F-210-1 SUPPLEMENT
IC–422–ZHGG
MOLD
-TO-P
PROD OSITION
UCT
Minimu
m
(2,54mm) .100"
IC SERIES
s
may ap or set-up cha
r
ply. Ca
ll Samt ges
ec.
IC–308–SGT
SCREW MOUNT DIP SOCKETS
Mates with:
APA
Highest
reliability DIP
sockets
IC series DIP sockets
feature U.L. rated
G.F. polyester body with
mounting holes and use
precision machined lead
sockets for high reliability
in the most demanding
applications.
TYPE
SOCKET
ROW SPACING &
NO. OF CONTACTS
IC
= IC
Socket
–S*, –A*, or –J
= Printed Circuit
* For LIF Specify –ZS or –ZA
SPECIFICATIONS
Insulator Material:
Black Glass Filled
Polyester
Flammability Rating:
UL 94V-0
Insulation Resistance:
5000 megohm @ 500 VDC
Temperature Range:
-55°C to +125°C
Withstanding Voltage:
1000 VRMS@60 Hz
Contact:
BeCu
Shell:
Brass except style K
Phosphor Bronze
Plating:
Au over 50µ" Ni or Sn over
100µ" Cu or 50µ" Ni
Current Rating:
1 amp continuous @
100 VDC per contact
Contact Resistance:
10 milliohms @ 200 milliamp
Socket Retention in Body:
5 Ibs against barb
Lead Size Range:
.015" to .022" DIA
and most IC leads
Insertion Force:
Standard = 9 oz avg, 16 oz
max (.017" DIA probe); Low
Insertion Force = 2.5 oz avg,
5.5 oz max (.018" DIA probe)
Withdrawal Force:
Standard = 2.5 oz avg, 1.5 oz
min (after 12 insertions with
.017" DIA probe); Low Insertion
Force = 2.0 oz avg, 0.35 oz min
(after 12 insertions with .018"
DIA probe)
–306
= .300 Row / 6 Contacts
–308
= .300 Row / 8 Contacts
–310
= .300 Row / 10 Contacts
IC-306
IC-308
*IC-310
IC-314
IC-316
IC-318
IC-320
IC-324
IC-422
IC-424
–314
= .300 Row / 14 Contacts
–316
= .300 Row / 16 Contacts
–318
= .300 Row / 18 Contacts
–320
= .300 Row / 20 Contacts
–324
= .300 Row / 24 Contacts
–422
= .400 Row / 22 Contacts
–424
= .400 Row / 24 Contacts
.093 ± .003
DIA THRU
.187 ± .003
C-BORE
.083 DP
(7,62)
.300
(2,54)
.100 TYP
(3,18)
.125
.093 ± .003
DIA THRU
.187 ± .003
C-BORE
.083 DP (7,64) .300
or
(10,16) .400
(2,54)
.100 TYP
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
(3,18)
.125
WWW.SAMTEC.COM
F-210-1 SUPPLEMENT
MOLD
-TO-P
PROD OSITION
UCT
Minimu
m
s
may ap or set-up cha
r
ply. Ca
ll Samt ges
ec.
IC–618–SGT
IC–314–WGT
LEAD
STYLE
PLATING
OPTION
(Leave Blank for
Standard Version)
OPTION
–W
= Wire-Wrap
For LIF Specify –ZW
–ZE, –ZH
= Elevated
For LIF Specify –ZE or –ZH
Requires
Style
–S or –ZS
and
.035"± .003"
board hole.
Requires GT
plating option
–610
= .600 Row / 10 Contacts
–614
= .600 Row / 14 Contacts
–616
= .600 Row / 16 Contacts
–618
= .600 Row / 18 Contacts
–624
= .600 Row / 24 Contacts
–628
= .600 Row / 28 Contacts
–632
= .600 Row / 32 Contacts
–640
= .600 Row / 40 Contacts
–940
= .900 Row / 40 Contacts
–950
= .900 Row / 50 Contacts
–964
= .900 Row / 64 Contacts
IC-624
IC-628
IC-632
IC-640
*IC-940
*†IC-950
IC-964
WWW.SAMTEC.COM
单片机
