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HYMD232M726AL8-H

Unbuffered DDR SO-DIMM

器件类别：存储    存储   

厂商名称：SK Hynix(海力士)

厂商官网：http://www.hynix.com/eng/

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参数 预览 参数对比
器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
SK Hynix(海力士)
零件包装代码
MODULE
包装说明
DIMM, DIMM200,24
针数
200
Reach Compliance Code
compli
ECCN代码
EAR99
访问模式
SINGLE BANK PAGE BURST
最长访问时间
0.75 ns
其他特性
AUTO/SELF REFRESH
最大时钟频率 (fCLK)
133 MHz
I/O 类型
COMMON
JESD-30 代码
R-XDMA-N200
内存密度
2415919104 bi
内存集成电路类型
DDR DRAM MODULE
内存宽度
72
功能数量
1
端口数量
1
端子数量
200
字数
33554432 words
字数代码
32000000
工作模式
SYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
32MX72
输出特性
3-STATE
封装主体材料
UNSPECIFIED
封装代码
DIMM
封装等效代码
DIMM200,24
封装形状
RECTANGULAR
封装形式
MICROELECTRONIC ASSEMBLY
峰值回流温度（摄氏度）
NOT SPECIFIED
电源
2.5 V
认证状态
Not Qualified
刷新周期
8192
自我刷新
YES
最大待机电流
0.18 A
最大压摆率
2.745 mA
最大供电电压 (Vsup)
2.7 V
最小供电电压 (Vsup)
2.3 V
标称供电电压 (Vsup)
2.5 V
表面贴装
NO
技术
CMOS
温度等级
COMMERCIAL
端子形式
NO LEAD
端子节距
0.6 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
文档预览
32Mx72 bits
Unbuffered DDR SO-DIMM
HYMD232M726A(L)8-J/M/K/H/L
DESCRIPTION
Hynix HYMD232M726A(L)8-J/M/K/H/L series is unbuffered 200-pin double data rate Synchronous DRAM Small Out-
line Dual In-Line Memory Modules (SO-DIMMs) which are organized as 32Mx72 high-speed memory arrays. Hynix
HYMD232M726A(L)8-J/M/K/H/L series consists of nine 32Mx8 DDR SDRAM in 400mil TSOP II packages on a 200pin
glass-epoxy substrate.
Hynix HYMD232M726A(L)8-J/M/K/H/L series is designed for high speed of up to 166MHz and offers fully synchro-
nous operations referenced to both rising and falling edges of differential clock inputs. While all addresses and control
inputs are latched on the rising edges of the clock, Data, Data strobes and Write data masks inputs are sampled on
both rising and falling edges of it. The data paths are internally pipelined and 2-bit prefetched to achieve very high
bandwidth. All input and output voltage levels are compatible with SSTL_2. High speed frequencies, programmable
latencies and burst lengths allow variety of device operation in high performance memory system.
Hynix HYMD232M726A(L)8-J/M/K/H/L series incorporates SPD(serial presence detect). Serial presence detect func-
tion is implemented via a serial 2,048-bit EEPROM. The first 128 bytes of serial PD data are programmed by Hynix to
identify DIMM type, capacity and other the information of DIMM and the last 128 bytes are available to the customer.
FEATURES
•
•
•
•
•
•
256MB (32M x 72) Unbuffered DDR SO-DIMM
based on 32Mx8 DDR SDRAM
JEDEC Standard 200-pin small outline dual in-line
memory module (SO-DIMM)
2.5V +/- 0.2V VDD and VDDQ Power supply
All inputs and outputs are compatible with SSTL_2
interface
Fully differential clock operations (CK & /CK) with
100MHz/125MHz/133MHz/166MHz
All addresses and control inputs except Data, Data
strobes and Data masks latched on the rising edges
of the clock
Data(DQ), Data strobes and Write masks latched on
both rising and falling edges of the clock
•
•
•
•
•
•
•
•
Data inputs on DQS centers when write (centered
DQ)
Data strobes synchronized with output data for read
and input data for write
Programmable CAS Latency 2 / 2.5 supported
Programmable Burst Length 2 / 4 / 8 with both
sequential and interleave mode
tRAS Lock-out function supported
Internal four bank operations with single pulsed RAS
Auto refresh and self refresh supported
8192 refresh cycles / 64ms
•
ORDERING INFORMATION
Part No.
HYMD232M726A(L)8-J
HYMD232M726A(L)8-M
HYMD232M726A(L)8-K
HYMD232M726A(L)8-H
HYMD232M726A(L)8-L
V
DD
=2.5V
V
DDQ
=2.5V
Power Supply
Clock Frequency
166MHz (*DDR333)
133MHz (*DDR266:2-2-2)
133MHz (*DDR266A)
133MHz (*DDR266B)
100MHz (*DDR200)
Interface
Form Pactor
SSTL_2
200pin Unbuffered SO-DIMM
* JEDEC Defined Specifications compliant
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any
responsibility for use of circuits described. No patent licenses are implied.
Rev. 0.2/Oct. 02
1
HYMD232M726A(L)8-J/M/K/H/L
PIN DESCRIPTION
Pin
CK0, /CK0, CK1, /CK1
CS0, CS1
CKE0, CKE1
/RAS, /CAS, /WE
A0 ~ A12
BA0, BA1
DQ0~DQ63
DQS0~DQS7
DM0~DM7
VDD
Pin Description
Differential Clock Inputs
Chip Select Input
Clock Enable Input
Commend Sets Inputs
Address
Bank Address
Data Inputs/Outputs
Data Strobe Inputs/Outputs
Data-in Mask
Power Supply
Pin
VDDQ
VSS
VREF
VDDSPD
SA0~SA2
SCL
SDA
VDDID
DU
NC
Pin Description
DQs Power Supply
Ground
Reference Power Supply
Power Supply for SPD
E
2
PROM Address Inputs
E
2
PROM Clock
E
2
PROM Data I/O
VDD Identification Flag
Do not Use
No Connection
PIN ASSIGNMENT
Pin
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
Name
VREF
VSS
DQ0
DQ1
VDD
DQS0
DQ2
VSS
DQ3
DQ8
VDD
DQ9
DQS1
VSS
DQ10
DQ11
VDD
CK0
/CK0
VSS
DQ16
DQ17
VDD
DQS2
DQ18
Pin
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
Name
VREF
VSS
DQ4
DQ5
VDD
DM0
DQ6
VSS
DQ7
DQ12
VDD
DQ13
DM1
VSS
DQ14
DQ15
VDD
VDD
VSS
VSS
DQ20
DQ21
VDD
DM2
DQ22
Pin
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
81
83
85
87
89
91
93
95
97
99
Name
VSS
DQ19
DQ24
VDD
DQ25
DQS3
VSS
DQ26
DQ27
VDD
NC
NC
VSS
NC
NC
VDD
NC
DU
VSS
NC
NC
VDD
CKE1
NC
A12
Pin
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
82
84
86
88
90
92
94
96
98
100
Name
VSS
DQ23
DQ28
VDD
DQ29
DM3
VSS
DQ30
DQ31
VDD
NC
NC
VSS
NC
NC
VDD
NC
DU
VSS
VSS
VDD
VDD
CKE0
DU
A11
Pin
101
103
105
107
109
111
113
115
117
119
121
123
125
127
129
131
133
135
137
139
141
143
145
147
149
Name
A9
VSS
A7
A5
A3
A1
VDD
A10/AP
BA0
/WE
/CS0
DU
VSS
DQ32
DQ33
VDD
DQS4
DQ34
VSS
DQ35
DQ40
VDD
DQ41
DQS5
VSS
Pin
102
104
106
108
110
112
114
116
118
120
122
124
126
128
130
132
134
136
138
140
142
144
146
148
150
Name
A8
VSS
A6
A4
A2
A0
VDD
BA1
/RAS
/CAS
/CS1
DU
VSS
DQ36
DQ37
VDD
DM4
DQ38
VSS
DQ39
DQ44
VDD
DQ45
DM5
VSS
Pin
151
153
155
157
159
161
163
165
167
169
171
173
175
177
179
181
183
185
187
189
191
193
195
199
Name
DQ42
DQ43
VDD
VDD
VSS
VSS
DQ48
DQ49
VDD
DQS6
DQ50
VSS
DQ51
DQ56
VDD
DQ57
DQS7
VSS
DQ58
DQ59
VDD
SDA
SCL
VDDID
Pin
152
154
156
158
160
162
164
166
168
170
172
174
176
178
180
182
184
186
188
190
192
194
196
200
Name
DQ46
DQ47
VDD
/CK1
CK1
VSS
DQ52
DQ53
VDD
DM6
DQ54
VSS
DQ55
DQ60
VDD
DQ61
DM7
VSS
DQ62
DQ63
VDD
SA0
SA1
SA2
DU
197 VDDSPD 198
Rev. 0.2/Oct. 02
2
HYMD232M726A(L)8-J/M/K/H/L
ABSOLUTE MAXIMUM RATINGS
Parameter
Ambient Temperature
Storage Temperature
Voltage on Any Pin relative to V
SS
Voltage on V
DD
relative to V
SS
Voltage on V
DDQ
relative to V
SS
Output Short Circuit Current
Power Dissipation
Soldering Temperature
⋅
Time
T
A
T
STG
V
IN
, V
OUT
V
DD
V
DDQ
I
OS
P
D
T
SOLDER
Symbol
0 ~ 70
-55 ~ 125
-0.5 ~ 3.6
-0.5 ~ 3.6
-0.5 ~ 3.6
50
8
260
/
10
Rating
o
Unit
C
o
C
V
V
V
mA
W
o
C
/
Sec
Note :
Operation at above absolute maximum rating can adversely affect device reliability
DC OPERATING CONDITIONS
(TA= 0 to 70
o
C, Voltage referenced to V
SS
= 0V)
Parameter
Power Supply Voltage
Power Supply Voltage
Input High Voltage
Input Low Voltage
Termination Voltage
Reference Voltage
Symbol
V
DD
V
DDQ
V
IH
V
IL
V
TT
V
REF
Min
2.3
2.3
V
REF
+ 0.15
-0.3
V
REF
- 0.04
1.15
Typ.
2.5
2.5
-
-
V
REF
1.25
Max
2.7
2.7
V
DDQ
+ 0.3
V
REF
- 0.15
V
REF
+ 0.04
1.35
Unit
V
V
V
V
V
V
3
2
1
Note
Note :
1. V
DDQ
must not exceed the level of V
DD
.
2. V
IL
(min) is acceptable -1.5V AC pulse width with < 5ns of duration.
3. The value of V
REF
is approximately equal to 0.5V
DDQ
.
AC OPERATING CONDITIONS
(TA= 0 to 70
o
C, Voltage referenced to V
SS
= 0V)
Parameter
Input High (Logic 1) Voltage, DQ, DQS and DM signals
Input Low (Logic 0) Voltage, DQ, DQS and DM signals
Input Differential Voltage, CK and /CK inputs
Input Crossing Point Voltage, CK and /CK inputs
Symbol
V
IH(AC)
V
IL(AC)
V
ID(AC)
V
IX(AC)
0.7
0.5*V
DDQ
-0.2
Min
V
REF
+ 0.31
V
REF
- 0.31
V
DDQ
+ 0.6
0.5*V
DDQ
+0.2
Max
Unit
V
V
V
V
1
2
Note
Note :
1. VID is the magnitude of the difference between the input level on CK and the input on /CK.
2. The value of V IX is expected to equal 0.5*V DDQ of the transmitting device and must track variations in the DC level of the same.
Rev. 0.2/Oct. 02
3
HYMD232M726A(L)8-J/M/K/H/L
AC OPERATING TEST CONDITIONS
(TA=0 to 70
o
C, Voltage referenced to VSS = 0V)
Parameter
Reference Voltage
Termination Voltage
AC Input High Level Voltage (V
IH
, min)
AC Input Low Level Voltage (V
IL
, max)
Input Timing Measurement Reference Level Voltage
Output Timing Measurement Reference Level Voltage
Input Signal maximum peak swing
Input minimum Signal Slew Rate
Termination Resistor (R
T
)
Series Resistor (R
S
)
Output Load Capacitance for Access Time Measurement (C
L
)
Value
V
DDQ
x 0.5
V
DDQ
x 0.5
V
REF
+ 0.31
V
REF
- 0.31
V
REF
V
TT
1.5
1
50
25
30
Unit
V
V
V
V
V
V
V
V/ns
Ω
Ω
pF
Rev. 0.2/Oct. 02
4
HYMD232M726A(L)8-J/M/K/H/L
CAPACITANCE
(T
A
=25
o
C, f=100MHz )
Parameter
Input Capacitance
Input Capacitance
Input Capacitance
Input Capacitance
Input Capacitance
Input Capacitance
Data Input / Output Capacitance
Data Input / Output Capacitance
A0 ~ A12, BA0, BA1
/RAS, /CAS, /WE
CKE0, CKE1
/CS0, /CS1
CK0, /CK0, CK1, /CK1
DM0 ~ DM7
DQ0 ~ DQ63, DQS0 ~ DQS7
CB0 ~ CB7
Pin
Symbol
C
IN1
C
IN2
C
IN3
C
IN4
C
IN5
C
IN6
C
IO1
C
IO2
Min
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Max
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Unit
pF
pF
pF
pF
pF
pF
pF
pF
Note :
1. VDD = min. to max., VDDQ = 2.3V to 2.7V, VODC = VDDQ/2, V
O
peak-to-peak = 0.2V
2. Pins not under test are tied to GND.
3. These values are guaranteed by design and are tested on a sample basis only.
OUTPUT LOAD CIRCUIT
V
TT
R
T
=50
Ω
Output
Zo=50
Ω
V
REF
C
L
=30pF
Rev. 0.2/Oct. 02
5
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参数对比
与HYMD232M726AL8-H相近的元器件有：HYMD232M726A8-H、HYMD232M726A8-J、HYMD232M726A8-K、HYMD232M726A8-L、HYMD232M726A8-M、HYMD232M726AL8-J、HYMD232M726AL8-K、HYMD232M726AL8-L、HYMD232M726AL8-M。描述及对比如下：
型号 HYMD232M726AL8-H HYMD232M726A8-H HYMD232M726A8-J HYMD232M726A8-K HYMD232M726A8-L HYMD232M726A8-M HYMD232M726AL8-J HYMD232M726AL8-K HYMD232M726AL8-L HYMD232M726AL8-M
描述 Unbuffered DDR SO-DIMM Unbuffered DDR SO-DIMM Unbuffered DDR SO-DIMM Unbuffered DDR SO-DIMM Unbuffered DDR SO-DIMM Unbuffered DDR SO-DIMM Unbuffered DDR SO-DIMM Unbuffered DDR SO-DIMM Unbuffered DDR SO-DIMM Unbuffered DDR SO-DIMM
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
厂商名称 SK Hynix(海力士) SK Hynix(海力士) SK Hynix(海力士) SK Hynix(海力士) SK Hynix(海力士) SK Hynix(海力士) SK Hynix(海力士) SK Hynix(海力士) SK Hynix(海力士) SK Hynix(海力士)
零件包装代码 MODULE MODULE MODULE MODULE MODULE MODULE MODULE MODULE MODULE MODULE
包装说明 DIMM, DIMM200,24 DIMM, DIMM200,24 DIMM, DIMM200,24 DIMM, DIMM200,24 DIMM, DIMM200,24 DIMM, DIMM200,24 DIMM, DIMM200,24 DIMM, DIMM200,24 DIMM, DIMM200,24 DIMM, DIMM200,24
针数 200 200 200 200 200 200 200 200 200 200
Reach Compliance Code compli unknow unknow unknow unknow unknow compli compli compli compli
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST SINGLE BANK PAGE BURST
最长访问时间 0.75 ns 0.75 ns 0.7 ns 0.75 ns 0.8 ns 0.75 ns 0.7 ns 0.75 ns 0.8 ns 0.75 ns
其他特性 AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
最大时钟频率 (fCLK) 133 MHz 133 MHz 166 MHz 133 MHz 125 MHz 133 MHz 166 MHz 133 MHz 125 MHz 133 MHz
I/O 类型 COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 R-XDMA-N200 R-XDMA-N200 R-XDMA-N200 R-XDMA-N200 R-XDMA-N200 R-XDMA-N200 R-XDMA-N200 R-XDMA-N200 R-XDMA-N200 R-XDMA-N200
内存密度 2415919104 bi 2415919104 bi 2415919104 bi 2415919104 bi 2415919104 bi 2415919104 bi 2415919104 bi 2415919104 bi 2415919104 bi 2415919104 bi
内存集成电路类型 DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE
内存宽度 72 72 72 72 72 72 72 72 72 72
功能数量 1 1 1 1 1 1 1 1 1 1
端口数量 1 1 1 1 1 1 1 1 1 1
端子数量 200 200 200 200 200 200 200 200 200 200
字数 33554432 words 33554432 words 33554432 words 33554432 words 33554432 words 33554432 words 33554432 words 33554432 words 33554432 words 33554432 words
字数代码 32000000 32000000 32000000 32000000 32000000 32000000 32000000 32000000 32000000 32000000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 32MX72 32MX72 32MX72 32MX72 32MX72 32MX72 32MX72 32MX72 32MX72 32MX72
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装代码 DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM DIMM
封装等效代码 DIMM200,24 DIMM200,24 DIMM200,24 DIMM200,24 DIMM200,24 DIMM200,24 DIMM200,24 DIMM200,24 DIMM200,24 DIMM200,24
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
峰值回流温度（摄氏度） NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
刷新周期 8192 8192 8192 8192 8192 8192 8192 8192 8192 8192
自我刷新 YES YES YES YES YES YES YES YES YES YES
最大待机电流 0.18 A 0.18 A 0.18 A 0.18 A 0.18 A 0.18 A 0.18 A 0.18 A 0.18 A 0.18 A
最大压摆率 2.745 mA 2.745 mA 2.835 mA 2.745 mA 2.52 mA 2.835 mA 2.835 mA 2.745 mA 2.52 mA 2.835 mA
最大供电电压 (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
最小供电电压 (Vsup) 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 NO NO NO NO NO NO NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
端子节距 0.6 mm 0.6 mm 0.6 mm 0.6 mm 0.6 mm 0.6 mm 0.6 mm 0.6 mm 0.6 mm 0.6 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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