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ICS290GI-XXT

Clock Generator, 200MHz, CMOS, PDSO20, 0.173 INCH, TSSOP-20

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:IDT (Integrated Device Technology)

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
零件包装代码
TSSOP
包装说明
TSSOP,
针数
20
Reach Compliance Code
compli
ECCN代码
EAR99
JESD-30 代码
R-PDSO-G20
JESD-609代码
e0
长度
6.5 mm
端子数量
20
最高工作温度
85 °C
最低工作温度
-40 °C
最大输出时钟频率
200 MHz
封装主体材料
PLASTIC/EPOXY
封装代码
TSSOP
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)
225
主时钟/晶体标称频率
166 MHz
认证状态
Not Qualified
座面最大高度
1.2 mm
最大供电电压
3.465 V
最小供电电压
3.135 V
标称供电电压
3.3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
TIN LEAD
端子形式
GULL WING
端子节距
0.65 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
30
宽度
4.4 mm
uPs/uCs/外围集成电路类型
CLOCK GENERATOR, OTHER
Base Number Matches
1
文档预览
PRELIMINARY DATASHEET
TRIPLE PLL FIELD PROG. SPREAD SPECTRUM CLOCK SYNTHESIZER
ICS290
Description
The ICS290 field programmable spread spectrum clock
synthesizer generates up to eight high-quality,
high-frequency clock outputs including multiple reference
clocks from a low-frequency crystal input. It is designed to
replace crystals, crystal oscillators and stand alone spread
spectrum devices in most electronic systems.
Using ICS’ VersaClock
TM
software to configure PLLs and
outputs, the ICS290 contains a One-Time Programmable
(OTP) ROM for field programmability. Programming
features include input/output frequencies, spread spectrum
amount, eight selectable configuration registers and up to
two sets of four low-skew outputs.
Using Phase-Locked Loop (PLL) techniques, the device
runs from a standard fundamental mode, inexpensive
crystal, or clock. It can replace multiple crystals and
oscillators, saving board space and cost.
The ICS290 is also available in factory programmed custom
versions for high-volume applications.
Features
Packaged as 20-pin TSSOP
Eight addressable registers
Replaces multiple crystals and oscillators
Output frequencies up to 200 MHz at 3.3 V
Configurable Spread Spectrum Modulation
Input crystal frequency of 5 to 27 MHz
Clock input frequency of 3 to 166 MHz
Up to eight reference outputs
Up to two sets of four low-skew outputs
Operating voltages of 3.3 V
Controllable output drive levels
Advanced, low-power CMOS process
Available in Pb (lead) free packaging
Block Diagram
VDD
PLL1 with
Spread
Spectrum
Divide
Logic
and
Output
Enable
Control
3
S2:S0
3
CLK1
CLK2
CLK3
CLK4
CLK5
CLK6
CLK7
CLK8
OTP
ROM
with PLL
Values
PLL2
PLL3
X1/ICLK
Crystal or
Clock Input
Crystal
Oscillator
X2
External capacitors
are required with a crystal input.
GND
3
PDTS
IDT™ / ICS™
TRIPLE PLL FIELD PROG. SPREAD SPECTRUM CLOCK SYNTHESIZER 1
ICS290
REV E 041207
ICS290
TRIPLE PLL FIELD PROG. SPREAD SPECTRUM CLOCK SYNTHESIZER
EPROM CLOCK SYNTHESIZER
Pin Assignment
GND
S0
S1
VDD
CLK1
CLK2
CLK3
CLK4
GND
X1/ICLK
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
S2
VDD
PDTS
GND
CLK8
CLK7
CLK6
CLK5
VDD
X2
20 pin (173 mil) TSSOP
Pin Descriptions
Pin
Number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Pin
Name
GND
S0
S1
VDD
CLK1
CLK2
CLK3
CLK4
GND
X1/ICLK
X2
VDD
CLK5
CLK6
CLK7
CLK8
GND
PDTS
VDD
S2
Pin
Type
Power
Input
Input
Power
Output
Output
Output
Output
Power
XI
XO
Power
Output
Output
Output
Output
Power
Input
Power
Input
Connect to ground.
Pin Description
Select pin 0. Internal pull-up resistor.
Select pin 1. Internal pull-up resistor.
Connect to +3.3 V.
Output clock 1. Weak internal pull-down when tri-state.
Output clock 2. Weak internal pull-down when tri-state.
Output clock 3. Weak internal pull-down when tri-state.
Output clock 4. Weak internal pull-down when tri-state.
Connect to ground.
Crystal input. Connect this pin to a crystal or external input clock.
Crystal Output. Connect this pin to a crystal. Float for clock input.
Connect to +3.3 V.
Output clock 5. Weak internal pull-down when tri-state.
Output clock 6. Weak internal pull-down when tri-state.
Output clock 7. Weak internal pull-down when tri-state.
Output clock 8. Weak internal pull-down when tri-state.
Connect to ground.
Power-down tri-state. Powers down entire chip and tri-states clock outputs
when low. Internal pull-up resistor.
Connect to +3.3 V.
Select pin 2. Internal pull-up resistor.
IDT™ / ICS™
TRIPLE PLL FIELD PROG. SPREAD SPECTRUM CLOCK SYNTHESIZER 2
ICS290
REV E 041207
ICS290
TRIPLE PLL FIELD PROG. SPREAD SPECTRUM CLOCK SYNTHESIZER
EPROM CLOCK SYNTHESIZER
External Components
The ICS290 requires a minimum number of external
components for proper operation.
The ICS290 also provides separate output divide values,
from 2 through 63, to allow the two output clock banks to
support widely differing frequency values from the same
PLL.
Each output frequency can be represented as:
OutputFreq
Series Termination Resistor
Clock output traces over one inch should use series
termination. To series terminate a 50Ω trace (a commonly
used trace impedance), place a 33Ω resistor in series with
the clock line, as close to the clock output pin as possible.
The nominal impedance of the clock output is 20Ω.
=
REFFreq
----
-
M
N
Output Drive Control
The ICS290 has two output drive settings. Low drive should
be selected when outputs are less than 100 MHz. High drive
should be selected when outputs are greater than 100 MHz.
(Consult the AC Electrical Characteristics for output rise and
fall times for each drive option.)
Decoupling Capacitors
As with any high-performance mixed-signal IC, the ICS290
must be isolated from system power supply noise to perform
optimally.
Decoupling capacitors of 0.01µF must be connected
between each VDD and the PCB ground plane. For
optimum device performance, the decoupling capacitor
should be mounted on the component side of the PCB.
Avoid the use of vias on the decoupling circuit.
ICS VersaClock Software
ICS applies years of PLL optimization experience into a user
friendly software that accepts the user’s target reference
clock and output frequencies and generates the lowest jitter,
lowest power configuration, with only a press of a button.
The user does not need to have prior PLL experience or
determine the optimal VCO frequency to support multiple
output frequencies.
VersaClock software quickly evaluates accessible VCO
frequencies with available output divide values and provides
an easy to understand, bar code rating for the target output
frequencies. The user may evaluate output accuracy,
performance trade-off scenarios in seconds.
Crystal Load Capacitors
The device crystal connections should include pads for
small capacitors from X1 to ground and from X2 to ground.
These capacitors are used to adjust the stray capacitance of
the board to match the nominally required crystal load
capacitance. Because load capacitance can only be
increased in this trimming process, it is important to keep
stray capacitance to a minimum by using very short PCB
traces (and no vias) been the crystal and device. Crystal
capacitors must be connected from each of the pins X1 and
X2 to ground.
The value (in pF) of these crystal caps should equal (C
L
-6
pF)*2. In this equation, C
L
= crystal load capacitance in pF.
Example: For a crystal with a 16 pF load capacitance, each
crystal capacitor would be 20 pF [(16-6) x 2] = 20.
Spread Spectrum Modulation
The ICS290 utilizes frequency modulation (FM) to distribute
energy over a range of frequencies. By modulating the
output clock frequencies, the device effectively lowers
energy across a broader range of frequencies; thus,
lowering a system’s electromagnetic interference (EMI). The
modulation rate is the time from transitioning from a
minimum frequency to a maximum frequency and then back
to the minimum.
Spread Spectrum Modulation can be applied as either
“center spread” or “down spread”. During center spread
modulation, the deviation from the target frequency is equal
in the positive and negative directions. The effective
average frequency is equal to the target frequency. In
ICS290 Configuration Capabilities
The architecture of the ICS290 allows the user to easily
configure the device to a wide range of output frequencies,
for a given input reference frequency.
The frequency multiplier PLL provides a high degree of
precision. The M/N values (the multiplier/divide values
available to generate the target VCO frequency) can be set
within the range of M = 1 to 1024 and N = 1 to 32,895.
IDT™ / ICS™
TRIPLE PLL FIELD PROG. SPREAD SPECTRUM CLOCK SYNTHESIZER 3
ICS290
REV E 041207
ICS290
TRIPLE PLL FIELD PROG. SPREAD SPECTRUM CLOCK SYNTHESIZER
EPROM CLOCK SYNTHESIZER
applications where the clock is driving a component with a
maximum frequency rating, down spread should be applied.
In this case, the maximum frequency, including modulation,
is the target frequency. The effective average frequency is
less than the target frequency.
The ICS290 operates in both center spread and down
spread modes. For center spread, the frequency can be
modulated between ±0.125% to ±2.0%. For down spread,
the frequency can be modulated between -0.25% to -4.0%.
Both output frequency banks will utilize identical spread
spectrum percentage deviations and modulation rates, if a
common VCO frequency can be identified.
Spread Spectrum Modulation Rate
The spread spectrum modulation frequency applied to the
output clock frequency may occur at a variety of rates. For
applications requiring the driving of “down-circuit” PLLs,
Zero Delay Buffers, or those adhering to PCI standards, the
spread spectrum modulation rate should be set to 30-33
kHz. For other applications, a 120 kHz modulation option is
available.
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS290. These ratings, which are
standard values for ICS commercially rated parts, are stress ratings only. Functional operation of the device at
these or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical
parameters are guaranteed only over the recommended operating temperature range.
Parameter
Supply Voltage, VDD
Inputs
Clock Outputs
Storage Temperature
Soldering Temperature
Junction Temperature
Condition
Referenced to GND
Referenced to GND
Referenced to GND
Max 10 seconds
Min.
-0.5
-0.5
-65
Typ.
Max.
7
VDD+0.5
VDD+0.5
150
260
125
Units
V
V
V
°C
°C
°C
Recommended Operation Conditions
Parameter
Ambient Operating Temperature (ICS290GP)
Ambient Operating Temperature (ICS290GIP)
Power Supply Voltage (measured in respect to GND)
Power Supply Ramp Time
Min.
0
-40
+3.135
Typ.
Max.
+70
+85
Units
°C
°C
V
ms
+3.3
+3.465
4
IDT™ / ICS™
TRIPLE PLL FIELD PROG. SPREAD SPECTRUM CLOCK SYNTHESIZER 4
ICS290
REV E 041207
ICS290
TRIPLE PLL FIELD PROG. SPREAD SPECTRUM CLOCK SYNTHESIZER
EPROM CLOCK SYNTHESIZER
DC Electrical Characteristics
Unless stated otherwise,
VDD = 3.3 V ±5%,
Ambient Temperature -40 to +85°C
Parameter
Operating Voltage
Symbol
VDD
Conditions
Config. Dependent - See
VersaClock
TM
Estimates
Min.
3.135
Typ.
Max.
3.465
Units
V
mA
Operating Supply Current
IDD
Eight 33.3333 MHz outs,
PDTS = 1, no load, Note 1
PDTS = 0, no load
S2:S0
S2:S0
VDD-0.5
VDD/2+1
27
500
0.4
0.4
mA
µA
V
V
V
V
V
VDD/2-1
V
V
V
0.4
V
Input High Voltage
Input Low Voltage
Input High Voltage, PDTS
Input Low Voltage, PDTS
Input High Voltage
Input Low Voltage
Output High Voltage
(CMOS High)
Output High Voltage
Output Low Voltage
Short Circuit Current
Nom. Output Impedance
Internal pull-up Resistor
Internal pull-down
Resistor
Input Capacitance
V
IH
V
IL
V
IH
V
IL
V
IH
V
IL
V
OH
V
OH
V
OL
I
OS
Z
O
R
PUS
R
PD
C
IN
ICLK
ICLK
I
OH
= -4 mA
I
OH
= -8 mA (Low Drive);
I
OH
= -12 mA (High Drive)
I
OL
= 8 mA (Low Drive);
I
OL
= 12 mA (High Drive)
Low Drive
High Drive
S2:S0, PDTS
CLK outputs
Inputs
VDD/2+1
VDD-0.4
2.4
±40
±70
20
190
120
4
mA
kΩ
kΩ
pF
Note 1: Example with 25 MHz crystal input with eight outputs of 33.3 MHz, no load, and VDD = 3.3 V.
IDT™ / ICS™
TRIPLE PLL FIELD PROG. SPREAD SPECTRUM CLOCK SYNTHESIZER 5
ICS290
REV E 041207
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参数对比
与ICS290GI-XXT相近的元器件有:ICS290G-XXLF、ICS290G-XXLFT、ICS290G-XXT、ICS290G-XX、ICS290GI-XXLF、ICS290GI-XXLFT、ICS290GI-XX。描述及对比如下:
型号 ICS290GI-XXT ICS290G-XXLF ICS290G-XXLFT ICS290G-XXT ICS290G-XX ICS290GI-XXLF ICS290GI-XXLFT ICS290GI-XX
描述 Clock Generator, 200MHz, CMOS, PDSO20, 0.173 INCH, TSSOP-20 Clock Generator, 200MHz, CMOS, PDSO20, 0.173 INCH, ROHS COMPLIANT, TSSOP-20 Clock Generator, 200MHz, CMOS, PDSO20, 0.173 INCH, ROHS COMPLIANT, TSSOP-20 Clock Generator, 200MHz, CMOS, PDSO20, 0.173 INCH, TSSOP-20 Clock Generator, 200MHz, CMOS, PDSO20, 0.173 INCH, TSSOP-20 Clock Generator, 200MHz, CMOS, PDSO20, 0.173 INCH, ROHS COMPLIANT, TSSOP-20 Clock Generator, 200MHz, CMOS, PDSO20, 0.173 INCH, ROHS COMPLIANT, TSSOP-20 Clock Generator, 200MHz, CMOS, PDSO20, 0.173 INCH, TSSOP-20
是否无铅 含铅 不含铅 不含铅 含铅 含铅 不含铅 不含铅 含铅
是否Rohs认证 不符合 符合 符合 不符合 不符合 符合 符合 不符合
零件包装代码 TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP
包装说明 TSSOP, TSSOP, TSSOP, TSSOP, TSSOP, TSSOP, TSSOP, TSSOP,
针数 20 20 20 20 20 20 20 20
Reach Compliance Code compli compli compli compli compli compli compli compli
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
JESD-30 代码 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20
JESD-609代码 e0 e3 e3 e0 e0 e3 e3 e0
长度 6.5 mm 6.5 mm 6.5 mm 6.5 mm 6.5 mm 6.5 mm 6.5 mm 6.5 mm
端子数量 20 20 20 20 20 20 20 20
最高工作温度 85 °C 70 °C 70 °C 70 °C 70 °C 85 °C 85 °C 85 °C
最大输出时钟频率 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 225 260 260 225 225 260 260 225
主时钟/晶体标称频率 166 MHz 166 MHz 166 MHz 166 MHz 166 MHz 166 MHz 166 MHz 166 MHz
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
最大供电电压 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V
最小供电电压 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
标称供电电压 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 TIN LEAD MATTE TIN MATTE TIN TIN LEAD TIN LEAD MATTE TIN MATTE TIN TIN LEAD
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 30 30 30 30 30 30 30 30
宽度 4.4 mm 4.4 mm 4.4 mm 4.4 mm 4.4 mm 4.4 mm 4.4 mm 4.4 mm
uPs/uCs/外围集成电路类型 CLOCK GENERATOR, OTHER CLOCK GENERATOR, OTHER CLOCK GENERATOR, OTHER CLOCK GENERATOR, OTHER CLOCK GENERATOR, OTHER CLOCK GENERATOR, OTHER CLOCK GENERATOR, OTHER CLOCK GENERATOR, OTHER
Base Number Matches 1 1 1 1 1 1 1 1
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器件捷径:
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