HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data
Issued Date : 2001.03.01
Revised Date : 2001.03.29
Page No. : 1/3
HTL295D
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HTL295D is designed for high voltage low power switching
applications especially for use in telephone and telecommunication
circuits.
Absolute Maximum Ratings
•
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
°C
Junction Temperature ..................................................................................... 150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ................................................................................... 1.5 W
•
Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ..................................................................................... -500 V
VCEO Collector to Emitter Voltage .................................................................................. -500 V
VEBO Emitter to Base Voltage ............................................................................................ -6 V
IC Collector Current ..................................................................................................... -250 mA
Characteristics
(Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
ICES
IEBO
*VCE(sat)1
*VCE(sat)2
*VCE(sat)3
*VBE(sat)
*hFE1
*hFE2
*hFE3
fT
Cob
Min.
-500
-500
-6
-
-
-
-
-
-
50
60
50
10
-
Typ.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Max.
-
-
-
-1
-10
-0.2
-500
-2
-3
-750
-
250
-
-
30
Unit
V
V
V
uA
uA
uA
mV
V
V
mV
Test Conditions
IC=-100uA, IE=0
IC=-1mA, IB=0
IE=-10uA
VCB=-500V, IE=0
VCE=-500V, IB=0
VEB=-6V, IC=0
IC=-10mA, IB=-1mA
IC=-50mA, IB=-5mA
IC=-80mA, IB=-4mA
IC=-10mA, IB=-1mA
VCE=-10V, IC=-1mA
VCE=-10V, IC=-20mA
VCE=-10V, IC=-80mA
VCE=-20V, IE=-10mA, f=1MHz
VCB=-20V, f=1MHz, IE=0
MHz
pF
*Pulse Test : Pulse Width
≤380us,
Duty Cycle≤2%
HTL295D
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
100000
Spec. No. : Preliminary Data
Issued Date : 2001.03.01
Revised Date : 2001.03.29
Page No. : 2/3
Sasturation Voltage & Collector Current
100
hFE @ V
CE
=10V
Saturation Voltage (mV)
10000
hFE
1000
V
CE(sat)
@ I
C
=20I
B
100
V
CE(sat)
@ I
C
=10I
B
10
0.1
1
10
100
1000
10
1
10
100
1000
Collector Current-I
C
(mA)
Collector Current-I
C
(mA)
Saturation Voltage & Collector Current
1000
100
Capacitance & Reverse-Biased Voltage
SATURATION VOLTAGE-(mV)
V
BE(sat)
@ I
C
=10I
B
Cob
Capacitance (pF)
100
1
10
100
1000
10
1
0.1
1
10
100
Collector Current-I
C
(mA)
Reverse Biased Voltage (V)
Safe Operating Area
10
1.6
1.4
PT=1mS
Power Derating
PD(W) , Power Dissipation
100
1000
Collector Current-I
C
(A)
1.2
1
0.8
0.6
0.4
0.2
1
PT=100mS
PT=1S
0.1
0.01
1
10
0
0
50
o
100
150
200
Forward Biased Voltage-V
CE
(V)
Ta( C) , Ambient Temperature
HTL295D
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-126ML Dimension
Marking :
Spec. No. : Preliminary Data
Issued Date : 2001.03.01
Revised Date : 2001.03.29
Page No. : 3/3
A
B
D
E
F
3
2
I
G
1
J
M
L
K
O
H
HSMC Logo
Part Number
Date Code
Product Series
Rank
Ink Marking
C
Style : Pin 1.Emitter 2.Collector 3.Base
N
3-Lead TO-126ML Plastic Package
HSMC Package Code : D
*:Typical
DIM
A
B
C
D
E
F
G
H
Inches
Min.
Max.
0.1356
0.1457
0.0170
0.0272
0.0344
0.0444
0.0501
0.0601
0.1131
0.1231
0.0737
0.0837
0.0294
0.0494
0.0462
0.0562
Millimeters
Min.
Max.
3.44
3.70
0.43
0.69
0.87
1.12
1.27
1.52
2.87
3.12
1.87
2.12
0.74
1.25
1.17
1.42
DIM
I
J
K
L
M
N
O
Inches
Min.
Max.
-
*0.1795
0.0268
0.0331
0.5512
0.5906
0.2903
0.3003
0.1378
0.1478
0.1525
0.1625
0.0740
0.0842
Millimeters
Min.
Max.
-
*4.56
0.68
0.84
14.00
15.00
7.37
7.62
3.50
3.75
3.87
4.12
1.88
2.14
Notes :
1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
•
Lead : 42 Alloy ; solder plating
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
•
Head Office
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
HTL295D
HSMC Product Specification
嵌入式系统
