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IDT70T3399S166BCGI8

Application Specific SRAM, 128KX18, 12ns, CMOS, PBGA256

器件类别:存储    存储   

厂商名称:IDT (Integrated Device Technology)

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
IDT (Integrated Device Technology)
包装说明
BGA, BGA256,16X16,40
Reach Compliance Code
compliant
最长访问时间
12 ns
最大时钟频率 (fCLK)
166 MHz
I/O 类型
COMMON
JESD-30 代码
S-PBGA-B256
JESD-609代码
e1
内存密度
2359296 bit
内存集成电路类型
APPLICATION SPECIFIC SRAM
内存宽度
18
湿度敏感等级
3
端口数量
2
端子数量
256
字数
131072 words
字数代码
128000
工作模式
SYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
128KX18
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
BGA
封装等效代码
BGA256,16X16,40
封装形状
SQUARE
封装形式
GRID ARRAY
并行/串行
PARALLEL
峰值回流温度(摄氏度)
260
电源
2.5,2.5/3.3 V
认证状态
Not Qualified
最大待机电流
0.02 A
最小待机电流
2.4 V
最大压摆率
0.51 mA
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Silver/Copper (Sn/Ag/Cu)
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
30
Base Number Matches
1
文档预览
Features:
HIGH-SPEED 2.5V
512/256/128K X 18
IDT70T3339/19/99S
SYNCHRONOUS
DUAL-PORT STATIC RAM
WITH 3.3V OR 2.5V INTERFACE
True Dual-Port memory cells which allow simultaneous
access of the same memory location
High-speed data access
– Commercial: 3.4 (200MHz)/3.6ns (166MHz)/
4.2ns (133MHz)(max.)
– Industrial: 3.6ns (166MHz)/4.2ns (133MHz) (max.)
Selectable Pipelined or Flow-Through output mode
Counter enable and repeat features
Dual chip enables allow for depth expansion without
additional logic
Interrupt and Collision Detection Flags
Full synchronous operation on both ports
– 5ns cycle time, 200MHz operation (14Gbps bandwidth)
– Fast 3.4ns clock to data out
– 1.5ns setup to clock and 0.5ns hold on all control, data, and
address inputs @ 200MHz
– Data input, address, byte enable and control registers
– Self-timed write allows fast cycle time
Separate byte controls for multiplexed bus and bus
matching compatibility
Dual Cycle Deselect (DCD) for Pipelined Output Mode
2.5V (±100mV) power supply for core
LVTTL compatible, selectable 3.3V (±150mV) or 2.5V
(±100mV) power supply for I/Os and control signals on
each port
Industrial temperature range (-40°C to +85°C) is
available at 166MHz and 133MHz
Available in a 256-pin Ball Grid Array (BGA), a 144-pin Thin
Quad Flatpack (TQFP) and 208-pin fine pitch Ball Grid Array
(fpBGA)
Supports JTAG features compliant with IEEE 1149.1
Due to limited pin count JTAG, Collision Detection and
Interrupt are not supported on the 144-pin TQFP package
Green parts available, see ordering information
Functional Block Diagram
UB
L
LB
L
UB
R
LB
R
FT/PIPE
L
1/0
0a 1a
a
0b 1b
b
1b 0b
b
1a 0a
a
1/0
FT/PIPE
R
R/W
L
CE
0L
CE
1L
1
0
1/0
B B
WW
0 1
L L
B B
WW
1 0
R R
1
0
1/0
R/W
R
CE
0R
CE
1R
OE
L
Dout0-8_L
Dout9-17_L
Dout0-8_R
Dout9-17_R
OE
R
1b 0b 1a 0a
FT/PIPE
L
0/1
0a 1a 0b
1b
,
0/1
FT/PIPE
R
ab
512/256/128K x 18
MEMORY
ARRAY
ba
I/O
0L
- I/O
17L
Din_L
Din_R
I/O
0R
- I/O
17R
CLK
L
A
18L
(1)
A
0L
REPEAT
L
ADS
L
CNTEN
L
A
18R (1)
CLK
R
,
Counter/
Address
Reg.
ADDR_L
ADDR_R
Counter/
Address
Reg.
A
0R
REPEAT
R
ADS
R
CNTEN
R
TDI
TCK
TMS
TRST
CE
0 L
CE1L
R/
W
L
INTERRUPT
COLLISION
DETECTION
LOGIC
CE
0 R
CE1R
R/
W
R
JTAG
TDO
COL
L
INT
L
ZZ
L
(2)
COL
R
INT
R
ZZ
CONTROL
LOGIC
ZZ
R
(2)
5652 drw 01
NOTES:
1. Address A
18
is a NC for the IDT70T3319. Also, Addresses A
18
and A
17
are NC's for the IDT70T3399.
2. The sleep mode pin shuts off all dynamic inputs, except JTAG inputs, when asserted. All static inputs, i.e., PL/FTx and
OPTx and the sleep mode pins themselves (ZZx) are not affected during sleep mode.
JULY 2008
DSC-5652/5
1
©2008 Integrated Device Technology, Inc.
IDT70T3339/19/99S
High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
Description:
The IDT70T3339/19/99 is a high-speed 512/256/128k x 18 bit
synchronous Dual-Port RAM. The memory array utilizes Dual-Port
memory cells to allow simultaneous access of any address from both ports.
Registers on control, data, and address inputs provide minimal setup and
hold times. The timing latitude provided by this approach allows systems
to be designed with very short cycle times. With an input data register, the
IDT70T3339/19/99 has been optimized for applications having unidirec-
tional or bidirectional data flow in bursts. An automatic power down feature,
controlled by
CE
0
and CE
1,
permits the on-chip circuitry of each port to
enter a very low standby power mode.
The IDT70T3339/19/99 can support an operating voltage of either
3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power
supply for the core of the device (V
DD
) is at 2.5V.
6.42
2
IDT70T3339/19/99S
High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
Pin Configuration
(3,4,5,6,9)
70T3339/19/99BC
BC-256
(8)
01/13/03
A1
A2
A3
A4
A5
A6
A7
256-Pin BGA
Top View
(9)
A8
A9
A10
A11
A12
A13
A14
A15
A16
NC
B1
TDI
B2
NC
B3
A
17L
(2)
A
14L
B4
B5
A
11L
B6
A
8L
B7
NC
B8
CE
1L
B9
OE
L
CNTEN
L
A
5L
B10
B11
B12
A
2L
B13
A
0L
B14
NC
B15
NC
B16
INT
L
C1
NC
C2
TDO A
18L
(1)
A
15L
C3
C4
C5
A
12L
C6
A
9L
C7
UB
L
C8
CE
0L
R/W
L
REPEAT
L
C9
C10
C11
A
4L
C12
A
1L
C13
V
DD
C14
NC
C15
NC
C16
COL
L
I/O
9L
D1
D2
V
SS
D3
A
16L
D4
A
13L
D5
A
10L
D6
A
7L
D7
NC
D8
LB
L
D9
CLK
L
ADS
L
D10
D11
A
6L
D12
A
3L
D13
OPT
L
D14
NC
D15
I/O
8L
D16
NC
E1
I/O
9R
E2
NC
E3
PIPE/
FT
L
V
DDQL
V
DDQL
V
DDQR
V
DDQR
V
DDQL
V
DDQL
V
DDQR
V
DDQR
V
DD
E4
E5
E6
E7
E8
E9
E10
E11
E12
E13
NC
E14
NC
E15
I/O
8R
E16
I/O
10R
I/O
10L
F1
F2
NC
F3
V
DDQL
V
DD
F4
F5
V
DD
F6
NC
F7
V
SS
F8
V
SS
F9
V
SS
F10
V
DD
F11
V
DD
V
DDQR
F12
F13
NC
F14
I/O
7L
I/O
7R
F15
F16
I/O
11L
G1
NC
G2
I/O
11R
V
DDQL
V
DD
G3
G4
G5
NC
G6
NC
G7
V
SS
G8
V
SS
G9
V
SS
G10
V
SS
G11
V
DD
V
DDQR
I/O
6R
G12
G13
G14
NC
G15
I/O
6L
G16
NC
H1
NC
H2
I/O
12L
V
DDQR
H3
H4
V
SS
H5
V
SS
H6
V
SS
H7
V
SS
H8
V
SS
H9
V
SS
H10
V
SS
H11
V
SS
H12
V
DDQL
I/O
5L
H13
H14
NC
H15
NC
H16
NC
J1
I/O
12R
J2
NC V
DDQR
V
SS
J3
J4
J5
V
SS
J6
V
SS
J7
V
SS
J8
V
SS
J9
V
SS
J10
V
SS
J11
V
SS
J12
V
DDQL
J13
NC
J14
NC
J15
I/O
5R
J16
I/O
13L
I/O
14R
I/O
13R
V
DDQL
ZZ
R
K1
K2
K3
K4
K5
V
SS
K6
V
SS
K7
V
SS
K8
V
SS
K9
V
SS
K10
V
SS
K11
ZZ
L
V
DDQR
I/O
4R
I/O
3R
I/O
4L
K12
K13
K14
K15
K16
NC
L1
NC
L2
I/O
14L
V
DDQL
V
SS
L3
L4
L5
V
SS
L6
V
SS
L7
V
SS
L8
V
SS
L9
V
SS
L10
V
SS
L11
V
SS
L12
V
DDQR
NC
L13
L14
NC
L15
I/O
3L
L16
I/O
15L
M1
NC
M2
I/O
15R
V
DDQR
V
DD
M3
M4
M5
NC
M6
NC
M7
V
SS
M8
V
SS
M9
V
SS
M10
V
SS
M11
V
DD
M12
V
DDQL
I/O
2L
M13
M14
NC
M15
I/O
2R
M16
I/O
16R
I/O
16L
N1
N2
NC V
DDQR
N3
N4
V
DD
N5
V
DD
N6
NC
N7
V
SS
N8
V
SS
N9
V
SS
N10
V
DD
N11
V
DD
N12
V
DDQL
I/O
1R
N13
N14
I/O
1L
N15
NC
N16
NC
P1
I/O
17R
P2
NC
PIPE/
FT
R
V
DDQR
V
DDQR
V
DDQL
V
DDQL
V
DDQR
V
DDQR
V
DDQL
V
DDQL
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
V
DD
P13
NC
P14
I/O
0R
P15
NC
P16
COL
R
I/O
17L
TMS
R1
R2
R3
A
16R
R4
18R
(1)
A
13R
R5
A
10R
R6
A
7R
R7
NC
R8
LB
R
R9
CLK
R
ADS
R
R10
R11
A
6R
R12
A
3R
R13
NC
R14
NC
R15
I/O
0L
R16
INT
R
T1
NC
T2
TRST
A
T3
A
15R
T5
A
12R
T6
A
9R
T7
UB
R
T8
CE
0R
R/W
R
REPEAT
R
A
4R
T9
T10
T11
T12
A
1R
T13
OPT
R
T14
NC
T15
NC
T16
,
T4
NC
TCK
NC
A
17R
(2)
A
14R
A
11R
A
8R
NC
CE
1R
OE
R
CNTEN
R
A
5R
A
2R
A
0R
NC
NC
5652 drw 02d
NOTES:
1. Pin is a NC for IDT70T3319 and IDT70T3399.
2. Pin is a NC for IDT70T3399.
3. All V
DD
pins must be connected to 2.5V power supply.
4. All V
DDQ
pins must be connected to appropriate power supply: 3.3V if OPT pin for that port is set to V
DD
(2.5V), and 2.5V if OPT pin for that port is
set to V
SS
(0V).
5. All V
SS
pins must be connected to ground supply.
6. Package body is approximately 17mm x 17mm x 1.4mm, with 1.0mm ball-pitch.
7. This package code is used to reference the package diagram.
8. This text does not indicate orientation of the actual part-marking.
9. Pins A15 and T15 will be V
REFL
and V
REFR
respectively for future HSTL device.
,
6.42
3
IDT70T3339/19/99S
High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
Pin Configuration(con't)
(3,4,5,6,9,10)
PL/FT
L
NC
NC
A
18L
(1)
A
17L
(2)
A
16L
A
15L
A
14L
A
13L
A
12L
A
11L
A
10L
A
9L
A
8L
A
7L
UB
L
LB
L
CE
1L
CE
0L
V
DD
V
SS
CLK
L
OE
L
R/W
L
ADS
L
CNTEN
L
REPEAT
L
A
6L
A
5L
A
4L
A
3L
A
2L
A
1L
A
0L
V
DD
NC
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
01/07/03
V
SS
V
DDQR
V
SS
I/O
9L
I/O
9R
I/O
10L
I/O
10R
I/O
11L
I/O
11R
V
DDQL
V
SS
I/O
12L
I/O
12R
V
DDQR
ZZ
R
V
DD
V
DD
V
SS
V
SS
V
DDQL
V
SS
I/O
13R
I/O
13L
I/O
14R
I/O
14L
V
DDQR
V
SS
I/O
15R
I/O
15L
I/O
16R
I/O
16L
I/O
17R
I/O
17L
V
SS
V
DDQL
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
70T3339/19/99DD
DD-144
(7)
144-Pin TQFP
Top View
(8)
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
OPT
L
V
DDQR
V
SS
I/O
8L
I/O
8R
I/O
7L
I/O
7R
I/O
6L
I/O
6R
V
SS
V
DDQL
I/O
5L
I/O
5R
V
SS
V
DDQR
V
DD
V
DD
V
SS
V
SS
ZZ
L
V
DDQL
I/O
4R
I/O
4L
I/O
3R
I/O
3L
V
SS
V
DDQR
I/O
2R
I/O
2L
I/O
1R
I/O
1L
I/O
0R
I/O
0L
V
SS
V
DDQL
OPT
R
,
5652 drw 02a
NOTES:
1. Pin is a NC for IDT70T3319 and IDT70T3399.
2. Pin is a NC for IDT70T3399.
3. All V
DD
pins must be connected to 2.5V power supply.
4. All V
DDQ
pins must be connected to appropriate power supply: 3.3V if OPT pin for that port is set to V
DD
(2.5V), and 2.5V if OPT pin for that port is set to V
SS
(0V).
5. All V
SS
pins must be connected to ground supply.
6. Package body is approximately 20mm x 20mm x 1.4mm.
7. This package code is used to reference the package diagram.
8. This text does not indicate orientation of the actual part-marking.
9. Due to limited pin count, JTAG, Collison Detection and Interrupt are not supported in the DD-144 package.
10. Pins 109 and 72 will be V
REFL
and V
REFR
respectively for future HSTL device.
PL/FT
R
NC
NC
A
18R
(1)
A
17R
(2)
A
16R
A
15R
A
14R
A
13R
A
12R
A
11R
A
10R
A
9R
A
8R
A
7R
UB
R
LB
R
CE
1R
CE
0R
V
DD
V
SS
CLK
R
OE
R
R/W
R
ADS
R
CNTEN
R
REPEAT
R
A
6R
A
5R
A
4R
A
3R
A
2R
A
1R
A
0R
V
DD
NC
6.42
4
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
IDT70T3339/19/99S
High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
Pin Configurations(con't)
(3,4,5,6,9)
01/13/03
1
I/O
9L
2
INT
L
3
V
SS
4
TDO
5
NC
6
A
16L
7
A
12L
8
A
8L
9
NC
10 11
V
DD
CLK
L
12
CNTEN
L
13 14
A
4L
A
0L
15
OPT
L
16 17
NC
V
SS
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
NC
V
SS
COL
L
TDI
A
17L(2)
A
13L
A
9L
NC
CE
0L
V
SS
ADS
L
A
5L
A
1L
NC
V
DDQR
I/O
8L
NC
V
DDQL
I/O
9R
V
DDQR
PIPE/
FT
L
A
18L(1)
A
14L
A
10L
UB
L
CE
1L
V
SS
R/W
L
A
6L
A
2L
V
DD
I/O
8R
NC
V
SS
NC
V
SS
I/O
10L
NC
A
15L
A
11L
A
7L
LB
L
V
DD
OE
L
REPEAT
L
A
3L
V
DD
NC
V
DDQL
I/O
7L
I/O
7R
I/O
11L
NC
V
DDQR
I/O
10R
I/O
6L
NC
V
SS
NC
V
DDQL
I/O
11R
NC
V
SS
V
SS
I/O
6R
NC
V
DDQR
NC
V
SS
I/O
12L
NC
NC
V
DDQL
I/O
5L
NC
V
DD
NC
V
DDQR
I/O
12R
70T3339/19/99BF
BF-208
(7)
208-Pin fpBGA
Top View
(8)
V
DD
NC
V
SS
I/O
5R
V
DDQL
V
DD
V
SS
ZZ
R
ZZ
L
V
DD
V
SS
V
DDQR
I/O
14R
V
SS
I/O
13R
V
SS
I/O
3R
V
DDQL
I/O
4R
V
SS
NC
I/O
14L
V
DDQR
I/O
13L
NC
I/O
3L
V
SS
I/O
4L
V
DDQL
NC
I/O
15R
V
SS
V
SS
NC
I/O
2R
V
DDQR
NC
V
SS
NC
I/O
15L
I/O
1R
V
DDQL
NC
I/O
2L
I/O
16R
I/O
16L
V
DDQR
COL
R
TRST
A
16R
A
12R
A
8R
NC
V
DD
CLK
R
CNTEN
R
A
4R
NC
I/O
1L
V
SS
NC
V
SS
NC
I/O
17R
TCK
A
17R(2)
A
13R
A
9R
NC
CE
0R
V
SS
ADS
R
A
5R
A
1R
NC
V
DDQL
I/O
0R
V
DDQR
NC
I/O
17L
V
DDQL
TMS
A
18R(1)
A
14R
A
10R
UB
R
CE
1R
V
SS
R/W
R
A
6R
A
2R
V
SS
NC
V
SS
NC
V
SS
INT
R
PIPE/
FT
R
NC
A
15R
A
11R
A
7R
LB
R
V
DD
OE
R
REPEAT
R
A
3R
A
0R
V
DD
OPT
R
NC
I/O
0L
5652 drw 02c
NOTES:
1. Pin is a NC for IDT70T3319 and IDT70T3399.
2. Pin is a NC for IDT70T3399.
3. All V
DD
pins must be connected to 2.5V power supply.
4. All V
DDQ
pins must be connected to appropriate power supply: 3.3V if OPT pin for that port is set to V
DD
(2.5V), and 2.5V if OPT pin for that port is
set to V
SS
(0V).
5. All V
SS
pins must be connected to ground supply.
6. Package body is approximately 15mm x 15mm x 1.4mm with 0.8mm ball pitch.
7. This package code is used to reference the package diagram.
8. This text does not indicate orientation of the actual part-marking.
9. Pins B14 and R14 will be V
REFL
and V
REFR
respectively for future HSTL device.
6.42
5
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