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IDT6168SA15EB

Standard SRAM, 4KX4, 15ns, CMOS, CDFP20, 0.300 INCH, CERPACK-20

器件类别:存储    存储   

厂商名称:IDT (Integrated Device Technology)

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
IDT (Integrated Device Technology)
零件包装代码
DFP
包装说明
0.300 INCH, CERPACK-20
针数
20
Reach Compliance Code
not_compliant
ECCN代码
3A001.A.2.C
最长访问时间
15 ns
I/O 类型
COMMON
JESD-30 代码
R-GDFP-F20
JESD-609代码
e0
内存密度
16384 bit
内存集成电路类型
STANDARD SRAM
内存宽度
4
功能数量
1
端口数量
1
端子数量
20
字数
4096 words
字数代码
4000
工作模式
ASYNCHRONOUS
最高工作温度
125 °C
最低工作温度
-55 °C
组织
4KX4
输出特性
3-STATE
可输出
NO
封装主体材料
CERAMIC, GLASS-SEALED
封装代码
DFP
封装等效代码
FL20,.3
封装形状
RECTANGULAR
封装形式
FLATPACK
并行/串行
PARALLEL
电源
5 V
认证状态
Not Qualified
筛选级别
38535Q/M;38534H;883B
座面最大高度
2.3368 mm
最小待机电流
4.5 V
最大压摆率
0.165 mA
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
MILITARY
端子面层
Tin/Lead (Sn/Pb)
端子形式
FLAT
端子节距
1.27 mm
端子位置
DUAL
宽度
6.9215 mm
文档预览
CMOS STATIC RAM
16K (4K x 4-BIT)
Integrated Device Technology, Inc.
IDT6168SA
IDT6168LA
FEATURES:
• High-speed (equal access and cycle time)
— Military: 15/20/25/35/45/55/70/85/100ns (max.)
— Commercial: 15/20/25/35ns (max.)
• Low power consumption
• Battery backup operation—2V data retention voltage
(IDT6168LA only)
• Available in high-density 20-pin ceramic or plastic DIP, 20-
pin SOlC, 20-pin CERPACK and 20-pin leadless chip carrier
• Produced with advanced CMOS high-performance
technology
• CMOS process virtually eliminates alpha particle soft-error
rates
• Bidirectional data input and output
• Military product compliant to MIL-STD-883, Class B
DESCRIPTION:
The IDT6168 is a 16,384-bit high-speed static RAM orga-
nized as 4K x 4. It is fabricated using lDT’s high-performance,
high-reliability CMOS technology. This state-of-the-art tech-
nology, combined with innovative circuit design techniques,
provides a cost-effective approach for high-speed memory
applications.
Access times as fast 15ns are available. The circuit also
offers a reduced power standby mode. When
CS
goes HIGH,
the circuit will automatically go to, and remain in, a standby
mode as long as
CS
remains HIGH. This capability provides
significant system-level power and cooling savings. The low-
power (LA) version also offers a battery backup data retention
capability where the circuit typically consumes only 1µW
operating off a 2V battery. All inputs and outputs of the
IDT6168 are TTL-compatible and operate from a single 5V
supply.
The IDT6168 is packaged in either a space saving 20-pin,
300-mil ceramic or plastic DIP, 20-pin CERPACK, 20-pin
SOIC, or 20-pin leadless chip carrier, providing high board-
level packing densities.
Military grade product is manufactured in compliance with
the latest revision of MIL-STD-883, Class B, making it ideally
suited to military temperature applications demanding the
highest level of performance and reliability.
FUNCTIONAL BLOCK DIAGRAM
A
0
V
CC
GND
ADDRESS
DECODER
16,384-BIT
MEMORY ARRAY
A
11
I/O
0
I/O
1
I/O
2
I/O
3
I/O CONTROL
INPUT
DATA
CONTROL
CS
WE
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
3090 drw 01
MILITARY AND COMMERCIAL TEMPERATURE RANGE
©1994
Integrated Device Technology, Inc.
MAY 1994
DSC-1121/1
5.2
1
IDT6168SA/LA
CMOS STATIC RAM 16K (4K x 4-BIT)
MILITARY AND COMMERCIAL TEMPERATURE RANGES
PIN CONFIGURATIONS
A
0
A
1
A
2
A
3
A
4
A
5
A
6
1
2
3
4
5
6
7
8
9
10
20
19
18
TRUTH TABLE
(1)
V
CC
A
11
A
10
A
9
A
8
I/O
3
I/O
2
I/O
1
I/O
0
Mode
Standby
Read
Write
CS
H
L
L
WE
X
H
L
Output
High-Z
D
OUT
D
IN
Power
Standby
Active
Active
3090 tbl 03
P20-1,
D20-1,
SO20-2,
& E20-1
17
16
15
14
13
12
11
NOTE:
1. H = V
IH
, L = V
IL
, X = Don't Care
CS
A
7
GND
WE
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol
V
TERM
Rating
Com’l.
Mil.
–0.5 to +7.0
Unit
V
Terminal Voltage –0.5 to +7.0
with Respect
to GND
Operating
Temperature
Temperature
Under Bias
Storage
Temperature
Power Dissipation
DC Output
Current
0 to +70
–55 to +125
–55 to +125
1.0
50
3090 drw 02
DIP/SOIC/SOJ/CERPACK
TOP VIEW
A
1
A
0
A
11
INDEX
V
CC
T
A
T
BIAS
–55 to +125
–65 to +135
–65 to +150
1.0
50
°C
°C
°C
W
mA
2
20 19
1
18
17
A
2
A
3
A
4
A
5
A
6
A
7
3
4
5
6
7
8
9
L20-1
16
15
14
13
A
10
A
9
A
8
I/O
3
I/O
2
I/O
1
3090 drw 03
T
STG
P
T
I
OUT
10 11
12
NOTE:
3090 tbl 04
1. Stresses greater than those listed under ABSOLUTE MAXIMUM
RATINGS may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other
conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
GND
LCC
TOP VIEW
PIN DESCRIPTIONS
Name
A
0
–A
11
Description
Address Inputs
Chip Select
Write Enable
Data Input/Output
Power
Ground
3090 tbl 01
I/O
0
CS
WE
RECOMMENDED DC OPERATING
CONDITIONS
Symbol
V
CC
GND
V
IH
V
IL
Parameter
Supply Voltage
Supply Voltage
Input High Voltage
Input Low Voltage
Min. Typ.
4.5
5.0
0
0
2.2
–0.5
(1)
Max.
5.5
0
6.0
0.8
Unit
V
V
V
V
CS
WE
I/O
0-3
V
CC
GND
NOTE:
3090 tbl 05
1. V
IL
(min.) = –3.0V for pulse width less than 20ns, once per cycle.
CAPACITANCE
(T
A
= +25°C, F = 1.0MH
Z
)
Symbol
C
IN
C
I/O
Parameter
(1)
Input Capacitance
I/O Capacitance
Conditions
V
IN
= 0V
V
OUT
= 0V
Max.
7
7
Unit
pF
pF
RECOMMENDED OPERATING
TEMPERATURE AND SUPPLY VOLTAGE
Grade
Military
Commercial
Temperature
–55°C to +125°C
0°C to +70°C
GND
0V
0V
VCC
5V
±
10%
5V
±
10%
3090 tbl 06
NOTE:
3090 tbl 02
1. This parameter is determined by device characterization, but is not
production tested.
5.2
2
IDT6168SA/LA
CMOS STATIC RAM 16K (4K x 4-BIT)
MILITARY AND COMMERCIAL TEMPERATURE RANGES
DC ELECTRICAL CHARACTERISTICS
(1)
(V
CC
= 5.0V
±
10%, V
LC
= 0.2V, V
HC
= V
CC
- 0.2V)
6168SA15
Symbol
I
CC1
Parameter
Operating Power Supply Current
CS
V
IL
, Outputs Open,
V
CC
= Max., f = 0
(3)
Dynamic Operating Current
CS
V
IL
, Outputs Open,
V
CC
= Max., f = f
MAX
(3)
Standby Power Supply Current
(TTL Level)
CS
V
IH
, V
CC
= Max.,
Outputs Open, f = f
MAX
(3)
Full Standby Power Supply Current
(CMOS Level)
CS
V
HC
, V
CC
= Max.,
V
IN
V
HC
or V
IN
V
LC
, f = 0
(3)
Power Com’l. Mil.
SA
LA
SA
LA
SA
LA
SA
LA
110
145
55
20
120
165
60
20
6168SA20
6168LA20
Com’l.
90
70
120
100
45
30
20
0.5
Mil.
100
80
120
110
45
35
20
5
3090 tbl 07
Unit
mA
I
CC2
mA
I
SB
mA
I
SB1
mA
DC ELECTRICAL CHARACTERISTICS
(CONTINUED)
(1)
6168SA25
6168LA25
6168SA35
6168LA35
Mil.
100
80
110
90
35
25
10
0.3
90
70
100
80
30
20
3
0.5
6168SA45/55
6168LA45/55
Com’l.
Mil.
100
80
110
80
35
25/20
10
0.3
6168SA70
(2)
6168LA70
(2)
Com’l.
Mil.
100
80
110
80
35
20
10
0.3
3090 tbl 08
(V
CC
= 5.0V
±
10%, V
LC
= 0.2V, V
HC
= V
CC
- 0.2V)
Symbol
I
CC1
Parameter
Operating Power Supply Current
CS
V
IL
, Outputs Open,
V
CC
= Max., f = 0
(3)
Dynamic Operating Current
CS
V
IL
, Outputs Open,
V
CC
= Max., f = f
MAX
(3)
Standby Power Supply Current
(TTL Level)
CS
V
IH
, V
CC
= Max.,
Outputs Open, f = f
MAX
(3)
Full Standby Power Supply Current
(CMOS Level)
CS
V
HC
, V
CC
= Max.,
V
IN
V
HC
or V
IN
V
LC
, f = 0
(3)
Power Com’l.
SA
LA
SA
LA
SA
LA
SA
LA
90
70
110
90
35
25
3
0.5
Mil. Com’l.
100
80
120
100
45
30
10
0.3
Unit
mA
I
CC2
mA
I
SB
mA
I
SB1
mA
NOTES:
1. All values are maximum guaranteed values.
2. Also available 85 and 100ns military devices.
3. f
MAX
= 1/t
RC
, only address inputs are cycling at f
MAX
. f = 0 means no address inputs are changing.
DC ELECTRICAL CHARACTERISTICS
V
CC
= 5.0V
±
10%
Symbol
|I
LI
|
|I
LO
|
V
OL
V
OH
Parameter
Input Leakage Current
Test Condition
V
CC
= Max.,
V
IN
= GND to V
CC
MIL
COM’L
MIL
COM’L
IDT6168SA
Min.
Max.
2.4
10
2
10
2
0.5
0.4
IDT6168LA
Min.
Max.
2.4
5
2
5
2
0.5
0.4
V
3090 tbl 09
Unit
µA
µA
V
Output Leakage Current V
CC
= Max.,
CS
= V
IH
,
V
OUT
= GND to V
CC
Output LOW Voltage
Output HIGH Voltage
I
OL
= 10mA, V
CC
= Min.
I
O
L = 8mA, V
CC
= Min.
I
OH
= –4mA, V
CC
= Min.
5.2
3
IDT6168SA/LA
CMOS STATIC RAM 16K (4K x 4-BIT)
MILITARY AND COMMERCIAL TEMPERATURE RANGES
DATA RETENTION CHARACTERISTICS
(LA Version Only)
V
LC
= 0.2V, V
HC
= V
CC
– 0.2V
Symbol
V
DR
I
CCDR
Parameter
V
CC
for Data Retention
Data Retention Current
Test Condition
MIL.
COM’L.
Min.
2.0
0
t
RC
(2)
IDT6168LA
Typ.
(1)
0.5
(2)
1.0
(3)
0.5
(2)
1.0
(3)
Max.
100
(2)
150
(3)
20
(2)
30
(3)
Unit
V
µA
µA
ns
ns
3090 tbl 10
CS
V
HC
V
IN
V
HC
or
V
LC
t
CDR
(5)
t
R
(5)
Chip Deselect to Data
Retention Time
Operation Recovery Time
NOTES:
1. T
A
= +25°C.
2. at V
CC
= 2V
3. at V
CC
= 3V
4. t
RC
= Read Cycle Time.
5. This parameter is guaranteed by device characterization, but is not production tested.
LOW V
CC
DATA RETENTION WAVEFORM
DATA
RETENTION
MODE
V
CC
t
CDR
4.5V
V
DR
2V
V
IH
V
DR
V
IH
3090 drw 04
4.5V
t
R
CS
AC TEST CONDITIONS
Input Pulse Levels
Input Rise/Fall Times
Input Timing Reference Levels
Output Reference Levels
AC Test Load
GND to 3.0V
5ns
1.5V
1.5V
See Figures 1 and 2
3090 tbl 11
5V
5V
480Ω
DATA
OUT
255Ω
30pF*
480
DATA
OUT
255
5pF*
3090 drw 05
3090 drw 06
Figure 1. AC Test Load
*Includes scope and jig capacitances
Figure 2. AC Test Load
(for t
CHZ
, t
CLZ
, t
WHZ
and t
OW
)
5.2
4
IDT6168SA/LA
CMOS STATIC RAM 16K (4K x 4-BIT)
MILITARY AND COMMERCIAL TEMPERATURE RANGES
AC ELECTRICAL CHARACTERISTICS
(V
CC
= 5.0V
±
10%, All Temperature Ranges)
6168SA15
Symbol
Read Cycle
t
RC
t
AA
t
ACS
t
CLZ
(2)
t
CHZ
(2)
t
OH
t
PU
(2)
t
PD
(2)
Read Cycle Time
Address Access Time
Chip Select Access Time
Chip Select to Output in Low-Z
Chip Deselect to Output in High-Z
Output Hold from Address Change
Chip Select to Power-Up Time
Chip Deselect to Power-Down Time
15
3
3
0
15
15
8
15
20/25
5
3
0
20/25
20/25
10
20/25
ns
ns
ns
ns
ns
ns
ns
ns
3090 drw 12
6168SA20/25
6168LA20/25
Min.
Max.
Unit
Parameter
Min.
Max.
AC ELECTRICAL CHARACTERISTICS (CONTINUED)
(V
CC
= 5.0V
±
10%, All Temperature Ranges)
6168SA35
6168LA35
6168SA45
(1)
6168LA45
(1)
6168SA55
(1)
6168LA55
(1)
6168SA70
(1)
6168LA70
(1)
Symbol
Read Cycle
t
RC
t
AA
t
ACS
t
CLZ
(2)
t
CHZ
(2)
t
OH
t
PU
(2)
t
PD
(2)
Parameter
Read Cycle Time
Address Access Time
Chip Select Access Time
Chip Select to Output in Low-Z
Chip Deselect to Output in High-Z
Output Hold from Address Change
Chip Select to Power-Up Time
Chip Deselect to Power-Down Time
Min.
35
5
3
0
Max.
35
35
15
35
Min.
45
5
3
0
Max.
45
45
25
40
Min.
55
5
3
0
Max.
55
55
25
50
Min.
70
5
3
0
Max.
70
70
30
60
Unit
ns
ns
ns
ns
ns
ns
ns
ns
3090 tbl 13
NOTES:
1. –55°C to +125°C temperature range only. Also available 85ns and 100ns devices.
2. This parameter is guaranteed with AC Test load (Figure 2) by device characterization, but is not production tested.
TIMING WAVEFORM OF READ CYCLE NO. 1
(1, 2)
t
RC
ADDRESS
t
AA
t
OH
DATA
OUT
PREVIOUS DATA VALID
DATA VALID
3090 drw 07
5.2
5
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