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ICM7555IBAT

Analog Waveform Generation Function, CMOS, PDSO8,

器件类别:模拟混合信号IC    信号电路   

厂商名称:General Electric Solid State

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
General Electric Solid State
包装说明
SOP, SOP8,.25
Reach Compliance Code
unknown
JESD-30 代码
R-PDSO-G8
JESD-609代码
e0
端子数量
8
最高工作温度
85 °C
最低工作温度
-20 °C
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装等效代码
SOP8,.25
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
电源
5/15 V
认证状态
Not Qualified
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子面层
Tin/Lead (Sn/Pb)
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
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参数对比
与ICM7555IBAT相近的元器件有:ICM7556MJD/883B、ICM7556MJD/C、ICM7556MJD/HR、ICM7555MTV/HR、ICM7555MTV/883B、ICM7555MTY、ICM7556MJD、ICM7555CBA-T、ICM7555IBA。描述及对比如下:
型号 ICM7555IBAT ICM7556MJD/883B ICM7556MJD/C ICM7556MJD/HR ICM7555MTV/HR ICM7555MTV/883B ICM7555MTY ICM7556MJD ICM7555CBA-T ICM7555IBA
描述 Analog Waveform Generation Function, CMOS, PDSO8, Analog Waveform Generation Function, CMOS, CDIP14, Analog Waveform Generation Function, CMOS, CDIP14 Analog Waveform Generation Function, CMOS, CDIP14 Analog Waveform Generation Function, CMOS, MBCY8 Analog Waveform Generation Function, CMOS, MBCY8, Analog Waveform Generation Function, CMOS, MBCY8 Analog Waveform Generation Function, CMOS, CDIP14, Analog Waveform Generation Function, CMOS, PDSO8, Analog Waveform Generation Function, CMOS, PDSO8,
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
包装说明 SOP, SOP8,.25 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 , CAN8,.2 , CAN8,.2 , CAN8,.2 DIP, DIP14,.3 SOP, SOP8,.25 SOP, SOP8,.25
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
JESD-30 代码 R-PDSO-G8 R-XDIP-T14 R-XDIP-T14 R-XDIP-T14 O-MBCY-W8 O-MBCY-W8 O-MBCY-W8 R-XDIP-T14 R-PDSO-G8 R-PDSO-G8
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
端子数量 8 14 14 14 8 8 8 14 8 8
最高工作温度 85 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 70 °C 85 °C
最低工作温度 -20 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C - -20 °C
封装主体材料 PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC METAL METAL METAL CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY
封装等效代码 SOP8,.25 DIP14,.3 DIP14,.3 DIP14,.3 CAN8,.2 CAN8,.2 CAN8,.2 DIP14,.3 SOP8,.25 SOP8,.25
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR ROUND ROUND ROUND RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE IN-LINE IN-LINE IN-LINE CYLINDRICAL CYLINDRICAL CYLINDRICAL IN-LINE SMALL OUTLINE SMALL OUTLINE
电源 5/15 V 5/15 V 5/15 V 5/15 V 5 V 5/15 V 5 V 5/15 V 5/15 V 5/15 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 OTHER MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY COMMERCIAL OTHER
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 GULL WING THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE WIRE WIRE WIRE THROUGH-HOLE GULL WING GULL WING
端子位置 DUAL DUAL DUAL DUAL BOTTOM BOTTOM BOTTOM DUAL DUAL DUAL
厂商名称 General Electric Solid State - - - - General Electric Solid State General Electric Solid State General Electric Solid State General Electric Solid State General Electric Solid State
封装代码 SOP DIP DIP DIP - - - DIP SOP SOP
表面贴装 YES NO NO NO - - - NO YES YES
端子节距 1.27 mm 2.54 mm 2.54 mm 2.54 mm - - - 2.54 mm 1.27 mm 1.27 mm
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