型号
- 型号
- 关键词
Dual-Port SRAM, 32KX16, 12ns, CMOS, PQFP128, TQFP-128
厂商名称：IDT (Integrated Device Technology)
器件标准：
| 型号 | IDT70V9279S12PRFGI | IDT70V9279S15PRFGI | IDT70V9279L15PRFGI | IDT70V9279L12PRFGI8 | IDT70V9279L12PRFGI |
|---|---|---|---|---|---|
| 描述 | Dual-Port SRAM, 32KX16, 12ns, CMOS, PQFP128, TQFP-128 | Dual-Port SRAM, 32KX16, 15ns, CMOS, PQFP128, TQFP-128 | Dual-Port SRAM, 32KX16, 15ns, CMOS, PQFP128, TQFP-128 | Dual-Port SRAM, 32KX16, 12ns, CMOS, PQFP128, TQFP-128 | Dual-Port SRAM, 32KX16, 12ns, CMOS, PQFP128, TQFP-128 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | QFP | QFP | QFP | QFP | QFP |
| 包装说明 | TQFP-128 | TQFP-128 | TQFP-128 | TQFP-128 | TQFP-128 |
| 针数 | 128 | 128 | 128 | 128 | 128 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
| 最长访问时间 | 12 ns | 15 ns | 15 ns | 12 ns | 12 ns |
| 其他特性 | PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE | PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE | PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE | PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE | PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE |
| JESD-30 代码 | R-PQFP-G128 | R-PQFP-G128 | R-PQFP-G128 | R-PQFP-G128 | R-PQFP-G128 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm |
| 内存密度 | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit |
| 内存集成电路类型 | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 128 | 128 | 128 | 128 | 128 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 32KX16 | 32KX16 | 32KX16 | 32KX16 | 32KX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | - | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |