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IDT71V65612S200BQ

ZBT SRAM, 256KX36, 3.2ns, CMOS, PBGA165, 13 X 15 MM, FINE PITCH, BGA-165

器件类别:存储    存储   

厂商名称:IDT (Integrated Device Technology)

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
IDT (Integrated Device Technology)
零件包装代码
BGA
包装说明
TBGA,
针数
165
Reach Compliance Code
not_compliant
ECCN代码
3A991.B.2.A
最长访问时间
3.2 ns
JESD-30 代码
R-PBGA-B165
JESD-609代码
e0
长度
15 mm
内存密度
9437184 bit
内存集成电路类型
ZBT SRAM
内存宽度
36
湿度敏感等级
3
功能数量
1
端子数量
165
字数
262144 words
字数代码
256000
工作模式
SYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
256KX36
封装主体材料
PLASTIC/EPOXY
封装代码
TBGA
封装形状
RECTANGULAR
封装形式
GRID ARRAY, THIN PROFILE
并行/串行
PARALLEL
峰值回流温度(摄氏度)
225
认证状态
Not Qualified
座面最大高度
1.2 mm
最大供电电压 (Vsup)
3.465 V
最小供电电压 (Vsup)
3.135 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
20
宽度
13 mm
文档预览
256K x 36, 512K x 18
3.3V Synchronous ZBT™ SRAMs
2.5V I/O, Burst Counter
Pipelined Outputs
Features
u
256K x 36, 512K x 18 memory configurations
u
Supports high performance system speed - 200 MHz
u
ZBT
TM
Feature - No dead cycles between write and read cycles
u
Internally synchronized output buffer enable eliminates the
u
Single R/W (READ/WRITE) control pin
u
Positive clock-edge triggered address, data, and control
signal registers for fully pipelined applications
u
4-word burst capability (interleaved or linear)
u
Individual byte write (BW
1
-
BW
4
) control (May tie active)
u
Three chip enables for simple depth expansion
u
3.3V power supply (±5%)
u
2.5V I/O Supply (V
DDQ
)
u
Power down controlled by ZZ input
u
Packaged in a JEDEC standard 100-pin plastic thin quad
need to control
OE
(3.2 ns Clock-to-Data Access)
Preliminary
IDT71V65612
IDT71V65812
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch
ball grid array (fBGA)
The IDT71V65612/5812 are 3.3V high-speed 9,437,184-bit
(9 Megabit) synchronous SRAMS. They are designed to eliminate dead
bus cycles when turning the bus around between reads and writes, or
writes and reads. Thus, they have been given the name ZBT
TM
, or Zero
Bus Turnaround.
Description
Address and control signals are applied to the SRAM during one clock
cycle, and two cycles later the associated data cycle occurs, be it read
or write. The IDT71V65612/5812 contain data I/O, address and control
signal registers. Output enable is the only asynchronous signal and can
be used to disable the outputs at any given time.
A Clock Enable (CEN) pin allows operation of the IDT71V65612/5812
to be suspended as long as necessary. All synchronous inputs are
ignored when (CEN) is high and the internal device registers will hold their
previous values.
There are three chip enable pins (CE
1
, CE
2
,
CE
2
) that allow the
user to deselect the device when desired. If any one of these three are
not asserted when ADV/LD is low, no new memory operation can be
initiated. However, any pending data transfers (reads or writes) will be
completed. The data bus will tri-state two cycles after chip is deselected or
a write is initiated.
The IDT71V65612/5812 has an on-chip burst counter. In the burst
mode, the IDT71V65612/5812 can provide four cycles of data for a single
address presented to the SRAM. The order of the burst sequence is
defined by the
LBO
input pin. The
LBO
pin selects between linear and
interleaved burst sequence. The ADV/LD signal is used to load a new
external address (ADV/LD = LOW) or increment the internal burst counter
(ADV/LD = HIGH).
The IDT71V65612/5812 SRAM utilize IDT's latest high-performance
CMOS process, and are packaged in a JEDEC Standard 14mm x 20mm
100-pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array
(BGA) and 165 fine pitch ball grid array (fBGA).
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Output
Input
I/O
Supply
Supply
Synchronous
Synchronous
Asynchronous
Synchronous
Synchronous
Synchronous
N/A
Synchronous
Static
N/A
N/A
N/A
N/A
Asynchronous
Synchronous
Static
Static
5314 tbl 01
Pin Description Summary
A
0
-A
18
CE
1
, CE
2
,
CE
2
OE
R/W
CEN
BW
1
,
BW
2
,
BW
3
,
BW
4
CLK
ADV/LD
LBO
TMS
TDI
TCK
TDO
ZZ
I/O
0
-I/O
31
, I/O
P1
-I/O
P4
V
DD
, V
DDQ
V
SS
Address Inputs
Chip Enables
Output Enable
Read/Write Signal
Clock Enable
Individual Byte Write Selects
Clock
Advance burst address / Load new address
Linear / Interleaved Burst Order
Test Mode Select
Test Data Input
Test Clock
Test Data Output
Sleep Mode
Data Input / Output
Core Power, I/O Power
Ground
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola, Inc.
NOVEMBER 2000
DSC-5314/01
1
©2000 Integrated Device Technology, Inc.
IDT71V65612, IDT71V65812, 256K x 36, 512K x 18, 3.3V Synchronous SRAMS with
ZBT™ Feature, 2.5V I/O, Burst Counter, and Pipelined Outputs
Preliminary
Commercial Temperature Range
Pin Definitions
(1)
Symbol
A
0
-A
18
ADV/LD
Pin Function
Address Inputs
Advance / Load
I/O
I
I
Active
N/A
N/A
Description
Synchronous Address inputs. The address register is triggered by a combination of the rising edge of
CLK, ADV/LD low,
CEN
lo w, and true chip enables.
ADV/LD is a synchronous input that is used to load the internal registers with new address and control
when it is sampled low at the rising edge of clock with the chip selected. When ADV/LD is low with the
chip deselected, any burst in progress is terminated. When ADV/LD is samp led high then the internal
burst counter is advanced for any burst that was in pro gress. The external addresses are ignored
when ADV/LD is sampled high.
R/W signal is a synchronous input that identifies whether the current load cycle initiated is a Read or
Write access to the memory array. The data bus activity for the current cycle takes place two clock
cycles later.
Synchronous Clock Enable Input. When
CEN
is sampled high, all other synchronous inputs, including
clock are ignored and outputs remain unchanged. The effect of
CEN
sampled high on the device
outputs is as if the low to high clock transition did not occur. For normal operation,
CEN
must be
sampled low at rising edge of clock.
Synchronous byte write enables. Each 9-bit byte has its own active low b yte write enable. On load
write cycles (When R/W and ADV/LD are sampled low) the appropriate byte write signal (BW
1
-BW
4
)
must be valid. The byte write signal must also be valid on each cycle of a burst write. Byte Write
sig nals are ignored when R/W is sampled high. The appropriate byte(s) of data are written into the
device two cycles later.
BW
1
-BW
4
can all be tied low if always doing write to the entire 36-bit word.
Synchronous active low chip enable.
CE
1
and
CE
2
are used with CE
2
to enable the IDT71V65612/5812.
(CE
1
or
CE
2
sampled high or CE
2
sampled low) and ADV/LD low at the rising edge of clock, initiates a
deselect cycle. The ZBT
TM
has a two cycle deselect, i.e., the data bus will tri-state two clock cycles
after deselect is initiated.
R/W
Read / Write
I
N/A
CEN
Clock Enable
I
LOW
BW
1
-BW
4
Individual Byte
Write Enables
I
LOW
CE
1
,
CE
2
Chip Enables
I
LOW
CE
2
CLK
I/O
0
-I/O
31
I/O
P1
-I/O
P4
LBO
Chip Enable
Clock
Data Input/Output
Linear Burst
Order
Output Enable
I
I
I/O
I
HIGH Synchronous active high chip enable. CE
2
is used with
CE
1
and
CE
2
to enable the chip. CE
2
has
inverted polarity but otherwise identical to
CE
1
and
CE
2
.
N/A
N/A
LOW
This is the clock input to the IDT71V65612/5812. Except for
OE,
all timing refe rences for the device are
made with respect to the rising edge of CLK.
Synchronous data input/output (I/O) pins. Both the data input path and data output path are registered
and triggered by the rising edge of CLK.
Burst ord er selection input. When
LBO
is high the Interleaved burst sequence is selected. When
LBO
is low the Linear burst sequence is selected.
LBO
is a static input and it must not change during
device operation.
Asynchronous output enable.
OE
must be low to read data from the 71V65612/5812. When
OE
is high
the I/O pins are in a high-impedance state.
OE
does not need to be active ly controlled for read and
write cycles. In normal operation,
OE
can be tied low.
Gives input command for TAP controller; sampled on rising edge of TCK.
Serial input of registers placed between TDI and TDO. Sampled on rising edge of TCK.
Clock input of TAP controller. Each TAP event is clocked. Test inputs are captured on rising edge of
TCK, while test outputs are driven from the falling edge of TCK.
Serial output of registers placed between TDI and TDO. This output is active d epending on the state of
the TAP controller.
Asynchronous sleep mode inp ut. ZZ HIGH will gate the CLK internally and power down the
IDT71V65612/5812 to its lowest power consumption level. Data retention is guaranteed in Sleep Mode.
3.3V core power supply.
2.5V I/O Supply.
Ground.
5314 tbl 02
OE
I
LOW
TMS
TDI
TCK
TDO
ZZ
V
DD
V
DDQ
V
SS
NOTE:
Test Mode Select
Test Data Input
Test Clock
Test Data Output
Sleep Mode
Power Supply
Power Supply
Ground
I
I
I
O
I
N/A
N/A
N/A
N/A
N/A
N/A
N/A
HIGH
N/A
N/A
N/A
1. All synchronous inputs must meet specified setup and hold times with respect to CLK.
6.42
2
IDT71V65612, IDT71V65812, 256K x 36, 512K x 18, 3.3V Synchronous SRAMS with
ZBT™ Feature, 2.5V I/O, Burst Counter, and Pipelined Outputs
Preliminary
Commercial Temperature Range
Functional Block Diagram
B8E
Address A [0:17]
D
Q
256Kx36 BIT
MEMORY ARRAY
Address
9;
1, CE2,
9;
2
R/
M
Input Register
9;D
ADV/
B:
8M
x
D
Q
Control
DI
DO
D
Clk
Q
Control Logic
Mux
Sel
D
Clk
Clock
Output Register
Q
E;
Gate
5314 drw 01a
,
Data I/O [0:31],
I/O P[1:4]
6.42
3
IDT71V65612, IDT71V65812, 256K x 36, 512K x 18, 3.3V Synchronous SRAMS with
ZBT™ Feature, 2.5V I/O, Burst Counter, and Pipelined Outputs
Preliminary
Commercial Temperature Range
Functional Block Diagram
B8E
Address A [0:18]
D
Q
512x18 BIT
MEMORY ARRAY
Address
9;
1, CE2,
9;
2
R/
M
Input Register
9;D
ADV/
B:
8M
x
D
Q
Control
DI
DO
D
Clk
Q
Control Logic
Mux
Sel
D
Clk
Clock
Output Register
Q
E;
Gate
5314 drw 01
,
Data I/O [0:15],
I/O P[1:2]
Recommended DC Operating
Conditions
Symbol
V
DD
V
DDQ
V
SS
V
IH
V
IH
V
IL
Parameter
Core Supply Voltage
I/O Supply Voltage
Supply Voltage
Input High Voltage - Inputs
Input High Voltage - I/O
Input Low Voltage
Min.
3.135
2.375
0
1.7
1.7
-0.3
(1)
Typ.
3.3
2.5
0
____
____
____
Max.
3.465
2.625
0
V
DD
+0.3
V
DDQ
+0.3
0.7
Unit
V
V
V
V
V
V
5314 tbl 03
NOTES:
1. V
IL
(min.) = –1.0V for pulse width less than t
CYC
/2, once per cycle.
6.42
4
IDT71V65612, IDT71V65812, 256K x 36, 512K x 18, 3.3V Synchronous SRAMS with
ZBT™ Feature, 2.5V I/O, Burst Counter, and Pipelined Outputs
Preliminary
Commercial Temperature Range
Recommended Operating
Temperature and Supply Voltage
Grade
Commercial
Temperature
(1)
0° C to +70° C
V
SS
0V
V
DD
3.3V±5%
V
DDQ
2.5V±5%
5314 tbl 05
NOTES:
1. T
A
is the "instant on" case temperature.
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
I/O
P3
I/O
16
I/O
17
V
DDQ
V
SS
I/O
18
I/O
19
I/O
20
I/O
21
V
SS
V
DDQ
I/O
22
I/O
23
V
DD
(1)
V
DD
V
DD
(1)
V
SS
I/O
24
I/O
25
V
DDQ
V
SS
I/O
26
I/O
27
I/O
28
I/O
29
V
SS
V
DDQ
I/O
30
I/O
31
I/O
P4
CE
2
BW
4
BW
3
BW
2
BW
1
CE
2
V
DD
V
SS
CLK
R/W
CEN
OE
ADV/LD
NC
(2)
A
17
A
8
A
9
Pin Configuration — 256K x 36
A
6
A
7
CE
1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
I/O
P2
I/O
15
I/O
14
V
DDQ
V
SS
I/O
13
I/O
12
I/O
11
I/O
10
V
SS
V
DDQ
I/O
9
I/O
8
V
SS
V
DD
(1)
V
DD
ZZ
I/O
7
I/O
6
V
DDQ
V
SS
I/O
5
I/O
4
I/O
3
I/O
2
V
SS
V
DDQ
I/O
1
I/O
0
I/O
P1
5314 drw 02
NOTES:
1. Pins 14, 16 and 66 do not have to be connected directly to V
DD
as long as the input voltage is
V
IH
.
2. Pin 84 is reserved for a future 16M.
3. DNU = Do not use. Pins 38, 39, 42 and 43 are reserved for respective JTAG pins TMS, TDI, TDO and TCK. Within
the current version these pins can be left unconnected, tied LOW (V
SS
), or tied HIGH (V
DD
).
LBO
A
5
A
4
A
3
A
2
A
1
A
0
DNU
(3)
DNU
(3)
V
SS
V
DD
DNU
(3)
DNU
(3)
A
10
A
11
A
12
A
13
A
14
A
15
A
16
,
Top View
100 TQFP
6.42
5
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