DATASHEET
LOW PHASE NOISE ZERO DELAY BUFFER AND MULTIPLIER
Description
The ICS670-02 is a high speed, low phase noise, Zero
Delay Buffer (ZDB) which integrates IDT’s proprietary
analog/digital Phase Locked Loop (PLL) techniques. Part of
IDT’s ClockBlocks
TM
family, the part’s zero delay feature
means that the rising edge of the input clock aligns with the
rising edges of the outputs giving the appearance of no
delay through the device. There are two identical outputs on
the chip. The FBCLK should be used to connect to the
FBIN. Each output has its own output enable pin.
The ICS670-02 is ideal for synchronizing outputs in a large
variety of systems, from personal computers to data
communications to video. By allowing off-chip feedback
paths, the chip can eliminate the delay through other
devices. The 15 different on-chip multipliers work in a
variety of applications. For other multipliers, including
functional multipliers, see the ICS527.
ICS670-02
Features
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Packaged in 16-pin SOIC
Pb (lead) free package, RoHS compliant
Clock inputs from 5 to 160 MHz (see page 2)
Patented PLL with low phase noise
Output clocks up to 160 MHz at 3.3 V
15 selectable on-chip multipliers
Power down mode available
Low phase noise: -111 dBc/Hz at 10 kHz
Output enable function tri-states outputs
Low jitter 15 ps one sigma
Advanced, low power, sub-micron CMOS process
Operating voltage of 3.3 V or 5 V
Industrial temperature range available (-40 to +85°C)
Block Diagram
VDD
3
OE1
IC L K
F B IN
Divide by
N
Phase
Detector,
Charge
Pump, and
Loop Filter
Voltage
Controlled
Oscillator
FBCLK
S 3 :S 0
4
CLK2
3
GND
E x te rn a l F e e d b a c k fro m F B C L K is re c o m m e n d e d .
OE2
IDT™ / ICS™
LOW PHASE NOISE ZERO DELAY BUFFER AND MULTIPLIER 1
ICS670-02
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ICS670-02
LOW PHASE NOISE ZERO DELAY BUFFER AND MULTIPLIER
ZDB AND MULTIPLIER
Pin Assignment
VDD
VDD
VDD
CLK2
OE2
FBCLK
OE1
FBIN
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GND
GND
GND
S0
S1
S2
S3
ICLK
Multiplier Select Table
S3
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
S2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
S1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
S0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
CLK2 (and FBCLK)
Low (Power down
entire chip)
Input x1.333
Input x6
Input x1.5
Input x3.333
Input x2.50
Input x4
Input x1
Input x2.333
Input x2.666
Input x12
Input x3
Input x10
Input x5
Input x8
Input x2
Input Range (MHz)
-
18 - 120
5 - 26.67
16.67 - 107
7.5 - 48
10 - 64
6 - 40
25 - 160
11 - 69
10 - 60
5 - 13.33
8 - 53.33
5 - 16
6 - 32
5 - 20
12 - 80
Pin Descriptions
Pin
Number
1-3
4
5
6
7
8
9
10
11
12
13
14 - 16
Pin
Name
VDD
CLK2
OE2
FBCLK
OE1
FBIN
ICLK
S3
S2
S1
S0
GND
Pin
Type
Input
Input
Input
Input
Input
Input
Input
Input
Input
Power
Pin Description
Power supply. Connect both pins to the same voltage (either 3.3 V or 5 V).
Output clock enable 2. Tri-states the clock 2 output when low.
Output clock enable 1. Tri-states the feedback clock output when low.
Feedback clock input.
Clock input. Connect to a 5 - 160 MHz clock.
Multiplier select pin 3. Determines outputs per table above. Internal pull-up.
Multiplier select pin 2. Determines outputs per table above. Internal pull-up.
Multiplier select pin 1. Determines outputs per table above. Internal pull-up.
Multiplier select pin 0. Determines outputs per table above. Internal pull-up.
Connect to ground.
Output Clock output from VCO. Output frequency equals the input frequency times multiplier.
Output Clock output from VCO. Output frequency equals the input frequency times multiplier.
IDT™ / ICS™
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LOW PHASE NOISE ZERO DELAY BUFFER AND MULTIPLIER
ZDB AND MULTIPLIER
External Components
The ICS670-02 requires a minimum number of external components for proper operation. Decoupling capacitors of
0.01µF should be connected between VDD and GND on pins 4 and 5, and VDD and GND on pins 13 and 12, as
close to the device as possible. A series termination resistor of 33Ω may be used to each clock output pin to reduce
reflections.
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS670-02. These ratings, which are
standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these
or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical
parameters are guaranteed only over the recommended operating temperature range.
Item
Supply Voltage, VDD
All Inputs and Outputs
Ambient Operating Temperature
Storage Temperature
Junction Temperature
Soldering Temperature
7V
Rating
-0.5 V to VDD+0.5 V
0 to +70° C
-65 to +150° C
150° C
260° C
Recommended Operation Conditions
Parameter
Ambient Operating Temperature
Power Supply Voltage (measured in respect to GND)
Min.
0
+3.0
Typ.
Max.
+70
+5.5
Units
°
C
V
DC Electrical Characteristics
VDD=3.3 V ±10%,
Ambient temperature -40 to +85° C, unless stated otherwise
Parameter
Operating Voltage
Input High Voltage
Input Low Voltage
Output High Voltage
Output Low Voltage
Output High Voltage,
CMOS level
Operating Supply Current
Symbol
VDD
V
IH
V
IL
V
OH
V
OL
V
OH
IDD
Conditions
Min.
3.0
2
Typ.
Max.
5.5
0.8
Units
V
V
V
V
V
V
I
OH
= -12 mA
I
OL
= 12 mA
I
OH
= -4 mA
No Load
2.4
0.4
VDD-0.4
35
mA
IDT™ / ICS™
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LOW PHASE NOISE ZERO DELAY BUFFER AND MULTIPLIER
ZDB AND MULTIPLIER
Parameter
Short Circuit Current
Internal Pull-up Resistor
Input Capacitance
Symbol
I
OS
R
PU
C
IN
Conditions
Each output
OE, select pins
OE, select pins
Min.
Typ.
±50
200
5
Max.
Units
mA
kΩ
pF
AC Electrical Characteristics
VDD = 3.3V ±10%,
Ambient Temperature -40 to +85° C, unless stated otherwise
Parameter
Input Clock Frequency
Output Clock Frequency
Output Rise Time
Output Fall Time
Output Clock Duty Cycle
Input to Output Skew
Maximum Absolute Jitter
Maximum Jitter
Phase Noise, relative to
carrier, 125 MHz (x5)
Symbol
f
IN
t
OR
t
OF
t
DC
Conditions
See table on page 2
0.8 to 2.0 V, no load
2.0 to 0.8 V, no load
measured at VDD/2
Note 1
short term
one sigma
100 Hz offset
1 kHz offset
10 kHz
200 kHz
Min.
5
Typ.
Max. Units
160
160
1.5
1.5
MHz
MHz
ns
ns
%
ps
ps
ps
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
45
50
±100
±45
15
-103
-117
-111
-88
55
Note 1: Rising edge of ICLK compared with rising edge of CLK2, with FBCLK connected to FBIN, and 15 pF load
on CLK2.
Thermal Characteristics
Parameter
Thermal Resistance Junction to
Ambient
Symbol
θ
JA
θ
JA
θ
JA
θ
JC
Conditions
Still air
1 m/s air flow
3 m/s air flow
Min.
Typ.
120
115
105
58
Max. Units
°
C/W
°
C/W
°
C/W
°
C/W
Thermal Resistance Junction to Case
IDT™ / ICS™
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LOW PHASE NOISE ZERO DELAY BUFFER AND MULTIPLIER
ZDB AND MULTIPLIER
Phase Noise for 125 MHz output, 25 MHz clock input
(VDD = 3.3 V)
0
-20
-40
ICS670-02 phase noise
3.3 V, 25 in 125 out
-60
-80
-100
-120
-140
10E+0
100E+0
1E+3
10E+3
100E+3
1E+6
10E+6
IDT™ / ICS™
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ICS670-02
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