
High Density
C
.350
D
CONNECTOR
MOUNTING
SURFACE
E
±.020 TYP
.350
.410
.470
.530
HSB
3
Hi Speed
Standard Hybrids - Signal/Power/ Docking Conn./
Brush
Coax/Fiber Optics
Accessories/Install.
Low Mating Force MIL-DTL-55302
5.
Contact Termination Finish
2
Gold plated in accordance with
MIL-G-45204, Type II, .000030 Min.
thick Gold over .000050 Min.
thick Nickel
Tin plated in accordance with
ASTM B545, .00010 Min. thick
Matte Tin over .00010 Min. thick
Nickel
Tin-Lead plated in accordance with
SAE-AMS-P-81728, .00010 Min.
thick Tin-Lead over .00010 Min.
thick Copper
6.
Hardware
X
Less Hardware
Hardware is purchased
separately (see page 59 for
hardware options).
5
6
Daughter Board Layout
C
.060
.110 ±.005
Mated Height
Dimensions
DAUGHTER
BOARD
CONNECTOR
DAUGHTER
BOARD
Rack & Panel
Brush
Ruggedized
.005
M
.025
LMD/LMS
Rectangular
Interconnects
MOTHER
BOARD
CONNECTOR
.680
.500
.560
.620
BOARD
EDGE
.035
FINISHED HOLE SIZE PER
CUSTOMER STANDARDS FOR
.016 PCB TAIL
A
.070
.
300
.150
Other
Rectangular
Interconnects
.205
MOTHER
BOARD
Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com
51
DSP 与 ARM 处理器
