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HVC1206V3835FET

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 38300000ohm, 600V, 1% +/-Tol, 50ppm/Cel, 1206

器件类别:无源元件    电阻器   

厂商名称:Ohmite

厂商官网:https://www.ohmite.com

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Ohmite
包装说明
SMT, 1206
Reach Compliance Code
compliant
ECCN代码
EAR99
构造
Chip
JESD-609代码
e3
端子数量
2
最高工作温度
155 °C
最低工作温度
-55 °C
封装高度
0.4 mm
封装长度
3.2 mm
封装形式
SMT
封装宽度
1.5 mm
包装方法
TR
额定功率耗散 (P)
0.25 W
电阻
38300000 Ω
电阻器类型
FIXED RESISTOR
尺寸代码
1206
技术
METAL GLAZE/THICK FILM
温度系数
50 ppm/°C
端子面层
Matte Tin (Sn) - with Nickel (Ni) barrier
容差
1%
工作电压
600 V
Base Number Matches
1
文档预览
THICK FILM
SMD
hVc Series
Precision High-Value High-voltage Wraparound Chip
• High value chip resistors in thick film technology
• Low temperature and voltage dependency (low TCR and VCR)
• High working voltage up to 3000V
• Suitable for high vacuum applications—no organics
• Contact areas: Nickel-barrier/matte tin
• Wraparound terminals
S e r i e S S p e c i f i c at i o n S
HIGH
VOLTAGE
f e at u r e S
Series
HVC0805---
Type
0805
Wattage
1
P
70
(mW)
125
HVC1206---
1206
250
HVC2512---
2512
1000
Oper. Voltage (V)
Resistance
std. untrimmed (≥5%)
Range
200
600
100K-100M
>100M-1G
>1G-10G
>10G-100G
600
1000
100K-100M
>100M-1G
>1G-10G
>10G-100G
2000
3000
100K-100M
>100M-1G
>1G-10G
>10G-100G
Tolerance
0.5-10%
2-20%
5-20%
10-30%
0.5-10%
2-20%
5-20%
10-30%
0.5-10%
1-20%
2-20%
5-30%
TCR
2
(ppm)
25, 50, 100
50, 100, 250
100, 250
1000, 2000
25, 50, 100
50, 100, 250
100, 250
500, 1000
25, 50, 100
25, 50, 100
50, 100
250, 500
VCR
2
(ppm)
50
250
500
1000
50
100
250
1000
10
25
100
250
1. At continuous power dissipation the dimensions of the solder pads have to be capable of sufficient heat conduction.
2. Not all TCR/VCR combinations available in all resistance values
characteriSticS
Operating temperature
-55°C ~ +155°C
range
Climatic category
55/155/56, acc. to EN 60068-1
Solderability
250°C, 3s, acc. to EN 60068-2-58
Max. soldering temperature
260°C, 10s, acc. to IEC 68-2-58
Long Term Stability
<1G
Load Life 70°C/1000h <0.25%
Storage 125°C/1000h <0.5%
Max. Voltage/1000h
<0.5%
<10G
<0.5%
<1%
<1%
≥1G
<1%
<2%
<2%
Derating
100
Percent Rated Power
80
60
40
20
0
-55
0
50 70 100
Ambient Temperature,
°C
155
Data not specified according to EN 140401-802 (CECC 40401-802)
t e r m i n a l D e ta i l S
Base Metal
PtAg
Termination Finish
100% electroplated matte Sn100
Thickness of Finish
5 microns
Barrier Material between Base Metal and Finish
Porosity-free Ni (5-8 microns thickness)
Baking/Annealing Process after Sn Plating
150°C; > 4 hours
Peak Process Body Temperature (Classification
260°C for 10 seconds
Temperature) and Maximum Time
1
1600 Golf Rd., Rolling Meadows, IL 60008 • 1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com
THICK FILM
SMD
hVc Series
HIGH
VOLTAGE
(mm)
Precision High-Value High-voltage Wraparound Chip
DimenSionS
W
L
a
T
Power
Size Rating (mW)
L
0805
125
2.00 +.15/-.05
1206
250
3.20 +.15/-.05
2512
1000
6.30 +.15/-.05
W
1.25 +.15/-.05
1.50 +.2/-.05
3.50 +.2/-.05
T
0.40 +.15/-.05
0.40 +.15/-.05
0.60 +.15/-.05
a
0.3 +.2/-.1
0.3 +.2/-.1
0.9 ±.2
hoW to orDer
RoHS Compliant
Standard Part Numbers
HVC0805T1004JET
HVC0805T5004JET
HVC0805T1005JET
HVC0805T5005JET
HVC0805T1006JET
HVC0805Z5006JET
HVC0805Z1007JET
HVC0805Z1008KET
HVC1206T1004JET
HVC1206T5004JET
HVC1206T1005JET
HVC1206T5005JET
HVC1206T1006JET
HVC1206Z5006JET
HVC1206Z1007JET
HVC1206Z1008KET
HVC2512T1004JET
HVC2512T5004JET
HVC2512T1005JET
HVC2512T5005JET
HVC2512T1006JET
HVC2512Z5006JET
HVC2512Z1007JET
HVC1206T1004JET
Series
Package
High Voltage
Size
Wrap Around Chip
(ppm)
TCR
W = 25
V = 50
T = 100
Z = 250
E = 500
N = 1000
U = 2000
Tolerance Tape & Reel
Ohms
D =0.50% 500 pc/reel
1004 = 1MΩ
5006 = 500MΩ F = 1%
G = 2%
J = 5%
K = 10%
M = 20%
P = 30%
2
Ohmite Mfg. Co.
1600 Golf Rd., Rolling Meadows, IL 60008 • 1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com
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