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HZT33

VOLTAGE REFERENCE DIODE, DO-35

器件类别:分立半导体    二极管   

厂商名称:Renesas(瑞萨电子)

厂商官网:https://www.renesas.com/

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器件参数
参数名称
属性值
Brand Name
Renesas
是否Rohs认证
不符合
厂商名称
Renesas(瑞萨电子)
零件包装代码
DO-35
包装说明
GLASS, SC-40, 2 PIN
针数
2
Reach Compliance Code
unknown
ECCN代码
EAR99
其他特性
HIGH RELIABILITY
外壳连接
ISOLATED
配置
SINGLE
二极管元件材料
SILICON
二极管类型
ZENER DIODE
JEDEC-95代码
DO-35
JESD-30 代码
O-LALF-W2
JESD-609代码
e0
元件数量
1
端子数量
2
封装主体材料
GLASS
封装形状
ROUND
封装形式
LONG FORM
峰值回流温度(摄氏度)
240
最大功率耗散
0.2 W
认证状态
Not Qualified
标称参考电压
33 V
表面贴装
NO
技术
ZENER
端子面层
Tin/Lead (Sn/Pb)
端子形式
WIRE
端子位置
AXIAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
电压温度Coeff-Max
1 mV/°C
最大电压容差
6.06%
Base Number Matches
1
文档预览
HZT33
Monolithic IC Zener Diode for Temperature Compensation
REJ03G1220-0500
(Previous: ADE-208-135D)
Rev.5.00
Jun 23, 2005
Features
Lower temperature coefficient of the reference voltage.
Lower dynamic resistance.
High reliability with glass seal.
Ordering Information
Type No.
HZT33
Cathode band
Navy Blue
Mark
HZT33
Package Name
DO-35
Package Code
(Previous Code)
GRZZ0002ZB-A
(DO-35)
Pin Arrangement
1
HZT
33
2
1. Cathode
2. Anode
Cathode band
Rev.5.00 Jun 23, 2005 page 1 of 4
HZT33
Absolute Maximum Ratings
(Ta = 25°C)
Item
Power dissipation
Operation temperature
Storage temperature
Note: Value at Ta = 75°C.
Pd *
Topr
Tstg
Symbol
Value
200
−20
to +75
−40
to +175
Unit
mW
°C
°C
Electrical Characteristics
(Ta = 25°C)
Item
Zener Voltage
Dynamic resistance
Temperature coefficient
Symbol
V
Z
r
d
γ
Z
Min
31.0
Typ
1.0 *
1
Max
35.0
25.0
Unit
V
mV/°C
Test Condition
I
Z
= 5 mA
I
Z
= 5 mA, f = 1 KHz
* I
Z
= 5 mA
Ta =
−20
to +25 to +75°C
2
Notes: 1. Type Value of
γ
Z
: 1.0 mV/°C
2. Definition of
γ
Z
γ
Z
based on Ta = + 25°C and the temperature coefficient with each temperature.
(Range of operation temperature)
Rev.5.00 Jun 23, 2005 page 2 of 4
HZT33
Main Characteristic
10
–2
500
5mm
2.5 mm
3 mm
Power Dissipation Pd (mW)
400
Printed circuit board
100
×
180
×
1.6t mm
Quality: paper phenol
Zener Current I
Z
(A)
10
–3
Ta = 25°C
300
200
10
–4
100
10
–5
20
25
30
Zener Voltage V
Z
(V)
35
0
0
50
Ambient Temperature Ta (°C)
100
Fig.1 Zener current vs. Zener voltage
Fig.2 Power Dissipation vs. Ambient Temperature
Rev.5.00 Jun 23, 2005 page 3 of 4
HZT33
Package Dimensions
JEITA Package Code
SC-40
RENESAS Code
GRZZ0002ZB-A
Previous Code
DO-35 / DO-35V
MASS[Typ.]
0.13g
L
E
L
φb
φD
Reference
Dimension in Millimeters
Symbol
φb
φD
E
L
Min
-
-
-
26.0
Nom
0.5
2.0
-
-
Max
-
-
4.2
-
Rev.5.00 Jun 23, 2005 page 4 of 4
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology
Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co.,
Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology (Shanghai) Co.,
Ltd.
Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China
Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> 2-796-3115, Fax: <82> 2-796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd.
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
© 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
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