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ICM7218CIJI/BI

Display Driver, 7-Segment, CMOS, CDIP28

器件类别:模拟混合信号IC    驱动程序和接口   

厂商名称:General Electric Solid State

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
General Electric Solid State
包装说明
DIP, DIP28,.6
Reach Compliance Code
unknown
其他特性
COMMON-ANODE
显示模式
SEGMENT
JESD-30 代码
R-XDIP-T28
JESD-609代码
e0
位数/字符
8-DIGIT
区段数
7
端子数量
28
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
CERAMIC
封装代码
DIP
封装等效代码
DIP28,.6
封装形状
RECTANGULAR
封装形式
IN-LINE
电源
5 V
标称供电电压
5 V
表面贴装
NO
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
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参数对比
与ICM7218CIJI/BI相近的元器件有:ICM7218BIPI、ICM7218AIJI、ICM7218AIJI/HR、ICM7218AIJI/BI、ICM7218BIJI/HR、ICM7218BIJI/BI、ICM7218CIJI、ICM7218CIJI/HR。描述及对比如下:
型号 ICM7218CIJI/BI ICM7218BIPI ICM7218AIJI ICM7218AIJI/HR ICM7218AIJI/BI ICM7218BIJI/HR ICM7218BIJI/BI ICM7218CIJI ICM7218CIJI/HR
描述 Display Driver, 7-Segment, CMOS, CDIP28 Display Driver, 7-Segment, CMOS, PDIP28, Display Driver, 7-Segment, CMOS, CDIP28, Display Driver, 7-Segment, CMOS, CDIP28 Display Driver, 7-Segment, CMOS, CDIP28 Display Driver, 7-Segment, CMOS, CDIP28 Display Driver, 7-Segment, CMOS, CDIP28 Display Driver, 7-Segment, CMOS, CDIP28, Display Driver, 7-Segment, CMOS, CDIP28
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
包装说明 DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknow
其他特性 COMMON-ANODE COMMON-CATHODE COMMON-ANODE COMMON-ANODE COMMON-ANODE COMMON-CATHODE COMMON-CATHODE COMMON-ANODE COMMON-ANODE
显示模式 SEGMENT SEGMENT SEGMENT SEGMENT SEGMENT SEGMENT SEGMENT SEGMENT SEGMENT
JESD-30 代码 R-XDIP-T28 R-PDIP-T28 R-XDIP-T28 R-XDIP-T28 R-XDIP-T28 R-XDIP-T28 R-XDIP-T28 R-XDIP-T28 R-XDIP-T28
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0
位数/字符 8-DIGIT 8-DIGIT 8-DIGIT 8-DIGIT 8-DIGIT 8-DIGIT 8-DIGIT 8-DIGIT 8-DIGIT
区段数 7 7 7 7 7 7 7 7 7
端子数量 28 28 28 28 28 28 28 28 28
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 CERAMIC PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
封装代码 DIP DIP DIP DIP DIP DIP DIP DIP DIP
封装等效代码 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6 DIP28,.6
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
标称供电电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO NO NO NO NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
端子节距 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
厂商名称 General Electric Solid State - General Electric Solid State General Electric Solid State General Electric Solid State General Electric Solid State General Electric Solid State General Electric Solid State General Electric Solid State
认证状态 - Not Qualified Not Qualified Not Qualified - Not Qualified - Not Qualified Not Qualified
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器件捷径:
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ
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