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HYMR13216H-840

Rambus DRAM Module, 32MX16, CMOS, RIMM-184

器件类别:存储    存储   

厂商名称:SK Hynix(海力士)

厂商官网:http://www.hynix.com/eng/

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器件参数
参数名称
属性值
厂商名称
SK Hynix(海力士)
零件包装代码
DMA
包装说明
,
针数
184
Reach Compliance Code
unknown
ECCN代码
EAR99
访问模式
BLOCK ORIENTED PROTOCOL
其他特性
SELF CONTAINED REFRESH
JESD-30 代码
R-XDMA-N184
内存密度
536870912 bit
内存集成电路类型
RAMBUS DRAM MODULE
内存宽度
16
功能数量
1
端口数量
1
端子数量
184
字数
33554432 words
字数代码
32000000
工作模式
SYNCHRONOUS
组织
32MX16
封装主体材料
UNSPECIFIED
封装形状
RECTANGULAR
封装形式
MICROELECTRONIC ASSEMBLY
认证状态
Not Qualified
自我刷新
YES
最大供电电压 (Vsup)
2.63 V
最小供电电压 (Vsup)
2.37 V
标称供电电压 (Vsup)
2.5 V
表面贴装
NO
技术
CMOS
端子形式
NO LEAD
端子位置
DUAL
文档预览
Direct Rambus RIMM
with 128/144Mbit RDRAMs
Preliminary
Overview
The Rambus
®
RIMM
TM
module is a general purpose high-
performance memory subsystem suitable for use in a broad
range of applications including computer memory, personal
computers, workstations, and other applications where high
bandwidth and low latency are required.
The Rambus RIMM module consist of 128Mb/144Mb
Direct Rambus DRAM devices. These are extremely high-
speed CMOS DRAMs organized as 8M words by 16 or 18
bits. The use of Rambus Signaling Level (RSL) technology
permits 600MHz ,711MHz or 800MHz transfer rates while
using conventional system and board design technologies.
Direct RDRAM devices are capable of sustained data
transfers at 1.25 ns per two bytes (10ns per 16 bytes).
The RDRAM architecture enables the highest sustained
bandwidth for multiple, simultaneous randomly addressed
memory transactions. The separate control and data buses
with independent row and column control yield over 95%
bus efficiency. The Direct RDRAM's 16-banks architecture
supports up to four simultaneous transactions per device.
Key Timing Parameters/Part Numbers
The following table lists the frequency and latency bins
available from RIMM modules. An optional -LP designator
is used to indicate low power modules.
Table 1: RIMM Module Frequency and Latency
Organization
x16
x16
x16
x16
x18
x18
x18
x18
I/O Freq.
MHz
600
711
800
800
600
711
800
800
t rac (Row Access
Time) ns
53
45
45
40
53
45
45
40
Features
w
High speed 800,711 and 600 MHz RDRAM storage
w
184 edge connector pads with 1 mm pad spacing
w
Maximum module PCB size: 133.5mm x 31.75mm x
1.37mm(5.21” x 1.25” x 0.05”)
w
Each RDRAM has 32 banks, for a total of 512, 384, 256,
192 or 128 banks on each 256MB, 192MB, 128MB,
96MB, or 64MB module respectively
w
Gold plated edge connector pad contacts
wSerial
Presence Detect(SPD) support
¾
w
Operates from a 2.5 volt supply (
¡
5%)
w
Low power and powerdown self refresh modes
w
Separate Row and Column buses for higher
efficiency
Form Factor
The Rambus RIMM modules are offered in a 184-pad 1mm
edge connector pad pitch from factor suitable for either 184
or 168 contact RIMM connectors. The RIMM module is
suitable for desktop and other system applications. Figure 1
shows an eight device Rambus RIMM module without heat
spreader.
This document is a general product description and is subject to change without notice. Hyundai Electronics does not assume any
responsibility for use of circuits described. No patent licenses are implied.
Rev. 1.0/Dec.99
1
RIMM with 128/144Mb RDRAM
Table 2: Module Pad Number and Signal Names
Pin
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
A24
A25
A26
A27
A28
A29
A30
A31
A32
A33
A34
A35
A36
A37
A38
A39
A40
A41
A42
A43
A44
A45
A46
2
Pin Name
Gnd
LDQA8
Gnd
LDQA6
Gnd
LDQA4
Gnd
LDQA2
Gnd
LDQA0
Gnd
LCTMN
Gnd
LCTM
Gnd
NC
Gnd
LROW1
Gnd
LCOL4
Gnd
LCOL2
Gnd
LCOL0
Gnd
LDQB1
Gnd
LDQB3
Gnd
LDQB5
Gnd
LDQB7
Gnd
LSCK
Vcmos
SOUT
Vcmos
NC
Gnd
NC
Vdd
Vdd
NC
NC
NC
NC
Pin
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
B14
B15
B16
B17
B18
B19
B20
B21
B22
B23
B24
B25
B26
B27
B28
B29
B30
B31
B32
B33
B34
B35
B36
B37
B38
B39
B40
B41
B42
B43
B44
B45
B46
Pin Name
Gnd
LDQA7
Gnd
LDQA5
Gnd
LDQA3
Gnd
LDQA1
Gnd
LCFM
Gnd
LCFMN
Gnd
NC
Gnd
LROW2
Gnd
LROW0
Gnd
LCOL3
Gnd
LCOL1
Gnd
LDQB0
Gnd
LDQB2
Gnd
LDQB4
Gnd
LDQB6
Gnd
LDQB8
Gnd
LCMD
Vcmos
SIN
Vcmos
NC
Gnd
NC
Vdd
Vdd
NC
NC
NC
NC
Pin
A47
A48
A49
A50
A51
A52
A53
A54
A55
A56
A57
A58
A59
A60
A61
A62
A63
A64
A65
A66
A67
A68
A69
A70
A71
A72
A73
A74
A75
A76
A77
A78
A79
A80
A81
A82
A83
A84
A85
A86
A87
A88
A89
A90
A91
A92
Pin Name
NC
NC
NC
NC
Vref
Gnd
SCL
Vdd
SDA
SVdd
SWP
Vdd
RSCK
Gnd
RDQB7
Gnd
RDQB5
Gnd
RDQB3
Gnd
RDQB1
Gnd
RCOL0
Gnd
RCOL2
Gnd
RCOL4
Gnd
RROW1
Gnd
NC
Gnd
RCTM
Gnd
RCTMN
Gnd
RDQA0
Gnd
RDQA2
Gnd
RDQA4
Gnd
RDQA6
Gnd
RDQA8
Gnd
Pin
B47
B48
B49
B50
B51
B52
B53
B54
B55
B56
B57
B58
B59
B60
B61
B62
B63
B64
B65
B66
B67
B68
B69
B70
B71
B72
B73
B74
B75
B76
B77
B78
B79
B80
B81
B82
B83
B84
B85
B86
B87
B88
B89
B90
B91
B92
Pin Name
NC
NC
NC
NC
Vref
Gnd
SA0
Vdd
SA1
SVdd
SA2
Vdd
RCMD
Gnd
RDQB8
Gnd
RDQB6
Gnd
RDQB4
Gnd
RDQB2
Gnd
RDQB0
Gnd
RCOL1
Gnd
RCOL3
Gnd
RROW0
Gnd
RROW2
Gnd
NC
Gnd
RCFMN
Gnd
RCFM
Gnd
RDQA1
Gnd
RDQA3
Gnd
RDQA5
Gnd
RDQA7
Gnd
Rev.1.0 Dec.99
RIMM with 128/144Mb RDRAM
Table 3: Module Connector Pad Description
Signal
Gnd
Module Connector Pads
A1, A3, A5, A7, A9, A11, A13, A15,
A17, A19, A21, A23, A25, A27, A29,
A31, A33, A39, A52, A60, A62, A64,
A66, A68, A70, A72, A74, A76, A78,
A80, A82, A84, A86, A88, A90, A92,
B1, B3, B5, B7, B9, B11, B13, B15,
B17, B19, B21, B23, B25, B27, B29,
B31, B33, B39, B52, B60, B62, B64,
B66, B68, B70, B72, B74, B76, B78,
B80, B82, B84, B86, B88, B90, B92
B10
B12
B34
A20, B20, A22, B22, A24
A14
A12
I
I
I
I
I
I
RSL
RSL
V
CMOS
RSL
RSL
RSL
I/O Type
Description
Ground reference for RDRAM core and interface.
72 PCB connector pads.
LCFM
LCFMN
LCMD
LCOL4..
LCOL0
LCTM
LCTMN
Clock from master. Interface clock used for receiv-
ing RSL signals from the Channel. Positive polarity.
Clock from master. Interface clock used for receiv-
ing RSL signals from the Channel. Negative polarity.
Serial Command used to read from and write to the
control registers. Also used for power management.
Column bus. 5-bit bus containing control and add-
ress information for column accesses.
Clock to master. Interface clock used for transmit-
ting RSL signals to the Channel. Positive polarity.
Clock to master. Interface clock used for transmit-
ting RSL signals to the Channel. Negative polarity.
Data bus A. A 9-bit bus carrying a byte of read or
write data between the Channel and the RDRAM.
LDQA8 is non-functional on x16 RDRAM devices.
Data bus B. A 9-bit bus carrying a byte of read or
write data between the Channel and the RDRAM.
LDQB8 is non-functional on x16 RDRAM devices.
Row bus. 3-bit bus containing control and address
information for row accesses.
Serial Clock input. Clock source used to read from
and write to the RDRAM control registers.
These pads are not connected. These 8 connector
pads are reserved for future use.
These pads are not connected. These 16connector
pads art reserved for future use. The 168 contact
RIMM connector does not connect to these PCB
pads.
LDQA8.. A2, B2, A4, B4, A6, B6, A8, B8, A10
I/O
LDQA0
LDQB8..
LDQB0
B32, A32, B30, A30, B28, A28, B26,
A26, B24
RSL
I/O
RSL
LROW2.. B16, A18, B18
LROW0
LSCK
NC
NC
A34
A16, B14, A38, B38, A40, B40, A77,
B79
A43, B43, A44, B44, A45, B45, A46,
B46, A47, B47, A48, B48, A49, B49,
A50, B50
B83
B81
I
I
RSL
V
CMOS
RCFM
RCFMN
I
RSL
Clock from master. Interface clock used for receiv-
ing RSL signals from the Channel. Positive polarity.
Clock from master. Interface clock used for receiv-
ing RSL signals from the Channel. Negative polar-
ity.
3
I
RSL
Rev.1.0 Dec.99
RIMM with 128/144Mb RDRAM
Signal
RCMD
Module Connector Pads
B59
I
RCOL4..
RCOL0
RCTM
RCTMN
A73, B73, A71, B71, A69
A79
A81
V
CMOS
I/O Type
Description
Serial Command Input used to read from and write
to the control registers. Also used for power
management.
Column bus. 5-bit bus containing control and
address information for column accesses.
Clock to master. Interface clock used for transmit-
ting RSL signals to the Channel. Positive polarity.
Clock to master. Interface clock used for transmit-
ting RSL signals to the Channel. Negative polarity.
Data bus A. A 9-bit bus carrying a byte of read or
write data between the Channel and the RDRAM.
RDQA8 is non-functional on x16 RDRAM devices.
Data bus B. A 9-bit bus carrying a byte of read or
write data between the Channel and the RDRAM.
RDQB8 is non-functional on x16 RDRAM devices.
Row bus. 3-bit bus containing control and address
information for row accesses.
Serial Clock input. Clock source used to read from
and write to the RDRAM control registers.
Serial Presence Detect Address 0.
Serial Presence Detect Address 1.
Serial Presence Detect Address 2.
Serial Presence Detect Clock.
Serial Presence Detect Data (Open Collector I/O)
Serial I/O for reading from and writing to the control
registers. Attaches to SIO0 of the first RDRAM on
the module.
Serial I/O for reading from and writing to the control
registers. Attaches to SIO1 of the last RDRAM on
the module.
SPD Voltage. Used for signals SCL, SDA, SWE,
SA0, SA1 and SA2.
I
SV
DD
Serial Presence Detect Write Protect (active high).
When low, the SPD can be written as well as read.
CMOS I/O Voltage. Used for signals CMD, SCK,
SIN, SOUT.
I
Supply voltage for the RDRAM core and interface
logic.
Logic threshold reference voltage for RSL signals.
I
I
I
RSL
RSL
RSL
RDQA8.. A91, B91, A89, B89, A87, B87, A85,
I/O
RDQA0 B85, A83
RDQB8..
RDQB0
B61, A61, B63, A63, B65, A65, B67,
I/O
A67, B69
RSL
RSL
RROW2.. B77, A75, B75
RROW0
RSCK
SA0
SA1
SA2
SCL
SDA
SIN
A59
B53
B55
B57
A53
A55
B36
I
I
I
I
I
I
I/O
RSL
V
CMOS
SV
DD
SV
DD
SV
DD
SV
DD
SV
DD
I/O V
CMOS
SOUT
A36
I/O V
CMOS
SV
DD
SWP
V
CMOS
Vdd
Vref
A56, B56
A57
A35, B35, A37, B37
A41, A42, A54, A58, B41, B42, B54,
B58
A51, B51
4
Rev.1.0 Dec.99
RIMM with 128/144Mb RDRAM
Note 1: Rambus Channel signals form a loop through the RIMM module, with the exception of the SIO chain.
Note 2: See Serial Presence Detection Specification for information on the SPD device and its contents
SIO0
SIO1
SCK
CMD
Vref
SIO0
SIO1
SCK
CMD
Vref
SIO0
SIO1
SCK
CMD
Vref
SIO0
SIO1
SCK
CMD
Vref
LDQA8
LDQA7
LDQA6
LDQA5
LDQA4
LDQA3
LDQA2
LDQA1
LDQA0
LCFM
LCFMN
LCTM
LCTMN
LROW2
LROW1
LROW0
LCOL4
LCOL3
LCOL2
LCOL1
LCOL0
LDQB0
LDQB1
LDQB2
LDQB3
LDQB4
LDQB5
LDQB6
LDQB7
LDQB8
DQA8
DQA7
DQA6
DQA5
DQA4
DQA3
DQA2
DQA1
DQA0
CFM
CFMN
CTM
CTMN
ROW2
ROW1
ROW0
COL4
COL3
COL2
COL1
COL0
DQB0
DQB1
DQB2
DQB3
DQB4
DQB5
DQB6
DQB7
DQB8
DQA8
DQA7
DQA6
DQA5
DQA4
DQA3
DQA2
DQA1
DQA0
CFM
CFMN
CTM
CTMN
ROW2
ROW1
ROW0
COL4
COL3
COL2
COL1
COL0
DQB0
DQB1
DQB2
DQB3
DQB4
DQB5
DQB6
DQB7
DQB8
DQA8
DQA7
DQA6
DQA5
DQA4
DQA3
DQA2
DQA1
DQA0
CFM
CFMN
CTM
CTMN
ROW2
ROW1
ROW0
COL4
COL3
COL2
COL1
COL0
DQB0
DQB1
DQB2
DQB3
DQB4
DQB5
DQB6
DQB7
DQB8
DQA8
DQA7
DQA6
DQA5
DQA4
DQA3
DQA2
DQA1
DQA0
CFM
CFMN
CTM
CTMN
ROW2
ROW1
ROW0
COL4
COL3
COL2
COL1
COL0
DQB0
DQB1
DQB2
DQB3
DQB4
DQB5
DQB6
DQB7
DQB8
RDQA8
RDQA7
RDQA6
RDQA5
RDQA4
RDQA3
RDQA2
RDQA1
RDQA0
RCFM
RCFMN
RCTM
RCTMN
RROW2
RROW1
RROW0
RCOL4
RCOL3
RCOL2
RCOL1
RCOL0
RDQB0
RDQB1
RDQB2
RDQB3
RDQB4
RDQB5
RDQB6
RDQB7
RDQB8
Direct RDRAM (128/144Mb) UN
Direct RDRAM (128/144Mb) U1
Direct RDRAM (128/144Mb) U2
Direct RDRAM (128/144Mb) U3
Serial Presence Detect
SCL
SWP
SCL
SDA
WP
A0A1A2
V
cc
SDA
1 per
2 RDRAMs SV
DD
0.1§
Þ
SA0
SA1
SA2
Gnd
V
REF
16
12
N
8
6
LSCK
LCMD
V
REF
RLSCK
256MB
192MB
128MB
96MB
64MB
Rev.1.0 Dec.99
RCMD
Module
Capacity
4
SIN
SOUT
Gnd
Vdd
Figure 2: RIMM Module Functional Diagram
V
CMOS
1 per
2 RDRAMs
Plus one
Near Connector
0.1§
Þ
Gnd
2 per
RDRAM
0.1§
Þ
Gnd
SV
DD
0.1§
Þ
5
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