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ICS650G-40LFT

Clock Generator, 189MHz, PDSO16, 0.173 INCH, ROHS COMPLIANT, TSSOP-16

器件类别:微控制器和处理器    时钟发生器   

厂商名称:IDT (Integrated Device Technology)

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
IDT (Integrated Device Technology)
零件包装代码
TSSOP
包装说明
0.173 INCH, ROHS COMPLIANT, TSSOP-16
针数
16
Reach Compliance Code
unknown
ECCN代码
EAR99
JESD-30 代码
R-PDSO-G16
JESD-609代码
e3
长度
5 mm
湿度敏感等级
1
端子数量
16
最高工作温度
70 °C
最低工作温度
最大输出时钟频率
189 MHz
封装主体材料
PLASTIC/EPOXY
封装代码
TSSOP
封装等效代码
TSSOP16,.25
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)
260
电源
3.3 V
主时钟/晶体标称频率
25 MHz
认证状态
Not Qualified
座面最大高度
1.2 mm
最大供电电压
3.45 V
最小供电电压
3.15 V
标称供电电压
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Matte Tin (Sn) - annealed
端子形式
GULL WING
端子节距
0.65 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
30
宽度
4.4 mm
uPs/uCs/外围集成电路类型
CLOCK GENERATOR, OTHER
Base Number Matches
1
文档预览
ICS650-40
E
THERNET
S
WITCH
C
LOCK
S
OURCE
Description
The ICS650-40 is a clock chip designed for use in
Ethernet Switch applications. Using ICS’ patented
Phase-Locked Loop (PLL) techniques, the device takes
a 25 MHz crystal input and produces various output
clock frequencies as listed in Output Select Table.
Features
Packaged in 16-pin TSSOP
Available in Pb (lead) free package
Operating voltage of 3.3 V
Low power consumption
Input frequency of 25 MHz
Low long-term jitter
2.5 V to 3.3 V clock outputs
Block Diagram
VDD
3
VDDOA
S1:S0
2
Control
Logic
CLKA
Phase Lock Loop
CLKB
X1/ICLK
25 MHz
crystal or clock X2
Clock
Buffer/
Crystal
Oscillator
4
GND
OE
VDDOB
Optional tuning crystal
capacitors
MDS 650-40 C
I n t e gra te d C i r c u i t S y s t e m s
1
525 Race Stre et, San Jo se, CA 9 5126
Revision 060705
te l (40 8) 2 97-12 01
w w w. i c st . c o m
ICS650-40
E
THERNET
S
WITCH
C
LOCK
S
OURCE
Pin Assignment
X1/ICLK
VDD
GND
VDDOA
CLKA
CLKB
VDDOB
GND
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
X2
GND
OE
GND
VDD
VDD
S1
S0
Output Select Table (MHz)
S1
0
0
1
1
S0
0
1
0
1
CLKA
(MHz)
127
133
157
189
CLKB
(MHz)
127
133
157
189
16-pin (173 mil) TSSOP
Pin Descriptions
Pin
Number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Pin
Name
X1/ICLK
VDD
GND
VDDOA
CLKA
CLKB
VDDOB
GND
S0
S1
VDD
VDD
GND
OE
GND
X2
Pin
Type
Input
Power
Power
Power
Connect to +3.3 V.
Connect to ground.
Pin Description
Crystal or clock input. Connect to a 25 MHz crystal or single ended clock.
Connect to +2.5 V or +3.3 V. For clock output buffer A only.
Output Clock A output with weak pull-down resistor.
Output Clock B output with weak pull-down resistor.
Power
Power
Input
Input
Power
Power
Power
Input
Power
Connect to +2.5 V or +3.3 V. For clock output buffer B only.
Connect to ground.
Select pin 0.
Select pin 1.
Connect to +3.3 V.
Connect to +3.3 V.
Connect to ground.
Output enable tri-states outputs and device is not shut down. Internal
pull-up resistor.
Connect to ground.
Output Crystal connection. Leave unconnected for clock input.
MDS 650-40 C
In te grated Circuit Systems
2
525 Ra ce Street, San Jose, CA 9512 6
Revision 060705
tel (4 08) 297-1 201
w w w. i c s t . c o m
ICS650-40
E
THERNET
S
WITCH
C
LOCK
S
OURCE
External Components
A minimum number of external components are required for proper operation. Decoupling capacitors of
0.01
µF
should be connected between VDD and GND pairs. The capacitors should be placed between pins
VDD and GND, and VDDO and GND, as close to the device as possible. A 33Ω series terminating resistor
should be used on each clock output if the trace is longer than 1 inch. A 25 MHz fundamental mode parallel
resonant crystal should be used with C
L
=18 pF.
On chip capacitors.
On Chip capacitors are used for a 18 pF load crystal. Small 2 to 3 pf trimming
capacitors are used from pins X1 to ground and X2 to ground to optimize the initial accuracy.
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS650-40. These ratings,
which are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of
the device at these or any other conditions above those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can
affect product reliability. Electrical parameters are guaranteed only over the recommended operating
temperature range.
Item
Supply Voltage, VDD
All Inputs and Outputs
Ambient Operating Temperature
Storage Temperature
Junction Temperature
Soldering Temperature
7V
Rating
-0.5 V to VDD+0.5 V
0 to +70°C
-65 to +150°C
125°C
260°C
Recommended Operation Conditions
Parameter
Ambient Operating Temperature
Power Supply Voltage (measured in respect to GND)
Min.
0
+3.15
Typ.
Max.
+70
+3.45
Units
°C
V
MDS 650-40 C
In te grated Circuit Systems
3
525 Ra ce Street, San Jose, CA 9512 6
Revision 060705
tel (4 08) 297-1 201
w w w. i c s t . c o m
ICS650-40
E
THERNET
S
WITCH
C
LOCK
S
OURCE
DC Electrical Characteristics
Unless otherwise specified,
VDD=3.3 V ±5%,
Ambient Temperature 0 to +70°C
Parameter
Operating Voltage
Output Operating Voltage
Input High Voltage, ICLK
Input Low Voltage, ICLK
Input High Voltage, S1:S0:OE
Input Low Voltage, S1:S0:OE
Output High Voltage
Output Low Voltage
Operating Supply Current
IDD at Output Disable
Condition(OE low)
Short Circuit Current
Internal Pull-up Resistor
Internal Pull-down Resistor
Symbol
VDD
VDDOA,B
V
IH
V
IL
V
IH
V
IL
V
OH
V
OL
IDD
Conditions
Min.
3.15
2.375
Typ.
Max.
3.45
3.45
VDD/2-0.5
Units
V
V
V
V
V
V
V
V
mA
mA
mA
kΩ
kΩ
Note 1
Note 1
VDD/2+0.5
2
VDD
0.4
I
OH
= -12 mA
I
OL
= 12 mA
No load
No load
2
0.4
40
16
±35
250
525
I
OS
R
PUP
R
PD
Each output
OE pin
CLK outputs
Note: 1. Nominal switching threshold is VDD/2.
AC Electrical Characteristics
,
VDD = 3.3 V ±5%, VDDO = 2.5 - 3.3 V ±5%, C
L
=10 pF
Ambient Temperature 0 to +70° C
Parameter
Input Frequency
Output Rise Time
Output Fall Time
Output Clock Duty Cycle
Frequency Error
Output to Output Skew
between clocks of the same
frequency
Absolute Jitter, Short-term P-P
Absolute Jitter, Short-term C-C
Long-term Jitter
Symbol
t
OR
t
OF
Conditions
20% to 80% of VDD
80% to 20% of VDD
at VDD/2
all clocks
Min.
Typ.
25
1.6
1.6
Max. Units
MHz
ns
ns
60
250
%
ppm
ps
40
49-51
0
variation from mean
1000 clock cycles
±100
200
250
±200
400
400
ps
ps
ps
MDS 650-40 C
In te grated Circuit Systems
4
525 Ra ce Street, San Jose, CA 9512 6
Revision 060705
tel (4 08) 297-1 201
w w w. i c s t . c o m
ICS650-40
E
THERNET
S
WITCH
C
LOCK
S
OURCE
Thermal Characteristics
(16-pin TSSOP)
Parameter
Thermal Resistance Junction to
Ambient
Thermal Resistance Junction to Case
Symbol
θ
JA
θ
JA
θ
JA
θ
JC
Conditions
Still air
1 m/s air flow
3 m/s air flow
Min.
Typ.
78
70
68
37
Max. Units
°C/W
°C/W
°C/W
°C/W
Marking Diagram
16
9
Marking Diagram
16
9
IC
650G-40
S
######
YYWW
IC
650G40LF
S
######
YYWW
1
8
1
8
Notes:
1. ###### is the lot code.
2. YYWW is the last two digits of the year, and the week number that the part was assembled.
3. “LF” designates Pb (lead ) free package.
4. Bottom marking: (origin). Origin = country of origin if not USA.
MDS 650-40 C
In te grated Circuit Systems
5
525 Ra ce Street, San Jose, CA 9512 6
Revision 060705
tel (4 08) 297-1 201
w w w. i c s t . c o m
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