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HYM71V8M755HCFU6-S

Synchronous DRAM Module, 8MX72, 6ns, CMOS, MICRO, SODIMM-144

器件类别:存储    存储   

厂商名称:SK Hynix(海力士)

厂商官网:http://www.hynix.com/eng/

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
SK Hynix(海力士)
零件包装代码
MODULE
包装说明
DIMM, DIMM144,20
针数
144
Reach Compliance Code
compliant
ECCN代码
EAR99
访问模式
SINGLE BANK PAGE BURST
最长访问时间
6 ns
其他特性
AUTO/SELF REFRESH
最大时钟频率 (fCLK)
100 MHz
I/O 类型
COMMON
JESD-30 代码
R-XDMA-N144
JESD-609代码
e4
内存密度
603979776 bit
内存集成电路类型
SYNCHRONOUS DRAM MODULE
内存宽度
72
功能数量
1
端口数量
1
端子数量
144
字数
8388608 words
字数代码
8000000
工作模式
SYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
8MX72
输出特性
3-STATE
封装主体材料
UNSPECIFIED
封装代码
DIMM
封装等效代码
DIMM144,20
封装形状
RECTANGULAR
封装形式
MICROELECTRONIC ASSEMBLY
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
3.3 V
认证状态
Not Qualified
刷新周期
4096
自我刷新
YES
最大待机电流
0.008 A
最大压摆率
0.8 mA
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
NO
技术
CMOS
温度等级
COMMERCIAL
端子面层
Gold (Au)
端子形式
NO LEAD
端子节距
0.5 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
文档预览
8Mx72 bits
PC100 SDRAM Unbuffered MicroDIMM
based on 8Mx16 SDRAM with LVTTL, 4 banks & 4K Refresh
HYM71V8M755HC(L)FU6 Series
DESCRIPTION
The HYM71V8M755HCTU6 Series are 8Mx72bits Synchronous DRAM Modules. The modules are composed of five
8Mx16bits CMOS Synchronous DRAMs in 54ball FBGA package, one 2Kbit EEPROM in 8pin TSSOP package on a 144pin
glass-epoxy printed circuit board.
The HYM71V8M755HCFU6 Series are Dual In-line Memory Modules suitable for easy interchange and addition of 64Mbytes
memory. The HYM71V8M755HCFU6 Series are fully synchronous operation referenced to the positive edge of the clock . All
inputs and outputs are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve
very high bandwidth.
FEATURES
PC100MHz support
144pin SDRAM Micro SO DIMM
Serial Presence Detect with EEPROM
1.00” (25.40mm) Height PCB with double sided compo-
nents
Single 3.3±0.3V power supply
- 1, 2, 4 or 8 or Full page for Sequential Burst
All device pins are compatible with LVTTL interface
- 1, 2, 4 or 8 for Interleave Burst
Data mask function by DQM
Programmable CAS Latency ; 2, 3 Clocks
SDRAM internal banks : four banks
Module bank : one physical bank
Auto refresh and self refresh
4096 refresh cycles / 64ms
Programmable Burst Length and Burst Type
ORDERING INFORMATION
Part No.
HYM71V8M755HCFU6-8
HYM71V8M755HCFU6-P
HYM71V8M755HCFU6-S
HYM71V8M755HCLFU6-8
HYM71V8M755HCLFU6-P
HYM71V8M755HCLFU6-S
Clock
Frequency
125MHz
100MHz
100MHz
125MHz
100MHz
100MHz
Internal
Bank
Ref.
Power
SDRAM
Package
Plating
Normal
4 Banks
4K
Low Power
FBGA
Gold
This document is a general product description and is subject to change without notice. Hynix Semiconductor Inc. does not assume any re-
sponsibility for use of circuits described. No patent licenses are implied.
Rev. 0.1/May. 02
1
PC100 SDRAM Unbuffered MicroDIMM
PIN DESCRIPTION
PIN
CK0
CKE0
/S0
BA0, BA1
A0 ~ A11
/RAS, /CAS, /WE
DQM0~DQM7
DQ0 ~ DQ63
CB0 ~ CB7
VCC
V
SS
SCL
SDA
SA0~2
WP
NC
PIN NAME
Clock Inputs
Clock Enable
Chip Select
SDRAM Bank Address
Address
Row Address Strobe, Column
Address Strobe, Write Enable
Data Input/Output Mask
Data Input/Output
Data Input/Output
Power Supply (3.3V)
Ground
SPD Clock Input
SPD Data Input/Output
SPD Address Input
Write Protect for SPD
No Connection
HYM71V8M755HC(L)FU6 Series
DESCRIPTION
The system clock input. All other inputs are registered to the SDRAM on the
rising edge of CLK
Controls internal clock signal and when deactivated, the SDRAM will be one
of the states among power down, suspend or self refresh
Enables or disables all inputs except CK, CKE and DQM
Selects bank to be activated during /RAS activity
Selects bank to be read/written during /CAS activity
Row Address : RA0 ~ RA11, Column Address : CA0 ~ CA8
Auto-precharge flag : A10
/RAS, /CAS and /WE define the operation
Refer function truth table for details
Controls output buffers in read mode and masks input data in write mode
Multiplexed data input / output pin
Check bits
Power supply for internal circuits and input buffers
Ground
Serial Presence Detect Clock input
Serial Presence Detect Data input/output
Serial Presence Detect Address Input
Write Protect for Serial Presence Detect on DIMM
No connection
Rev. 0.1/May. 02
2
PC100 SDRAM Unbuffered MicroDIMM
PIN ASSIGNMENTS
FRONT SIDE
PIN NO.
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
HYM71V8M755HC(L)FU6 Series
BACK SIDE
PIN NO.
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
FRONT SIDE
PIN NO.
71
73
75
77
79
81
83
85
87
89
91
93
95
97
99
101
103
105
107
109
111
113
115
117
119
121
123
125
127
129
131
133
BACK SIDE
PIN NO.
72
74
76
78
80
82
84
86
88
90
92
94
96
98
100
102
104
106
108
110
112
114
116
118
120
122
124
126
128
130
132
134
136
138
140
142
144
NAME
VSS
DQ0
DQ1
DQ2
DQ3
VCC
DQ4
DQ5
DQ6
DQ7
VSS
DQM0
DQM1
VCC
A0
A1
A2
VSS
DQ8
DQ9
DQ10
DQ11
VCC
DQ12
DQ13
DQ14
DQ15
VSS
NC
NC
NAME
VSS
DQ32
DQ33
DQ34
DQ35
VCC
DQ36
DQ37
DQ38
DQ39
VSS
DQM4
DQM5
VCC
A3
A4
A5
VSS
DQ40
DQ41
DQ42
DQ43
VCC
DQ44
DQ45
DQ46
DQ47
VSS
NC
NC
NAME
NC
NC
VSS
NC
NC
VCC
DQ16
DQ17
DQ18
DQ19
VSS
DQ20
DQ21
DQ22
DQ23
VCC
A6
A8
VSS
A9
A10
VCC
DQM2
DQM3
VSS
DQ24
DQ25
DQ26
DQ27
VCC
DQ28
DQ29
DQ30
DQ31
VSS
SDA
VCC
NAME
NC
*CK1
VSS
NC
NC
VCC
DQ48
DQ49
DQ50
DQ51
VSS
DQ52
DQ53
DQ54
DQ55
VCC
A7
BA0
VSS
BA1
A11
VCC
DQM6
DQM7
VSS
DQ56
DQ57
DQ58
DQ59
VCC
DQ60
DQ61
DQ62
DQ63
VSS
SCL
VCC
Voltage Key
61
63
65
67
69
CK0
VCC
/RAS
/WE
/S0
62
64
66
68
70
CKE0
VCC
/CAS
NC
NC
135
137
139
141
143
Note : * CK1 are connected with termination R/C (Refer to the Block Diagram)
Rev. 0.1/May. 02
3
PC100 SDRAM Unbuffered MicroDIMM
BLOCK DIAGRAM
/S0
/CS
/CS
/CS
HYM71V8M755HC(L)FU6 Series
DQM0
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
LDQM
DQO
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
UDQM
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
U0
DQM1
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
LDQM
DQO
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
UDQM
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
U2
DQM4
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
LDQM
DQO
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
UDQM
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
U3
DQM1
DQM5
/CS
/CS
DQM2
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
Serial PD
LDQM
DQO
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
UDQM
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
U1
DQM6
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
LDQM
DQO
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
UDQM
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
U4
DQM3
DQM7
SCL
WP
A0
SA0
A1
SA1
A2
SA2
SDA
10 Ohm
DQn
10 Ohm
CK0
10 Ohm
CK1
10 pF
U0 - U4
Every DQ pin of SDRAMs
BA0-BA1 : SDRAMs U0 - U4
A0 - An
/RAS
/CAS
CKE0
/WE
: SDRAMs U0 - U4
: SDRAMs U0 - U4
: SDRAMs U0 - U4
: SDRAMs U0 - U4
: SDRAMs U0 - U4
Note : 1. The serial resistor values of DQs are 10ohms
2. The padding capacitance of termination R/C for CK1 is 10pF
Rev. 0.1/May. 02
4
PC100 SDRAM Unbuffered MicroDIMM
SERIAL PRESENCE DETECT
BYTE
NUMBER
BYTE0
BYTE1
BYTE2
BYTE3
BYTE4
BYTE5
BYTE6
BYTE7
BYTE8
BYTE9
BYTE10
BYTE11
BYTE12
BYTE13
BYTE14
BYTE15
BYTE16
BYTE17
BYTE18
BYTE19
BYTE20
BYTE21
BYTE22
BYTE23
BYTE24
BYTE25
BYTE26
BYTE27
BYTE28
BYTE29
BYTE30
BYTE31
BYTE32
BYTE33
BYTE34
BYTE35
BYTE36
~61
BYTE62
BYTE63
BYTE64
BYTE65
~71
FUNCTION
DESCRIPTION
# of Bytes Written into Serial Memory at Module
Manufacturer
Total # of Bytes of SPD Memory Device
Fundamental Memory Type
# of Row Addresses on This Assembly
# of Column Addresses on This Assembly
# of Module Banks on This Assembly
Data Width of This Assembly
Data Width of This Assembly (Continued)
Voltage Interface Standard of This Assembly
SDRAM Cycle Time @/CAS Latency=3
Access Time from Clock @/CAS Latency=3
DIMM Configuration Type
Refresh Rate/Type
Primary SDRAM Width
Error Checking SDRAM Width
Minimum Clock Delay Back to Back Random Column
Address
Burst Lenth Supported
# of Banks on Each SDRAM Device
SDRAM Device Attributes, /CAS Lataency
SDRAM Device Attributes, /CS Lataency
SDRAM Device Attributes, /WE Lataency
SDRAM Module Attributes
SDRAM Device Attributes, General
SDRAM Cycle Time @/CAS Latency=2
Access Time from Clock @/CAS Latency=2
SDRAM Cycle Time @/CAS Latency=1
Access Time from Clock @/CAS Latency=1
Minimum Row Precharge Time (tRP)
Minimum Row Active to Row Active Delay (tRRD)
Minimum /RAS to /CAS Delay (tRCD)
Minimum /RAS Pulse Width (tRAS)
Module Bank Density
Command and Address Signal Input Setup Time
Command and Address Signal Input Hold Time
Data Signal Input Setup Time
Data Signal Input Hold Time
Superset Information (may be used in future)
SPD Revision
Checksum for Byte 0~62
Manufacturer JEDEC ID Code
....Manufacturer JEDEC ID Code
2ns
1ns
2ns
1ns
8ns
6ns
-8
-P
128 Bytes
256 Bytes
SDRAM
12
9
1 Bank
72 Bits
-
LVTTL
10ns
6ns
ECC
15.625us
/ Self Refresh Supported
x16
x16
tCCD = 1 CLK
1,2,4,8,Full Page
4 Banks
/CAS Latency=2,3
/CS Latency=0
/WE Latency=0
Neither Buffered nor Registered
+/- 10% voltage tolerence, Burst
Read Single Bit Write, Precharge
All, Auto Precharge, Early RAS
Precharge
8ns
6ns
-
-
20ns
16ns
20ns
48ns
10ns
6ns
-
-
20ns
20ns
20ns
50ns
64MB
2ns
1ns
2ns
1ns
-
Intel SPD 1.2B
-
Hynix JEDED ID
Unused
HSI(Korea Area)
HSA (United States Area)
HSE (Europe Area)
HSJ (Japan Area)
HSS(Singapore)
Asia Area
E1h
2ns
1ns
2ns
1ns
20h
10h
20h
10h
12ns
6ns
-
-
20ns
20ns
20ns
50ns
A0h
60h
00h
00h
14h
10h
14h
30h
10ns
6ns
80h
60h
HYM71V8M755HC(L)FU6 Series
FUNCTION
-S
-8
VALUE
-P
80h
08h
04h
0Ch
09h
01h
48h
00h
01h
A0h
60h
02h
80h
10h
10h
01h
8Fh
04h
06h
01h
01h
00h
0Eh
A0h
60h
00h
00h
14h
14h
14h
32h
10h
20h
10h
20h
10h
00h
12h
27h
ADh
FFh
0*h
1*h
2*h
3*h
4*h
5*h
2Fh
3, 8
20h
10h
20h
10h
C0h
60h
00h
00h
14h
14h
14h
32h
2
A0h
60h
1
-S
NOTE
BYTE72
Manufacturing Location
9
Rev. 0.1/May. 02
5
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参数对比
与HYM71V8M755HCFU6-S相近的元器件有:HYM71V8M755HCFU6-P、HYM71V8M755HCLFU6-P、HYM71V8M755HCLFU6-S、HYM71V8M755HCLFU6-8。描述及对比如下:
型号 HYM71V8M755HCFU6-S HYM71V8M755HCFU6-P HYM71V8M755HCLFU6-P HYM71V8M755HCLFU6-S HYM71V8M755HCLFU6-8
描述 Synchronous DRAM Module, 8MX72, 6ns, CMOS, MICRO, SODIMM-144 Synchronous DRAM Module, 8MX72, 6ns, CMOS, MICRO, SODIMM-144 Synchronous DRAM Module, 8MX72, 6ns, CMOS, MICRO, SODIMM-144 Synchronous DRAM Module, 8MX72, 6ns, CMOS, MICRO, SODIMM-144 Synchronous DRAM Module, 8MX72, 6ns, CMOS, MICRO, SODIMM-144
是否无铅 含铅 不含铅 不含铅 含铅 含铅
是否Rohs认证 不符合 符合 符合 不符合 不符合
零件包装代码 MODULE MODULE MODULE MODULE MODULE
包装说明 DIMM, DIMM144,20 DIMM, DIMM144,20 DIMM, DIMM144,20 DIMM, DIMM144,20 DIMM, DIMM144,20
针数 144 144 144 144 144
Reach Compliance Code compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST
最长访问时间 6 ns 6 ns 6 ns 6 ns 6 ns
其他特性 AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
最大时钟频率 (fCLK) 100 MHz 100 MHz 100 MHz 100 MHz 125 MHz
I/O 类型 COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 R-XDMA-N144 R-XDMA-N144 R-XDMA-N144 R-XDMA-N144 R-XDMA-N144
JESD-609代码 e4 e4 e4 e4 e4
内存密度 603979776 bit 603979776 bit 603979776 bit 603979776 bit 603979776 bit
内存集成电路类型 SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
内存宽度 72 72 72 72 72
功能数量 1 1 1 1 1
端口数量 1 1 1 1 1
端子数量 144 144 144 144 144
字数 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words
字数代码 8000000 8000000 8000000 8000000 8000000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C
组织 8MX72 8MX72 8MX72 8MX72 8MX72
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装代码 DIMM DIMM DIMM DIMM DIMM
封装等效代码 DIMM144,20 DIMM144,20 DIMM144,20 DIMM144,20 DIMM144,20
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
峰值回流温度(摄氏度) NOT SPECIFIED 260 260 NOT SPECIFIED NOT SPECIFIED
电源 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
刷新周期 4096 4096 4096 4096 4096
自我刷新 YES YES YES YES YES
最大待机电流 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A
最大压摆率 0.8 mA 0.8 mA 0.8 mA 0.8 mA 0.8 mA
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 NO NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Gold (Au) Gold (Au) Gold (Au) Gold (Au) Gold (Au)
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED 20 20 NOT SPECIFIED NOT SPECIFIED
厂商名称 SK Hynix(海力士) - SK Hynix(海力士) SK Hynix(海力士) SK Hynix(海力士)
热门器件
热门资源推荐
器件捷径:
E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ
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