echnical Data
HSMx-C260
Surface Mount Chip LEDs
Description
The HSMx-C260 is a reverse
mountable chip-type LED for
lighting the non-component side
of a PC board. In this reverse
mounting configuration, this
LED is designed to emit light
through a small cut-out hole in
the PC board.
HSMx-C260
Data Sheet
Reverse Mountable
atures
The HSMx-C260 is available in
four colors. The small size, narrow
footprint, and low profile make
this series of LEDs excellent for
backlighting, status indication,
and front panel illumination
The HSMx-C260 is a reverse mountable chip-type LED for
applications.
pplications
lighting the non-component side of a PC board. In this
Keypad Backlighting
mounting configuration, this LED is designed to
reverse
ymbol Backlighting
through a small cut-out hole in the PC board.
emit light
tatus Indication
HSMx-C260 is available in four colors. The small size,
The
Front Panel Indicator
narrow footprint, and low profile make this series of LEDs
excellent for backlighting, status indication, and front
panel illumination applications.
MT LED
Diffused Optics
mall 3.4 x 1.25 mm
Footprint
Operating Temperature
Range of -25
°
C to +80
°
C
Compatible with IR Solder
Four Colors Available: Red,
Orange, Yellow, and Green
Available in 8 mm tape on
in. (178 mm) Diameter
Reels
Description
Features
•
Reverse Mountable SMT LED
•
Diffused Optics
•
Small 3.4 x 1.25 mm Footprint
•
Operating Temperature Range of -25°C to +80°C
•
Compatible with IR Solder
•
Four Colors Available: Red, Orange, Yellow, and Green
•
Available in 8 mm tape on 7 in. (178 mm) Diameter
Reels
Device Selection Guide
Part Number
Part Number
HSMY-C260
HSMS-C260
HSMG-C260
HSMD-C260
HSMY-C260
HSMG-C260
HSMD-C260
Color
High Efficiency Red
Orange
Yellow
Green
Parts Per Reel
3000
3000
Applications
•
Keypad Backlighting
•
Symbol Backlighting
Parts Per Reel
•
Status Indication
3000
•
Front Panel Indicator
3000
3000
3000
HSMS-C260
evice Selection Guide
Color
3000
High Efficiency Red
3000
Orange
Yellow
Green
Package Dimensions
LED DIE
CATHODE
MARK
1.25 (0.049)
3.4 (0.134)
DIFFUSED
EPOXY
1.1 (0.043)
PC BOARD
1.2 (0.047)
POLARITY
1.1 (0.043)
0.3 (0.012)
0.50 ± 0.15
(0.020 ± 0.006)
0.50 ± 0.15
(0.020 ± 0.006)
SOLDERING
TERMINAL
HSMx-C260
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is
±
0.1 mm (± 0.004 in.) unless otherwise specified.
Absolute Maximum Ratings at T
A
=25
°
C
Parameter
DC Forward Current
[1]
Peak Pulsing Current
[2]
Power Dissipation
Reverse Voltage (I
R
= 100
µA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
HSMx-C260
Units
25
mA
100
mA
65
mW
5
V
95
°C
-25 to +80
°C
-30 to +85
°C
See IR soldering profile (Figure 6)
Notes:
1. Derate linearly as shown in Figure 4 for temperature above 25°C.
2. Pulse condition of 1/10 duty and 0.1 msec. width.
2
Optical Characteristics at T
A
=25
°
C
Color
Luminous
Intensity
[1]
I
v
(mcd) @ 20 mA
Min.
Typ.
2.50
8.0
2.50
8.0
2.50
8.0
4.00
15.0
Peak
Wavelength
peak
(nm)
Typ.
639
606
584
570
Dominant
Wavelength
d
(nm)
Typ.
626
604
586
572
Viewing
Angle
2
1/2
Degrees
[2]
Typ.
170
170
170
170
HER
Orange
Yellow
Green
Notes:
1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical
axis of the lamp package.
2.
1/2
is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Electrical Characteristics at T
A
=25
°
C
Color
Forward Voltage
Reverse
Capacitance
V
F
(V)
Breakdown
C(pF)
@ I
F
=20 mA
V
R
(V) @ I
R
=100
µ
A @ V
F
=0 V, f =1 MHz
Typ.
Max.
Min.
Typ.
1.9
2.6
5
8
2.1
2.6
5
6
2.1
2.6
5
7
2.2
2.6
5
6
Thermal
Resistance
Rθ
J-P
(
°
C/W)
Typ.
250
250
250
250
HER
Orange
Yellow
Green
Color Bin Limits
[1]
Green Color Bins
[1]
Dom. Wavelength [nm]
Bin ID
MIN.
MAX.
A
561.5
564.5
B
564.5
567.5
C
567.5
570.5
D
570.5
573.5
E
573.5
576.5
Tolerance:
±
0.5 nm
Orange Color Bins
[1]
Dom. Wavelength [nm]
Bin ID
MIN.
MAX.
A
597.0
600.0
B
600.0
603.0
C
603.0
606.0
D
606.0
609.0
E
609.0
612.0
F
612.0
615.0
Tolerance:
±
1 nm
Yellow/Amber
Color Bins
[1]
Dom. Wavelength [nm]
Bin ID
MIN.
MAX.
A
582.0
584.5
B
584.5
587.0
C
587.0
589.5
D
589.5
592.5
E
592.0
594.5
F
594.5
597.0
Tolerance:
±
0.5 nm
Note:
1. Bin categories are established for classification of products.
Products may not be available in all categories.
Please contact your Agilent representative for information on currently available bins.
3
Light Intensity (Iv) Bin Limits
[1]
Bin ID
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Tolerance:
±
15%
Note:
1. Bin categories are established for classification of products.
Products may not be available in all categories. Please con-
tact your Agilent representative for information on currently
available bins.
Intensity (mcd)
Min.
Max.
0.11
0.18
0.18
0.29
0.29
0.45
0.45
0.72
0.72
1.10
1.10
1.80
1.80
2.80
4.50
7.20
11.20
18.00
28.50
45.00
71.50
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
2.80
4.50
7.20
11.20
18.00
28.50
45.00
71.50
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
4500.00
4
5
1.0
GREEN
RELATIVE INTENSITY
YELLOW
0.5
ORANGE
HER
0
500
550
600
650
700
750
WAVELENGTH – nm
Figure 1. Relative Intensity vs. Wavelength.
100
I
F
– FORWARD CURRENT – mA
1.6
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
10
HER
GREEN
1.2
0.8
1
YELLOW
0.1
ORANGE
1.5
1.7
1.9
2.1
2.3
V
F
– FORWARD VOLTAGE – V
0.4
0
0
10
20
30
40
I
F
– FORWARD CURRENT – mA
Figure 2. Forward Current vs. Forward Voltage.
Figure 3. Luminous Intensity vs. Forward Current.
I
F MAX.
– MAXIMUM FORWARD CURRENT – mA
35
RELATIVE INTENSITY – %
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
20
40
60
80
100
30
25
20
15
10
5
0
Rθ
J-A
= 600°C/W
Rθ
J-A
= 800°C/W
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
T
A
– AMBIENT TEMPERATURE – °C
ANGLE
Figure 4. Maximum Forward Current vs.
Ambient Temperature.
Figure 5. Relative Intensity vs. Angle.
5
