HTMS1x01; HTMS8x01
HITAG µ transponder IC
Rev. 3.4 — 21 May 2015
152934
Product data sheet
COMPANY PUBLIC
1. General description
The HITAG product line is well known and established in the contactless identification
market.
Due to the open marketing strategy of NXP Semiconductors there are various
manufacturers well established for both the transponders/cards as well as the read/write
devices. All of them supporting HITAG 1, HITAG 2 and HITAG S transponder ICs.
With the new HITAG µ family, this existing infrastructure is extended with the next
generation of ICs being substantially smaller in mechanical size, lower in cost, offering
more operation distance and speed, but still being operated with the same reader
infrastructure and transponder manufacturing equipment.
The protocol and command structure for HITAG µ is design to support Reader Talks First
(RTF) operation, including anti-collision algorithm.
Different memory sizes are offered and can be operated using exactly the same protocol.
1.1 Target markets
1.1.1 Animal identification
The ISO standards ISO 11784 and ISO 11785 are well established in this market and
HITAG µ is especially designed to deliver the optimum performance compliant to these
standards. The HITAG µ advanced ICs are offering additional memory for storage of
customized offline data like further breeding details.
1.1.2 Laundry automation
•
Identify 200 pcs of garment with one read/write device
•
Long operation distance with typical small shaped laundry button transponders
•
Insensitive to harsh conditions like pressure, heat and water
NXP Semiconductors
HTMS1x01; HTMS8x01
HITAG µ transponder IC
1.1.3 Beer keg and gas cylinder logistic
•
Recognizing a complete pallet of gas cylinders at one time
•
Long writing distance
•
Voluntarily change between TTF Mode with user defined data length and read/write
modes without changing the configuration on the transponder
•
Authenticity check at the beer pubs - between beer bumper and supplied beer keg,
provides a safe protection of the beer brand
1.1.4 Brand protection
•
Authenticity check for high level brands or for original refilling e.g. toner for fax
machines.
2. Features and benefits
2.1 Features
Integrated circuit for contactless identification transponders and cards
Integrated resonance capacitor of 210 pF with
3
% tolerance or 280 pF with
5
%
tolerance over full production
Frequency range 100 kHz to 150 kHz
2.2 Protocol
Modulation read/write device
transponder: 100 % ASK and binary pulse length
coding
Modulation transponder
read/write device: Strong ASK modulation with
anti-collision, Manchester and Biphase coding
Fast anti-collision protocol
Cyclic Redundancy Check (CRC)
Transponder Talks First (TTF) mode
Temporary switch from Transponder Talks First into Reader Talks First (RTF) Mode
Data rate read/write device to transponder: 5.2 kbit/s
Data rates transponder to read/write device: 2 kbit/s, 4 kbit/s, 8 kbit/s
2.3 Memory
Different memory options
Up to 10000 erase/write cycles
10 years non-volatile data retention
Memory Lock functionality
32-bit password feature
2.4 Supported standards
Full compliant to ISO 11784 and ISO 11785 Animal ID
Designed to support ISO/IEC 14223 Animal ID with anticollision and read/write
functionality
HTMS1x01_8x01
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.4 — 21 May 2015
152934
2 of 57
NXP Semiconductors
HTMS1x01; HTMS8x01
HITAG µ transponder IC
2.5 Security features
48-bit Unique Identification Number (UID)
2.6 Delivery types
Sawn, gold-bumped 8” wafer
HVSON2
SOT-1122
3. Applications
Animal identification
Laundry automation
Beer keg and gas cylinder logistic
Brand protection
4. Quick reference data
Table 1.
Symbol
t
ret
N
endu(W)
C
i
Quick reference data
Parameter
retention time
write endurance
input capacitance
between LA and LB
HTMS1x01
HTMS8x01
[1]
[2]
[3]
Integrated Resonance Capacitor: 210 pF
3 %
Integrated Resonance Capacitor: 280 pF
5 %
[1][2]
[1][3]
Conditions
T
amb
55
C
Min
10
100000
Typ
-
-
Max
-
-
Unit
year
cycle
Wafer EEPROM characteristics
Interface characteristics
203.7
266
210
280
216.3
294
pF
pF
Measured with an HP4285A LCR meter at 125 kHz/room temperature (25C); V
IN1-IN2
= 0.5 V (RMS)
HTMS1x01_8x01
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.4 — 21 May 2015
152934
3 of 57
NXP Semiconductors
HTMS1x01; HTMS8x01
HITAG µ transponder IC
5. Ordering information
Table 2.
Ordering information
Package
Name
HTMS1001FUG/AM
HTMS8001FUG/AM
HTMS8101FUG/AM
HTMS8201FUG/AM
HTMS8001FTB/AF
HTMS8101FTB/AF
HTMS8201FTB/AF
HTMS8001FTK/AF
Wafer
Wafer
Wafer
Wafer
XSON3
XSON3
XSON3
HVSON2
Description
Type
Version
-
-
-
-
SOT1122
SOT1122
SOT1122
SOT899-1
sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG
,
210 pF
sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG
,
280pF
sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG
Advanced,
280 pF
sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG
Advanced+,
280 pF
plastic extremely thin small outline package; no HITAG
,
280 pF
leads; 4 terminals; body 1
1.45
0.5 mm
plastic extremely thin small outline package; no HITAG
Advanced,
leads; 4 terminals; body 1
1.45
0.5 mm
280 pF
plastic extremely thin small outline package; no HITAG
Advanced+,
leads; 4 terminals; body 1
1.45
0.5 mm
280 pF
plastic thermal enhanced very thin small outline HITAG
,
280 pF
package; no leads; 2 terminals; body 3
2
0.85 mm
plastic thermal enhanced very thin small outline HITAG
Advanced,
package; no leads; 2 terminals; body 3
2
280 pF
0.85 mm
plastic thermal enhanced very thin small outline HITAG
Advanced+,
package; no leads; 2 terminals; body 3
2
280 pF
0.85 mm
Type number
HTMS8101FTK/AF
HVSON2
SOT899-1
HTMS8201FTK/AF
HVSON2
SOT899-1
HTMS1x01_8x01
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.4 — 21 May 2015
152934
4 of 57
NXP Semiconductors
HTMS1x01; HTMS8x01
HITAG µ transponder IC
6. Block diagram
The HITAG µ transponder ICs require no external power supply. The contactless interface
generates the power supply and the system clock via the resonant circuitry by inductive
coupling to the Read/Write Device (RWD). The interface also demodulates data
transmitted from the RWD to the HITAG µ transponder IC, and modulates the magnetic
field for data transmission from the HITAG µ transponder IC to the RWD.
Data are stored in a non-volatile memory (EEPROM). The EEPROM has a capacity of up
to 1760 bit and is organized in blocks.
ANALOGUE
RF INTERFACE
VREG
PAD
VDD
DIGITAL CONTROL
EEPROM
ANTICOLLISION
RECT
DEMOD
data
in
READ/WRITE
CONTROL
TRANSPONDER
Cres
MOD
data
out
ACCESS CONTROL
EEPROM INTERFACE
CONTROL
CLK
PAD
clock
RF INTERFACE
CONTROL
R/W
SEQUENCER
CHARGE PUMP
001aai334
Fig 1.
Block diagram of HITAG µ transponder IC
HTMS1x01_8x01
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.4 — 21 May 2015
152934
5 of 57
