首页 > 器件类别 > 存储

IDT70V3389S6BCGI

Dual-Port SRAM, 64KX18, 6ns, CMOS, PBGA256, BGA-256

器件类别:存储   

厂商名称:IDT (Integrated Device Technology)

器件标准:  

下载文档
器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
IDT (Integrated Device Technology)
零件包装代码
BGA
包装说明
LBGA, BGA256,16X16,40
针数
256
Reach Compliance Code
compliant
ECCN代码
3A991.B.2.A
Is Samacsys
N
最长访问时间
6 ns
最大时钟频率 (fCLK)
83 MHz
I/O 类型
COMMON
JESD-30 代码
S-PBGA-B256
JESD-609代码
e1
长度
17 mm
内存密度
1179648 bit
内存集成电路类型
DUAL-PORT SRAM
内存宽度
18
湿度敏感等级
3
功能数量
1
端口数量
2
端子数量
256
字数
65536 words
字数代码
64000
工作模式
SYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
64KX18
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
LBGA
封装等效代码
BGA256,16X16,40
封装形状
SQUARE
封装形式
GRID ARRAY, LOW PROFILE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
260
电源
2.5/3.3,3.3 V
认证状态
Not Qualified
座面最大高度
1.5 mm
最大待机电流
0.03 A
最小待机电流
3.15 V
最大压摆率
0.36 mA
最大供电电压 (Vsup)
3.45 V
最小供电电压 (Vsup)
3.15 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Silver/Copper (Sn/Ag/Cu)
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
30
宽度
17 mm
Base Number Matches
1
文档预览
HIGH-SPEED 3.3V 64K x 18
SYNCHRONOUS PIPELINED
DUAL-PORT STATIC RAM
WITH 3.3V OR 2.5V INTERFACE
Features
x
IDT70V3389S
True Dual-Port memory cells which allow simultaneous
access of the same memory location
x
High-speed clock to data access
– Commercial: 4.2/5/6ns (max.)
– Industrial: 5/6ns (max)
x
Pipelined output mode
x
Counter enable and reset features
x
Dual chip enables allow for depth expansion without
additional logic
x
Full synchronous operation on both ports
– 7.5ns cycle time, 133MHz operation (9.6 Gbps bandwidth)
– Fast 4.2ns clock to data out
– 1.8ns setup to clock and 0.7ns hold on all control, data, and
x
x
x
x
x
address inputs @ 133MHz
– Data input, address, byte enable and control registers
– Self-timed write allows fast cycle time
Separate byte controls for multiplexed bus and bus
matching compatibility
LVTTL- compatible, single 3.3V (±150mV) power supply for
core
LVTTL- compatible, selectable 3.3V (±150mV)/2.5V (±125mV)
power supply for I/Os and control signals on each port
Industrial temperature range (-40°C to +85°C) is
available for selected speeds
Available in a 128-pin Thin Quad Plastic Flatpack (TQFP),
208-pin fine pitch Ball Grid Array, and 256-pin Ball
Grid Array
Functional Block Diagram
UB
L
LB
L
R/W
L
B
W
0
L
B
W
1
L
B B
WW
1 0
R R
UB
R
LB
R
R/W
R
CE
0L
CE
1L
CE
0R
CE
1R
OE
L
Dout0-8_L
Dout9-17_L
Dout0-8_R
Dout9-17_R
OE
R
64K x 18
MEMORY
ARRAY
I/O
0 L
- I/O
1 7 L
CLK
L
Din_L
Din_R
I/O
0R
- I/O
17R
CLK
R
A
15L
A
0L
CNTRST
L
ADS
L
CNTEN
L
Counter/
Address
Reg.
ADDR_L
ADDR_R
Counter/
Address
Reg.
A
15R
A
0R
CNTRST
R
ADS
R
CNTEN
R
4832 tbl 01
.
APRIL 2001
1
©2001 Integrated Device Technology, Inc.
DSC 4832/8
IDT70V3389S
High-Speed 64K x 18 Dual-Port Synchronous Pipelined Static RAM
Industrial and Commercial Temperature Ranges
Description:
The IDT70V3389 is a high-speed 64K x 18 bit synchronous Dual-Port
RAM. The memory array utilizes Dual-Port memory cells to allow
simultaneous access of any address from both ports. Registers on control,
data, and address inputs provide minimal setup and hold times. The timing
latitude provided by this approach allows systems to be designed with very
short cycle times. With an input data register, the IDT70V3389 has been
optimized for applications having unidirectional or bidirectional data flow
in bursts. An automatic power down feature, controlled by
CE
0
and CE
1,
permits the on-chip circuitry of each port to enter a very low standby power
mode.
The 70V3389 can support an Ioperating voltage of either 3.3V or 2.5V
on one or both ports, controllable by the OPT pins. The power supply for
the core of the device (V
DD
) remains at 3.3V.
Pin Configuration
(1,2,3,4)
1
I/O
9L
2
NC
3
V
SS
4
NC
5
NC
6
NC
7
A
12L
8
A
8L
9
NC
10 11
V
DD
CLK
L
12
CNTEN
L
13 14
A
4L
A
0L
15
OPT
L
16 17
NC
V
SS
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
NC
V
SS
NC
V
SS
NC
A
13L
A
9L
NC
CE
0L
V
SS
ADS
L
A
5L
A
1L
V
SS
V
DDQR
I/O
8L
NC
V
DDQL
I/O
9R
V
DDQR
V
DD
NC
A
14L
A
10L
UB
L
CE
1L
V
SS
R/W
L
A
6L
A
2L
V
DD
I/O
8R
NC
V
SS
NC
V
SS
I/O
10L
NC
A
15L
A
11L
A
7L
LB
L
V
DD
OE
L
CNTRST
L
A
3L
V
DD
NC
V
DDQL
I/O
7L
I/O
7R
I/O
11L
NC
V
DDQR
I/O
10R
I/O
6L
NC
V
SS
NC
V
DDQL
I/O
11R
NC
V
SS
V
SS
I/O
6R
NC
V
DDQR
NC
V
SS
I/O
12L
NC
NC
V
DDQL
I/O
5L
NC
V
DD
NC
V
DDQR
I/O
12R
70V3389BF
BF-208
(5)
208-Pin fpBGA
Top View
(6)
V
DD
NC
V
SS
I/O
5R
V
DDQL
V
DD
V
SS
V
SS
V
SS
V
DD
V
SS
V
DDQR
I/O
14R
V
SS
I/O
13R
V
SS
I/O
3R
V
DDQL
I/O
4R
V
SS
NC
I/O
14L
V
DDQR
I/O
13L
NC
I/O
3L
V
SS
I/O
4L
V
DDQL
NC
I/O
15R
V
SS
V
SS
NC
I/O
2R
V
DDQR
NC
V
SS
NC
I/O
15L
I/O
1R
V
DDQL
NC
I/O
2L
I/O
16R
I/O
16L
V
DDQR
NC
NC
NC
A
12R
A
8R
NC
V
DD
CLK
R
CNTEN
R
A
4R
NC
I/O
1L
V
SS
NC
V
SS
NC
I/O
17R
NC
NC
A
13R
A
9R
NC
UB
R
CE
0R
V
SS
ADS
R
A
5R
A
1R
V
SS
V
DDQL
I/O
0R
V
DDQR
NC
I/O
17L
V
DDQL
V
SS
NC
A
14R
A
10R
CE
1R
V
SS
R/W
R
A
6R
A
2R
V
SS
NC
V
SS
NC
V
SS
NC
V
DD
NC
A
15R
A
11R
A
7R
LB
R
V
DD
OE
R
CNTRST
R
A
3R
A
0R
V
DD
OPT
R
NC
I/O
0L
4832 tbl 02
NOTES:
1. All V
DD
pins must be connected to 3.3V power supply.
2. All V
DDQ
pins must be connected to appropriate power supply: 3.3V if OPT pin for that port is set to V
IH
(3.3V), and 2.5V if OPT pin for that port is
set to V
IL
(0V).
3. All V
SS
pins must be connected to ground supply.
4. Package body is approximately 15mm x 15mm x 1.4mm with 0.8mm ball pitch.
5. This package code is used to reference the package diagram.
6. This text does not indicate orientation of the actual part-marking.
6.42
2
IDT70V3389S
High-Speed 64K x 18 Dual-Port Synchronous Pipelined Static RAM
Industrial and Commercial Temperature Ranges
Pin Configuration
(1,2,3,4)
(con't.)
70V3389BC
BC-256
(5)
256-Pin BGA
Top View
(6)
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
NC
B1
NC
B2
NC
B3
NC
B4
A
14L
B5
A
11L
B6
A
8L
B7
NC
B8
CE
1L
B9
OE
L
CNTEN
L
B10
B11
A
5L
B12
A
2L
B13
A
0L
B14
NC
B15
NC
B16
NC
C1
NC
C2
NC
C3
NC
C4
A
15L
C5
A
12L
C6
A
9L
C7
UB
L
C8
CE
0L
R/W
L
CNTRST
L
C9
C10
C11
A
4L
C12
A
1L
C13
V
DD
C14
NC
C15
NC
C16
NC
D1
I/O
9L
D2
V
SS
D3
NC
D4
A
13L
D5
A
10L
D6
A
7L
D7
NC
D8
LB
L
D9
CLK
L
ADS
L
D10
D11
A
6L
D12
A
3L
D13
OPT
L
D14
NC
D15
I/O
8L
D16
NC
E1
I/O
9R
E2
NC
E3
V
DD
E4
V
DDQL
V
DDQL
V
DDQR
V
DDQR
V
DDQL
V
DDQL
V
DDQR
V
DDQR
V
DD
E5
E6
E7
E8
E9
E10
E11
E12
E13
NC
E14
NC
E15
I/O
8R
E16
I/O
10R
I/O
10L
F1
F2
NC
F3
V
DDQL
F4
V
DD
F5
V
DD
F6
V
SS
F7
V
SS
F8
V
SS
F9
V
SS
F10
V
DD
F11
V
DD
V
DDQR
F12
F13
NC
F14
I/O
7L
F15
I/O
7R
F16
I/O
11L
G1
NC
G2
I/O
11R
V
DDQL
G3
G4
V
DD
G5
V
SS
G6
V
SS
G7
V
SS
G8
V
SS
G9
V
SS
G10
V
SS
G11
V
DD
V
DDQR
I/O
6R
G12
G13
G14
NC
G15
I/O
6L
G16
NC
H1
NC
H2
I/O
12L
V
DDQR
H3
H4
V
SS
H5
V
SS
H6
V
SS
H7
V
SS
H8
V
SS
H9
V
SS
H10
V
SS
H11
V
SS
H12
V
DDQL
I/O
5L
H13
H14
NC
H15
NC
H16
NC
J1
I/O
12R
J2
NC
J3
V
DDQR
V
SS
J4
J5
V
SS
J6
V
SS
J7
V
SS
J8
V
SS
J9
V
SS
J10
V
SS
J11
V
SS
J12
V
DDQL
J13
NC
J14
NC
J15
I/O
5R
J16
I/O
13L
I/O
14R
I/O
13R
V
DDQL
K1
K2
K3
K4
V
SS
K5
V
SS
K6
V
SS
K7
V
SS
K8
V
SS
K9
V
SS
K10
V
SS
K11
V
SS
K12
V
DDQR
I/O
4R
I/O
3R
K13
K14
K15
I/O
4L
K16
NC
L1
NC
L2
I/O
14L
V
DDQL
L3
L4
V
SS
L5
V
SS
L6
V
SS
L7
V
SS
L8
V
SS
L9
V
SS
L10
V
SS
L11
V
SS
L12
V
DDQR
L13
NC
L14
NC
L15
I/O
3L
L16
I/O
15L
M1
NC
M2
I/O
15R
V
DDQR
M3
M4
V
DD
M5
V
SS
M6
V
SS
M7
V
SS
M8
V
SS
M9
V
SS
M10
V
SS
M11
V
DD
M12
V
DDQL
I/O
2L
M13
M14
NC
M15
I/O
2R
M16
I/O
16R
I/O
16L
N1
N2
NC
N3
V
DDQR
N4
V
DD
N5
V
DD
N6
V
SS
N7
V
SS
N8
V
SS
N9
V
SS
N10
V
DD
N11
V
DD
N12
V
DDQL
I/O
1R
N13
N14
I/O
1L
N15
NC
N16
NC
P1
I/O
17R
P2
NC
P3
V
DD
P4
V
DDQR
V
DDQR
V
DDQL
V
DDQL
V
DDQR
V
DDQR
V
DDQL
V
DDQL
P5
P6
P7
P8
P9
P10
P11
P12
V
DD
P13
NC
P14
I/O
0R
P15
NC
P16
NC
R1
I/O
17L
R2
NC
R3
NC
R4
A
13R
R5
A
10R
R6
A
7R
R7
NC
R8
LB
R
R9
CLK
R
ADS
R
R10
R11
A
6R
R12
A
3R
R13
NC
R14
NC
R15
I/O
0L
R16
NC
T1
NC
T2
NC
T3
NC
T4
A
15R
T5
A
12R
T6
A
9R
T7
UB
R
T8
CE
0R
R/W
R
CNTRST
R
T9
T10
T11
A
4R
T12
A
1R
T13
OPT
R
T14
NC
T15
NC
T16
,
NC
NC
NC
NC
A
14R
A
11R
A
8R
NC
CE
1R
OE
R
CNTEN
R
A
5R
A
2R
A
0R
NC
NC
4832 drw 02c
NOTES:
1. All V
DD
pins must be connected to 3.3V power supply.
2. All V
DDQ
pins must be connected to appropriate power supply: 3.3V if OPT pin for that port is set to V
IH
(3.3V), and 2.5V if OPT pin for that port is
set to V
IL
(0V).
3. All V
SS
pins must be connected to ground supply.
4. Package body is approximately 17mm x 17mm x 1.4mm, with 1.0mm ball-pitch.
5. This package code is used to reference the package diagram.
6. This text does not indicate orientation of the actual part-marking.
,
6.42
3
IDT70V3389S
High-Speed 64K x 18 Dual-Port Synchronous Pipelined Static RAM
Industrial and Commercial Temperature Ranges
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
A
13L
A
12L
A
11L
A
10L
A
9L
A
8L
A
7L
UB
L
LB
L
CE
1L
CE
0L
V
DD
V
DD
V
SS
V
SS
CLK
L
OE
L
R/W
L
ADS
L
CNTEN
L
CNTRST
L
A
6L
A
5L
A
4L
A
3L
A
2L
Pin Configuration
(1,2,3,4)
(con't.)
A
14L
A
15L
V
SS
NC
IO
9L
IO
9R
V
DDQL
V
SS
IO
10L
IO
10R
V
DDQR
V
SS
IO
11L
IO
11R
IO
12L
IO
12R
V
DD
V
DD
V
SS
V
SS
IO
13R
IO
13L
IO
14R
IO
14L
IO
15R
IO
15L
V
DDQL
V
SS
IO
16R
IO
16L
V
DDQR
V
SS
IO
17R
IO
17L
NC
NC
A
15R
A
14R
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
70V3389PRF
PK-128
(5)
128-Pin TQFP
Top View
(6)
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
A
1L
A
0L
OPT
L
NC (V
SS
)
(7)
IO
8L
IO
8R
NC (V
SS
)
(7)
V
SS
V
DDQL
IO
7L
IO
7R
V
SS
V
DDQR
IO
6L
IO
6R
IO
5L
IO
5R
V
DD
V
DD
V
SS
V
SS
IO
4R
IO
4L
IO
3R
IO
3L
IO
2R
IO
2L
V
SS
V
DDQL
IO
1R
IO
1L
V
SS
V
DDQR
IO
0R
IO
0L
OPT
R
A
0R
A
1R
4832 drw 02a
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
NOTES:
1. All V
DD
pins must be connected to 3.3V power supply.
2. All V
DDQ
pins must be connected to appropriate power supply: 3.3V if OPT pin for that port is set to V
IH
(3.3V), and 2.5V if OPT pin for that port is
set to V
IL
(0V).
3. All V
SS
pins must be connected to ground supply.
4. Package body is approximately 14mm x 20mm x 1.4mm.
5. This package code is used to reference the package diagram.
6. This text does not indicate orientation of the actual part-marking.
7. In the 70V3379 (32K x 18) and 70V3389 (64K x 18), pins 96 and 99 are NC. The upgrade devices 70V3399 (128K x 18) and 70V3319 (256K x 18) assign
these pins as V
SS
. Customers who plan to take advantage of the upgrade path should treat these pins as V
SS
on the 70V3379 and 70V3389. If no upgrade is
needed, the pins can be treated as NC.
A
13R
A
12R
A
11R
A
10R
A
9R
A
8R
A
7R
UB
R
LB
R
CE
1R
CE
0R
V
DD
V
DD
V
SS
V
SS
CLK
R
OE
R
R/W
R
ADS
R
CNTEN
R
CNTRST
R
A
6R
A
5R
A
4R
A
3R
A
2R
.
6.42
4
IDT70V3389S
High-Speed 64K x 18 Dual-Port Synchronous Pipelined Static RAM
Industrial and Commercial Temperature Ranges
Pin Names
Left Port
CE
0L
,
CE
1L
R/W
L
OE
L
A
0L
- A
15L
I/O
0L
- I/O
17L
CLK
L
ADS
L
CNTEN
L
CNTRST
L
UB
L
- LB
L
V
DDQL
OPT
L
V
DD
V
SS
Right Port
CE
0R
,
CE
1R
R/W
R
OE
R
A
0R
- A
15R
I/O
0R
- I/O
17R
CLK
R
ADS
R
CNTEN
R
CNTRST
R
UB
R
- LB
R
V
DDQR
OPT
R
Chip Enables
Read/Write Enable
Output Enable
Address
Data Input/Output
Clock
Address Strobe Enable
Counter Enable
Counter Reset
Byte Enables (9-bit bytes)
Power (I/O Bus) (3.3V or 2.5V)
(1)
Option for selecting V
DDQX
(1,2)
Power (3.3V)
(1)
Ground (0V)
4832 tbl 01
Names
NOTES:
1. V
DD
, OPT
X
, and V
DDQX
must be set to appropriate operating levels prior to
applying inputs on the I/Os and controls for that port.
2. OPT
X
selects the operating voltage levels for the I/Os and controls on that port.
If OPT
X
is set to VIH (3.3V), then that port's I/Os and controls will operate at 3.3V
levels and V
DDQX
must be supplied at 3.3V. If OPT
X
is set to VIL (0V), then that
port's I/Os and controls will operate at 2.5V levels and V
DDQX
must be supplied
at 2.5V. The OPT pins are independent of one another—both ports can operate
at 3.3V levels, both can operate at 2.5V levels, or either can operate at 3.3V
with the other at 2.5V.
Truth Table I—Read/Write and Enable Control
(1,2,3)
OE
X
X
X
X
L
L
L
H
CLK
CE
0
L
L
L
L
L
L
L
L
CE
1
H
H
H
H
H
H
H
H
UB
H
H
L
L
H
L
L
L
LB
H
L
H
L
L
H
L
L
R/W
X
L
L
L
H
H
H
X
Upper Byte
I/O
9-18
High-Z
High-Z
D
IN
D
IN
High-Z
D
OUT
D
OUT
High-Z
Lower Byte
I/O
0-8
High-Z
D
IN
High-Z
D
IN
D
OUT
High-Z
D
OUT
High-Z
All Bytes Deselected
Write to Lower Byte Only
Write to Upper Byte Only
Write to Both Bytes
Read Lower Byte Only
Read Upper Byte Only
Read Both Bytes
Outputs Disabled
4832 tbl 02
MODE
NOTES:
1. "H" = V
IH,
"L" = V
IL,
"X" = Don't Care.
2.
ADS, CNTEN, CNTRST
= V
IH
.
3.
OE
is an asynchronous input signal.
6.42
5
查看更多>
参数对比
与IDT70V3389S6BCGI相近的元器件有:IDT70V3389S5BFGI8、IDT70V3389S5PRFGI8、IDT70V3389S6BFGI、IDT70V3389S6PRFGI、IDT70V3389S6PRFG8、IDT70V3389S5PRFG8、IDT70V3389S4PRFG8、IDT70V3389S5BCGI8。描述及对比如下:
型号 IDT70V3389S6BCGI IDT70V3389S5BFGI8 IDT70V3389S5PRFGI8 IDT70V3389S6BFGI IDT70V3389S6PRFGI IDT70V3389S6PRFG8 IDT70V3389S5PRFG8 IDT70V3389S4PRFG8 IDT70V3389S5BCGI8
描述 Dual-Port SRAM, 64KX18, 6ns, CMOS, PBGA256, BGA-256 Dual-Port SRAM, 64KX18, 5ns, CMOS, PBGA208, FINE PITCH, BGA-208 Dual-Port SRAM, 64KX18, 5ns, PQFP128, PLASTIC, TQFP-128 Dual-Port SRAM, 64KX18, 6ns, CMOS, PBGA208, FINE PITCH, BGA-208 Dual-Port SRAM, 64KX18, 6ns, CMOS, PQFP128, PLASTIC, TQFP-128 Dual-Port SRAM, 64KX18, 6ns, CMOS, PQFP128, PLASTIC, TQFP-128 Dual-Port SRAM, 64KX18, 5ns, CMOS, PQFP128, PLASTIC, TQFP-128 Dual-Port SRAM, 64KX18, 4.2ns, CMOS, PQFP128, PLASTIC, TQFP-128 Dual-Port SRAM, 64KX18, 5ns, CMOS, PBGA256, BGA-256
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 BGA BGA QFP BGA QFP QFP QFP QFP BGA
包装说明 LBGA, BGA256,16X16,40 TFBGA, BGA208,17X17,32 LFQFP, TFBGA, BGA208,17X17,32 LFQFP, QFP128,.63X.87,20 LFQFP, LFQFP, LFQFP, LBGA, BGA256,16X16,40
针数 256 208 128 208 128 128 128 128 256
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 6 ns 5 ns 5 ns 6 ns 6 ns 6 ns 5 ns 4.2 ns 5 ns
JESD-30 代码 S-PBGA-B256 S-PBGA-B208 R-PQFP-G128 S-PBGA-B208 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 S-PBGA-B256
JESD-609代码 e1 e1 e3 e1 e3 e3 e3 e3 e1
长度 17 mm 15 mm 20 mm 15 mm 20 mm 20 mm 20 mm 20 mm 17 mm
内存密度 1179648 bit 1179648 bit 1179648 bit 1179648 bit 1179648 bit 1179648 bit 1179648 bit 1179648 bit 1179648 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 18 18 18 18 18 18 18 18 18
湿度敏感等级 3 3 3 3 3 3 3 3 3
功能数量 1 1 1 1 1 1 1 1 1
端子数量 256 208 128 208 128 128 128 128 256
字数 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words
字数代码 64000 64000 64000 64000 64000 64000 64000 64000 64000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 70 °C 70 °C 70 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C - - - -40 °C
组织 64KX18 64KX18 64KX18 64KX18 64KX18 64KX18 64KX18 64KX18 64KX18
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LBGA TFBGA LFQFP TFBGA LFQFP LFQFP LFQFP LFQFP LBGA
封装形状 SQUARE SQUARE RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE
封装形式 GRID ARRAY, LOW PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260 260 260 260 260 260 260 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.5 mm 1.2 mm 1.6 mm 1.2 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.5 mm
最大供电电压 (Vsup) 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V
最小供电电压 (Vsup) 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) MATTE TIN Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn) - annealed MATTE TIN MATTE TIN MATTE TIN Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL BALL GULL WING BALL GULL WING GULL WING GULL WING GULL WING BALL
端子节距 1 mm 0.8 mm 0.5 mm 0.8 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 1 mm
端子位置 BOTTOM BOTTOM QUAD BOTTOM QUAD QUAD QUAD QUAD BOTTOM
处于峰值回流温度下的最长时间 30 30 30 30 30 30 30 30 30
宽度 17 mm 15 mm 14 mm 15 mm 14 mm 14 mm 14 mm 14 mm 17 mm
最大时钟频率 (fCLK) 83 MHz 100 MHz - 83 MHz 83 MHz - - - 100 MHz
I/O 类型 COMMON COMMON - COMMON COMMON - - - COMMON
端口数量 2 2 - 2 2 - - - 2
输出特性 3-STATE 3-STATE - 3-STATE 3-STATE - - - 3-STATE
封装等效代码 BGA256,16X16,40 BGA208,17X17,32 - BGA208,17X17,32 QFP128,.63X.87,20 - - - BGA256,16X16,40
电源 2.5/3.3,3.3 V 2.5/3.3,3.3 V - 2.5/3.3,3.3 V 2.5/3.3,3.3 V - - - 2.5/3.3,3.3 V
最大待机电流 0.03 A 0.03 A - 0.03 A 0.03 A - - - 0.03 A
最小待机电流 3.15 V 3.15 V - 3.15 V 3.15 V - - - 3.15 V
最大压摆率 0.36 mA 0.415 mA - 0.36 mA 0.36 mA - - - 0.415 mA
Base Number Matches 1 1 1 1 1 1 1 - -
其他特性 - PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE -
一个用VHDL写的真实的机器人程序,请给填写注释.(20分不是实际的分数.可以给更高的分数.)
这是一个真实的机器人的运动程序.是我的教授给学生们一起研究的.任务就是让我把它的实际的意思给注释出来...
lbf_78 嵌入式系统
儿童防走失提醒器
带着小孩出去游玩时,恐怕你最提心的是小孩走失。本装置可有效地解决这一问题。该装置由发射器和接收器组成...
程序天使 DIY/开源硬件专区
基于MSP430的低功耗温度采集仪
基于MSP430的低功耗温度采集仪 基于MSP430的低功耗温度采集仪 ...
taburiss001 微控制器 MCU
求助滤波器设计!!
要用TMS320F2812做各种滤波器,可现在问题重重,请求人帮助 有酬谢,有热心的高手可加QQ:2...
lf2812 DSP 与 ARM 处理器
多轴无人机安全气囊
大家好,我公司寻求资金和技术员,研发无人机气囊,会有广泛的应用,有意者请联系我,谢谢。 多轴无人...
airbag DIY/开源硬件专区
热门器件
热门资源推荐
器件捷径:
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ
需要登录后才可以下载。
登录取消