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IC41C82052-50T

Fast Page DRAM, 2MX8, 50ns, CMOS, PDSO28, 0.400 INCH, TSOP2-28

器件类别:存储    存储   

厂商名称:Integrated Silicon Solution ( ISSI )

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Integrated Silicon Solution ( ISSI )
包装说明
0.400 INCH, TSOP2-28
Reach Compliance Code
compliant
访问模式
FAST PAGE
最长访问时间
50 ns
其他特性
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O 类型
COMMON
JESD-30 代码
R-PDSO-G28
JESD-609代码
e0
内存密度
16777216 bit
内存集成电路类型
FAST PAGE DRAM
内存宽度
8
功能数量
1
端口数量
1
端子数量
28
字数
2097152 words
字数代码
2000000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
2MX8
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装等效代码
TSOP28,.46
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
电源
5 V
认证状态
Not Qualified
刷新周期
2048
自我刷新
NO
最大待机电流
0.001 A
最大压摆率
0.12 mA
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
文档预览
IC41C82052
IC41LV82052
2M x 8 (16-MBIT) DYNAMIC RAM
WITH .AST PAGE MODE
.EATURES
• .AST Page Mode access cycle
• TTL compatible inputs and outputs
• Refresh Interval:
-- 2,048 cycles/32 ms
• Refresh Mode:
4)5-Only,
+)5-before-4)5
(CBR), and Hidden
• JEDEC standard pinout
• Single power supply:
5V±10% or 3.3V ± 10%
• Byte Write and Byte Read operation via
+)5
DESCRIPTION
The
1+51
82052 Series is a 2,097,152 x 8-bit high-performance
CMOS Dynamic Random Access Memory. The .ast Page
Mode allows 2,048 random accesses within a single row with
access cycle time as short as 20 ns per 8-bit word.
These features make the 82052 Series ideally suited for high-
bandwidth graphics, digital signal processing, high-performance
computing systems, and peripheral applications.
The 82052 Series is packaged in a 28-pin 300mil SOJ and a 28
pin TSOP-2
PRODUCT SERIES OVERVIEW
Part No.
IC41C82052
IC41LV82052
Refresh
2K
2K
Voltage
5V ± 10%
3.3V ± 10%
KEY TIMING PARAMETERS
Parameter
RAS
Access Time (t
RAC
)
CAS
Access Time (t
CAC
)
Column Address Access Time (t
AA
)
EDO Page Mode Cycle Time (t
PC
)
Read/Write Cycle Time (t
RC
)
-50
50
13
25
20
84
-60
60
15
30
25
104
Unit
ns
ns
ns
ns
ns
PIN CON.IGURATION
28 Pin SOJ, TSOP-2
VCC
I/O0
I/O1
I/O2
I/O3
WE
RAS
NC
A10
A0
A1
A2
A3
VCC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
GND
I/O7
I/O6
I/O5
I/O4
CAS
OE
A9
A8
A7
A6
A5
A4
GND
PIN DESCRIPTIONS
A0-A10
I/O0-7
WE
OE
RAS
CAS
Vcc
GND
NC
Address Inputs
Data Inputs/Outputs
Write Enable
Output Enable
Row Address Strobe
Column Address Strobe
Power
Ground
No Connection
ICSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors
which may appear in this publication. © Copyright 2000, Integrated Circuit Solution Inc.
Integrated Circuit Solution Inc.
DR015-0A 06/12/2001
1
IC41C82052
IC41LV82052
.UNCTIONAL BLOCK DIAGRAM
OE
WE
CAS
CONTROL
LOGIC
WE
CONTROL
LOGICS
OE
CONTROL
LOGIC
OE
CAS
CAS
WE
RAS
RAS
CLOCK
GENERATOR
DATA I/O BUS
REFRESH
COUNTER
DATA I/O BUFFERS
ROW DECODER
RAS
COLUMN DECODERS
SENSE AMPLIFIERS
I/O0-I/O7
MEMORY ARRAY
2,097,152 x 8
ADDRESS
BUFFERS
A0-A10
TRUTH TABLE
.unction
Standby
Read
Write: Word (Early Write)
Read-Write
Hidden Refresh
RAS-Only
Refresh
CBR Refresh
Note:
1. EARLY WRITE only.
Read
Write
(1)
RAS
H
L
L
L
L→H→L
L→H→L
L
H→L
CAS
H
L
L
L
L
L
H
L
WE
X
H
L
H→L
H
L
X
X
OE
X
L
X
L→H
L
X
X
X
Address t
R
/t
C
I/O
X
High-Z
ROW/COL
D
OUT
ROW/COL
D
IN
ROW/COL
D
OUT
, D
IN
ROW/COL
D
OUT
ROW/COL
D
OUT
ROW/NA
High-Z
X
High-Z
2
Integrated Circuit Solution Inc.
DR015-0A 06/12/2001
IC41C82052
IC41LV82052
.unctional Description
The IC41C82052 and IC41LV82052 are CMOS DRAMs
optimized for high-speed bandwidth, low power
applications. During READ or WRITE cycles, each bit is
uniquely addressed through the 11 address bits. These
are entered 11 bits (A0-A10) at a time for the 2K refresh
device. The row address is latched by the Row Address
Strobe (RAS). The column address is latched by the
Column Address Strobe (CAS).
RAS
is used to latch the
first nine bits and
CAS
is used the latter ten bits.
Refresh Cycle
To retain data, 2,048 refresh cycles are required in each
32 ms period. There are two ways to refresh the memory:
1. By clocking each of the 2,048 row addresses (A0
through A10) with RAS at least once every 32 ms. Any
read, write, read-modify-write or RAS-only cycle re-
freshes the addressed row.
2. Using a
CAS-before-RAS
refresh cycle.
CAS-before-
RAS
refresh is activated by the falling edge of
RAS,
while holding
CAS
LOW. In
CAS-before-RAS
refresh
cycle, an internal 11-bit counter provides the row ad-
dresses and the external address inputs are ignored.
CAS-before-RAS
is a refresh-only mode and no data
access or device selection is allowed. Thus, the output
remains in the High-Z state during the cycle.
Memory Cycle
A memory cycle is initiated by bring
RAS
LOW and it is
terminated by returning both
RAS
and
CAS
HIGH. To
ensures proper device operation and data integrity any
memory cycle, once initiated, must not be ended or
aborted before the minimum t
RAS
time has expired. A new
cycle must not be initiated until the minimum precharge
time t
RP
, t
CP
has elapsed.
Power-On
After application of the V
CC
supply, an initial pause of
200 µs is required followed by a minimum of eight initial-
ization cycles (any combination of cycles containing a
RAS
signal).
During power-on, it is recommended that
RAS
track with
V
CC
or be held at a valid V
IH
to avoid current surges.
Read Cycle
A read cycle is initiated by the falling edge of
CAS
or
OE,
whichever occurs last, while holding
WE
HIGH. The
column address must be held for a minimum time specified
by t
AR
. Data Out becomes valid only when t
RAC
, t
AA
, t
CAC
and t
OEA
are all satisfied. As a result, the access time is
dependent on the timing relationships between these
parameters.
Write Cycle
A write cycle is initiated by the falling edge of
CAS
and
WE,
whichever occurs last. The input data must be valid at or
before the falling edge of
CAS
or
WE,
whichever occurs
last.
Integrated Circuit Solution Inc.
DR015-0A 06/12/2001
3
IC41C82052
IC41LV82052
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol
V
T
V
CC
I
OUT
P
D
T
A
T
STG
Parameters
Voltage on Any Pin Relative to GND
Supply Voltage
Output Current
Power Dissipation
Commercial Operation Temperature
Storage Temperature
5V
3.3V
5V
3.3V
Rating
–1.0 to +7.0
–0.5 to +4.6
–1.0 to +7.0
–0.5 to +4.6
50
1
0 to +70
–55 to +125
Unit
V
V
mA
W
°C
°C
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent
damage to the device. This is a stress rating only and functional operation of the device at these
or any other conditions above those indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating conditions for extended periods may affect
reliability.
RECOMMENDED OPERATING CONDITIONS
(Voltages are referenced to GND.)
Symbol
V
CC
V
IH
V
IL
T
A
Parameter
Supply Voltage
Input High Voltage
Input Low Voltage
Commercial Ambient Temperature
5V
3.3V
5V
3.3V
5V
3.3V
Min.
4.5
3.0
2.4
2.0
–1.0
–0.3
0
Typ.
5.0
3.3
—
—
—
—
—
Max.
5.5
3.6
V
CC
+ 1.0
V
CC
+ 0.3
0.8
0.8
70
Unit
V
V
V
°C
CAPACITANCE
(1,2)
Symbol
C
IN
1
C
IN
2
C
IO
Parameter
Input Capacitance: A0-A10
Input Capacitance:
RAS, CAS, WE, OE
Data Input/Output Capacitance: I/O0-I/O7
Max.
5
7
7
Unit
p.
p.
p.
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: T
A
= 25°C, f = 1 MHz.
4
Integrated Circuit Solution Inc.
DR015-0A 06/12/2001
IC41C82052
IC41LV82052
ELECTRICAL CHARACTERISTICS
(1)
(Recommended Operating Conditions unless otherwise noted.)
Symbol
I
IL
I
IO
V
OH
V
OL
I
CC
1
I
CC
2
I
CC
3
Parameter
Input Leakage Current
Output Leakage Current
Output High Voltage Level
Output Low Voltage Level
Standby Current: TTL
Standby Current: CMOS
Operating Current:
Random Read/Write
(2,3,4)
Average Power Supply Current
Operating Current:
.ast Page Mode
(2,3,4)
Average Power Supply Current
Refresh Current:
RAS-Only
(2,3)
Average Power Supply Current
Refresh Current:
CBR
(2,3,5)
Average Power Supply Current
Test Condition
Any input 0V < V
IN
< Vcc
Other inputs not under test = 0V
Output is disabled (Hi-Z)
0V < V
OUT
< Vcc
I
OH
= –5.0 mA with V
CC
=5V
I
OH
= –2.0 mA with V
CC
=3.3V
I
OL
= 4.2 mA with V
CC
=5V
I
OL
= 2 mA with V
CC
=3.3V
RAS, CAS
> V
IH
RAS, CAS
> V
CC
– 0.2V
RAS, CAS,
Address Cycling, t
RC
= t
RC
(min.)
RAS
= V
IL
,
CAS,
t
RC
= t
RC
(min.)
RAS
Cycling,
CAS
> V
IH
t
RC
= t
RC
(min.)
RAS, CAS
Cycling
t
RC
= t
RC
(min.)
5V
3.3V
5V
3.3V
-50
-60
-50
-60
-50
-60
-50
-60
Speed
Min.
–5
–5
2.4
—
—
—
—
—
—
—
—
—
—
—
—
—
Max.
5
5
—
0.4
2
0.5
1
0.5
120
110
90
80
120
110
120
110
Unit
µA
µA
V
V
mA
mA
mA
I
CC
4
mA
I
CC
5
mA
I
CC
6
mA
Notes:
1. An initial pause of 200 µs is required after power-up followed by eight
RAS
refresh cycles (RAS-Only or CBR) before proper device
operation is assured. The eight
RAS
cycles wake-up should be repeated any time the t
RE.
refresh requirement is exceeded.
2. Dependent on cycle rates.
3. Specified values are obtained with minimum cycle time and the output open.
4. Column-address is changed once each EDO page cycle.
5. Enables on-chip refresh and address counters.
Integrated Circuit Solution Inc.
DR015-0A 06/12/2001
5
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