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ICS-40730

Ultra-Low Noise Microphone with Differential Output

GENERAL DESCRIPTION

The ICS-40730 is an ultra-low noise, differential analog

output, bottom-ported MEMS microphone. The ICS-40730

includes a MEMS microphone element, an impedance

converter, a differential output amplifier and an enhanced RF

package. The ICS-40730’s 74 dB SNR and ±2 dB sensitivity

tolerance make it an excellent choice for microphone arrays

and far field voice control applications.

The ICS-40730 has a linear response up to 124 dB SPL with a

differential output sensitivity specification of −32 dBV. It can

be used in a single-ended mode with −38 dBV sensitivity and

the same high SNR.

The ICS-40730 is available in a 4.72 mm × 3.76 mm × 3.50 mm

surface-mount package.

APPLICATIONS



Smart Home Devices

Smartphones

Teleconferencing Systems

Security and Surveillance

Microphone Arrays

Voice Control and Activation

FEATURES



Ultra-High 74 dBA SNR

−32 dBV Differential Sensitivity, −38 dBV Single-

Ended Sensitivity

±2 dB Sensitivity Tolerance

4.72 × 3.76 × 3.5 mm Surface-Mount Package

Non-Inverted Signal Output

Extended Frequency Response from 25 Hz to 20 kHz

Enhanced RF Performance

285 µA Current Consumption

124 dB SPL Acoustic Overload Point

−77 dBV PSR

Compatible with Sn/Pb and Pb-Free Solder Processes

RoHS/WEEE Compliant

FUNCTIONAL BLOCK DIAGRAM

OUTPUT

AMPLIFIER

OUTPUT+

OUTPUT−

ICS-40730

POWER

VDD

GND

This document contains information on a preproduction

product. Specifications and information herein are

subject to change without notice.

InvenSense Inc.

1745 Technology Drive, San Jose, CA 95110 U.S.A

+1(408) 988–7339

www.invensense.com

Document Number: DS-000139

Revision: 0.1

Rev Date: 5/30/16

ICS-40730

TABLE OF CONTENTS

General Description ..................................................................................................................................................................... 1

Applications ................................................................................................................................................................................. 1

Features ....................................................................................................................................................................................... 1

Functional Block Diagram ............................................................................................................................................................ 1

Table of Contents .................................................................................................................................................................................... 2

Specifications .......................................................................................................................................................................................... 3

Table 1. Electrical Characteristics ................................................................................................................................................ 3

Absolute Maximum Ratings .................................................................................................................................................................... 4

Table 2. Absolute Maximum Ratings ........................................................................................................................................... 4

ESD Caution ................................................................................................................................................................................. 4

Soldering Profile........................................................................................................................................................................... 5

Table 3. Recommended Soldering Profile* .................................................................................................................................. 5

Pin Configurations And Function Descriptions ....................................................................................................................................... 6

Table 4. Pin Function Descriptions............................................................................................................................................... 6

Typical Performance Characteristics ....................................................................................................................................................... 7

Theory Of Operation ............................................................................................................................................................................... 8

Balanced Output .......................................................................................................................................................................... 8

Single-Ended Operation ............................................................................................................................................................... 8

Applications Information ........................................................................................................................................................................ 9

Codec Connection ........................................................................................................................................................................ 9

Supporting Documents ......................................................................................................................................................................... 10

Evaluation Board User Guide ..................................................................................................................................................... 10

Application Notes ...................................................................................................................................................................... 10

PCB Design And Land Pattern Layout ................................................................................................................................................... 11

PCB Material And Thickness ...................................................................................................................................................... 11

Handling Instructions ............................................................................................................................................................................ 12

Pick And Place Equipment ......................................................................................................................................................... 12

Reflow Solder ............................................................................................................................................................................. 12

Board Wash................................................................................................................................................................................ 12

Outline Dimensions ............................................................................................................................................................................... 13

Ordering Guide .......................................................................................................................................................................... 13

Revision History ......................................................................................................................................................................... 14

Compliance Declaration Disclaimer ...................................................................................................................................................... 15

Page 2 of 15

Document Number: DS-000139

Revision: 0.1

Preliminary Technical Data

ICS-40730

SPECIFICATIONS

TABLE 1. ELECTRICAL CHARACTERISTICS

= 25°C, V

= 1.5 to 3.63 V, unless otherwise noted. Typical specifications are not guaranteed.

PARAMETER

PERFORMANCE

Directionality

Sensitivity

CONDITIONS

MIN

TYP

Omni

−32

−38

104

0.6

−77

−45

124

1.5

= 1.8 V

= 3.3 V

OUTPUT CHARACTERISTICS

Output Impedance

Differential

Single-Ended, OUTPUT+

Single-Ended, OUTPUT−

Output DC Offset

OUTPUT+

OUTPUT−

Maximum Output Voltage

Differential, 124 dB SPL input

Single-Ended, 124 dB SPL input

Noise Floor

20 Hz to 20 kHz, A-weighted, rms

750

340

410

0.66

0.70

0.79

0.40

−106

V rms

dBV

285

3.63

350

375

MAX

UNITS

NOTES

Signal-to-Noise Ratio (SNR)

Equivalent Input Noise (EIN)

Dynamic Range

Total Harmonic Distortion (THD)

Power-Supply Rejection (PSR)

Power Supply Rejection Ratio (PSRR)

Acoustic Overload Point

POWER SUPPLY

Supply Voltage (V

)

Supply Current (I

)

1 kHz, 94 dB SPL, differential

1 kHz, 94 dB SPL, single-ended

20 Hz to 20 kHz, A-weighted,

differential

20 Hz to 20 kHz, A-weighted,

single-ended

20 Hz to 20 kHz, A-weighted

Derived from EIN and maximum

acoustic input

105 dB SPL

217 Hz, 100 mVp-p square wave

superimposed on V

= 1.8 V,

A-weighted

1 kHz, 100 mV p-p sine wave

superimposed on V

= 1.8 V

10% THD

−34

−40

−30

−36

dBV

dBA

dBA SPL

dBV

dB SPL

µA

Page 3 of 15

Document Number: DS-000139

Revision: 0.1

ICS-40730

ABSOLUTE MAXIMUM RATINGS

Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only

and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for

extended periods may affect device reliability.

TABLE 2. ABSOLUTE MAXIMUM RATINGS

PARAMETER

Supply Voltage (V

)

Sound Pressure Level

Mechanical Shock

Vibration

Temperature Range

Biased

Storage

−40°C to +85°C

−55°C to +150°C

RATING

−0.3 V to +3.63 V

160 dB

10,000

Per MIL-STD-883 Method 2007, Test Condition B

ESD CAUTION

ESD (electrostatic discharge) sensitive device.

Charged devices and circuit boards can

discharge without detection. Although this

product features patented or proprietary

protection circuitry, damage may occur on

devices subjected to high energy ESD.

Therefore proper ESD precautions should be

taken to avoid performance degradation or

loss of functionality.

Page 4 of 15

Document Number: DS-000139

Revision: 0.1

ICS-40730

SOLDERING PROFILE

RAMP-UP

CRITICAL ZONE

TO T

TEMPERATURE

SMAX

SMIN

PREHEAT

RAMP-DOWN

25°C

TO PEAK TEMPERATURE

TIME

Figure 1. Recommended Soldering Profile Limits

TABLE 3. RECOMMENDED SOLDERING PROFILE*

PROFILE FEATURE

Average Ramp Rate (T

to T

)

Minimum Temperature

SMIN

)

Minimum Temperature

SMIN

)

Time (T

SMIN

to T

SMAX

), t

Sn63/Pb37

1.25°C/sec max

100°C

150°C

60 sec to 75 sec

1.25°C/sec

45 sec to 75 sec

183°C

215°C +3°C/−3°C

20 sec to 30 sec

3°C/sec max

5 min max

Pb-Free

1.25°C/sec max

100°C

200°C

60 sec to 75 sec

1.25°C/sec

~50 sec

217°C

260°C +0°C/−5°C

20 sec to 30 sec

3°C/sec max

5 min max

Preheat

Ramp-Up Rate (T

SMAX

to T

)

Time Maintained Above Liquidous (t

)

Liquidous Temperature (T

)

Peak Temperature (T

)

Time Within +5°C of Actual Peak

Temperature (t

)

Ramp-Down Rate

Time +25°C (t

25°C

) to Peak Temperature

*Note:

The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All

microphones are also compatible with the J-STD-020 profile

Page 5 of 15

Document Number: DS-000139

Revision: 0.1