型号
- 型号
- 关键词
Multi-Port SRAM, 4KX16, 45ns, CMOS, PQFP80, TQFP-80
器件类别：存储
厂商名称：IDT (Integrated Device Technology)
器件标准：
| 型号 | IDT70824S45PFG8 | IDT70824L45PFG8 | IDT70824S45PF8 | IDT70824L45PF8 |
|---|---|---|---|---|
| 描述 | Multi-Port SRAM, 4KX16, 45ns, CMOS, PQFP80, TQFP-80 | Multi-Port SRAM, 4KX16, 45ns, CMOS, PQFP80, TQFP-80 | Multi-Port SRAM, 4KX16, 45ns, CMOS, PQFP80, TQFP-80 | Multi-Port SRAM, 4KX16, 45ns, CMOS, PQFP80, TQFP-80 |
| 是否无铅 | 不含铅 | 不含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP | QFP | QFP | QFP |
| 包装说明 | TQFP-80 | TQFP-80 | TQFP-80 | TQFP-80 |
| 针数 | 80 | 80 | 80 | 80 |
| Reach Compliance Code | compliant | compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 45 ns | 45 ns | 45 ns | 45 ns |
| 其他特性 | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN |
| JESD-30 代码 | S-PQFP-G80 | S-PQFP-G80 | S-PQFP-G80 | S-PQFP-G80 |
| JESD-609代码 | e3 | e3 | e0 | e0 |
| 长度 | 14 mm | 14 mm | 14 mm | 14 mm |
| 内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
| 内存集成电路类型 | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM |
| 内存宽度 | 16 | 16 | 16 | 16 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 80 | 80 | 80 | 80 |
| 字数 | 4096 words | 4096 words | 4096 words | 4096 words |
| 字数代码 | 4000 | 4000 | 4000 | 4000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 4KX16 | 4KX16 | 4KX16 | 4KX16 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LQFP | LQFP | LQFP | LQFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 260 | 260 | 240 | 240 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | MATTE TIN | MATTE TIN | TIN LEAD | TIN LEAD |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 20 | 20 |
| 宽度 | 14 mm | 14 mm | 14 mm | 14 mm |
| Base Number Matches | 1 | 1 | 1 | - |
