型号
- 型号
- 关键词
ZBT SRAM, 256KX36, 5.33ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
厂商名称：IDT (Integrated Device Technology)
下载文档| 型号 | IDT71V66603S100PF | IDT71V66603S133BG | IDT71V66603S133PF | IDT71V66603S100BG | IDT71V66803S100PF | IDT71V66803S100BG | IDT71V66803S133PF | IDT71V66803S133BG |
|---|---|---|---|---|---|---|---|---|
| 描述 | ZBT SRAM, 256KX36, 5.33ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | ZBT SRAM, 256KX36, 4.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 | ZBT SRAM, 256KX36, 4.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | ZBT SRAM, 256KX36, 5.33ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 | ZBT SRAM, 512KX18, 4.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | ZBT SRAM, 512KX18, 4.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 | ZBT SRAM, 512KX18, 5.33ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | ZBT SRAM, 512KX18, 5.33ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP | BGA | QFP | BGA | QFP | BGA | QFP | BGA |
| 包装说明 | 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | 14 X 22 MM, PLASTIC, BGA-119 | 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | 14 X 22 MM, PLASTIC, BGA-119 | LQFP, | 14 X 22 MM, PLASTIC, BGA-119 | 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | 14 X 22 MM, PLASTIC, BGA-119 |
| 针数 | 100 | 119 | 100 | 119 | 100 | 119 | 100 | 119 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 5.33 ns | 4.5 ns | 4.5 ns | 5.33 ns | 4.5 ns | 4.5 ns | 5.33 ns | 5.33 ns |
| JESD-30 代码 | R-PQFP-G100 | R-PBGA-B119 | R-PQFP-G100 | R-PBGA-B119 | R-PQFP-G100 | R-PBGA-B119 | R-PQFP-G100 | R-PBGA-B119 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 20 mm | 22 mm | 20 mm | 22 mm | 20 mm | 22 mm | 20 mm | 22 mm |
| 内存密度 | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit |
| 内存集成电路类型 | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM |
| 内存宽度 | 36 | 36 | 36 | 36 | 18 | 18 | 18 | 18 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 100 | 119 | 100 | 119 | 100 | 119 | 100 | 119 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 524288 words | 524288 words | 524288 words | 524288 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 512000 | 512000 | 512000 | 512000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX36 | 256KX36 | 256KX36 | 256KX36 | 512KX18 | 512KX18 | 512KX18 | 512KX18 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LQFP | BGA | LQFP | BGA | LQFP | BGA | LQFP | BGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE | GRID ARRAY | FLATPACK, LOW PROFILE | GRID ARRAY | FLATPACK, LOW PROFILE | GRID ARRAY | FLATPACK, LOW PROFILE | GRID ARRAY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 240 | 225 | 240 | 225 | 240 | 225 | 240 | 225 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 3.5 mm | 1.6 mm | 3.5 mm | 1.6 mm | 3.5 mm | 1.6 mm | 3.5 mm |
| 最大供电电压 (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | GULL WING | BALL | GULL WING | BALL | GULL WING | BALL | GULL WING | BALL |
| 端子节距 | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm |
| 端子位置 | QUAD | BOTTOM | QUAD | BOTTOM | QUAD | BOTTOM | QUAD | BOTTOM |
| 处于峰值回流温度下的最长时间 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |